5 research outputs found

    SINPHOS - SINgle PHOton spectrometer for biomedical application

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    In the last decades several experiments have clearly demonstrated that, once illuminated, all biological systems emit for some time a very weak flux of photons, called Delayed Luminescence (DL). Some recent results have shown the possibility of using the DL as a diagnostic tool in the field of optical biopsy or of multi-dimensional diagnostics. Following such indications we decided to start developing SINPHOS, a monolithic micro-device, capable of measuring simultaneously the time distribution and the spectrum of photons coming from a weak source. Two important innovative aspects will characterize this spectrometer: the optical part, realized by means of the Deep Lithography with Particles (DLP), and SPAD (Single Photon Avalanche Diode) detectors under development along with ST-Microelectronics

    Basic aspects of deep lithography with particles for the fabrication of micro-optical and micromechanical structures

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    The strength of today's deep lithographic micro-machining technologies is their ability to fabricate monolithic building-blocks including optical and mechanical functionalities that can be precisely integrated in more complex photonic systems. In this contribution we present the physical aspects of Deep Lithography with ion Particles (DLP). We investigate the impact of the ion mass, energy and fluence on the developed surface profile to find the optimized irradiation conditions for different types of high aspect ratio micro-optical structures. To this aim, we develop a software program that combines the atomic interaction effects with the macroscopic beam specifications. We illustrate the correctness of our simulations with experimental data that we obtained in a collaboration established between the accelerator facilities at TUM, LNS and VUB. Finally, we review our findings and discuss the strengths and weaknesses of DLP with respect to Deep Lithography with X-rays (LIGA)

    Performance simulations of optical multichip-module interconnects: comparing guided-wave and free-space pathways

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    We simulate and compare optical transmission efficiencies, throughputs and interconnection lengths of free-space and POF-based guided-wave optical interconnection systems for different types of microcavity emitters

    Low-cost micro-optics for PCB-level photonic interconnects

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    One of the grand challenges in solving the interconnection bottlenecks at the Printed Circuit Board (PCB) and Multi-Chip-Module (MCM) level, is to adequately replace the PCB and intra-MCM galvanic interconnects with high-performance, low-cost, compact and reliable micro-photonic-alternatives. Therefore we address the following components in this paper: 1) out-of-plane couplers for optical waveguides embedded in PCB, 2) peripheral fiber ribbons and two-dimensional single- and multimode fiber connectors for high-speed parallel optical connections, and 3) intra-MCM level optical interconnections via free-space optical modules. For the fabrication of these micro-optical interconnect modules, we are focusing at the Vrije Universiteit Brussel on the continuous development of a rapid prototyping technology, which we call Deep Proton Writing (DPW). The special feature of this prototyping technology is that it is compatible with commercial low-cost mass replication techniques such as micro injection moulding and hot embossing. Laser ablation is used at Ghent University for the fabrication of PCB-embedded waveguides; and integrated micro-mirrors. The main advantage of this technology is that it is compatible with present-day PCB manufacturing. For the free-space MCM-level optical interconnect module, we furthermore give special attention to the optical tolerancing and the opto-mechanical integration of the components. We use both a sensitivity analysis to misalignment errors and Monte Carlo simulations. It is our aim to investigate the whole component integration chain from the optoelectronic device to the micro-opto-mechanical components constituting the interconnect module
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