Approaches in Sustainable, Biobased Multilayer Packaging Solutions

The depletion of fossil resources and the growing demand for plastic waste reduction has put industries and academic researchers under pressure to develop increasingly sustainable packaging solutions that are both functional and circularly designed. In this review, we provide an overview of the fundamentals and recent advances in biobased packaging materials, including new materials and techniques for their modification as well as their end-of-life scenarios. We also discuss the composition and modification of biobased films and multilayer structures, with particular attention to readily available drop-in solutions, as well as coating techniques. Moreover, we discuss end-of-life factors, including sorting systems, detection methods, composting options, and recycling and upcycling possibilities. Finally, regulatory aspects are pointed out for each application scenario and end-of-life option. Moreover, we discuss the human factor in terms of consumer perception and acceptance of upcycling

Microstructural evolution of Cu–Sn–Ni compounds in full intermetallic micro-joint and in situ micro-bending test

This is a post-peer-review, pre-copyedit version of an article published in Journal of Materials Science: Materials in Electronics. The final authenticated version is available online at: https://doi.org/10.1007/s10854-018-9293-8This study focuses on the microstructural evolution process of Cu–Sn–Ni intermetallic compounds (IMCs) interlayer in the micro-joints, formed from the initial Ni/Sn (1.5 µm)/Cu structure through transient liquid phase (TLP) soldering. Under the bonding temperature of 240 °C, the micro-joints evolve into Ni/(Cu, Ni)6Sn5/(Cu, Ni)3Sn/Cu structure, where the interfacial reactions on Cu/Sn and Sn/Ni are suppressed by the atoms diffusing from the opposite side. The thickness of (Cu, Ni)3Sn layer on plated Cu layer still increases with the prolonged dwell time. When the bonding temperature was elevated to 290 °C, the phase transformation of (Cu, Ni)6Sn5 into (Cu, Ni)3Sn has been accelerated, thus the majority of IMCs interlayer is constituted with (Cu, Ni)3Sn. However, a small amount of Ni-rich (Cu, Ni)6Sn5 phases still remain near the Ni substrate and some of them close to the center-line of IMCs interlayer. The state between (Cu, Ni)6Sn5 and the adjacent (Cu, Ni)3Sn tends to reach equilibrium in Ni content based on the observation from Transmission Electron Microscope (TEM). In addition, the Cu–Sn–Ni IMCs micro-cantilevers were fabricated from these micro-joints using Focus Ion Beam (FIB) for the in situ micro-bending test, the results indicate a high ultimate tensile strength as well as the brittle fracture in the inter- and transgranular modes