Efficient photon capture on germanium surfaces using industrially feasible nanostructure formation

Nanostructured surfaces are known to provide excellent optical properties for various photonics devices. Fabrication of such nanoscale structures to germanium (Ge) surfaces by metal assisted chemical etching (MACE) is, however, challenging as Ge surface is highly reactive resulting often in micron-level rather than nanoscale structures. Here we show that by properly controlling the process, it is possible to confine the chemical reaction only to the vicinity of the metal nanoparticles and obtain nanostructures also in Ge. Furthermore, it is shown that controlling the density of the nanoparticles, concentration of oxidizing and dissolving agents as well as the etching time plays a crucial role in successful nanostructure formation. We also discuss the impact of high mobility of charge carriers on the chemical reactions taking place on Ge surfaces. As a result we propose a simple one-step MACE process that results in nanoscale structures with less than 10% surface reflectance in the wavelength region between 400 nm and 1600 nm. The method consumes only a small amount of Ge and is thus industrially viable and also applicable to thin Ge layers.Comment: 8 pages, 4 figures. Full citation details and link to manuscript published in Nanotechnology were adde

Al-neal Degrades Al2O3 Passivation of Silicon Surface

Atomic layer deposited (ALD) aluminum oxide (Al2O3) has emerged as a useful material for silicon devices due to its capability for effective surface passivation and ability to generate p(+) region underneath the oxide as active or passive component in semiconductor devices. However, it is uncertain how Al2O3 films tolerate the so-called Al-neal treatment that is a necessary process step in devices that also contain silicon dioxide (SiO2) passivation layers. Herein, it is reported that the Al-neal process is harmful for the passivation performance of Al2O3 causing over eightfold increase in surface recombination velocity (SRV) (from 0.9 to 7.3 cm s(-1)). Interestingly, it is also observed that the stage at which the so-called activation of Al2O3 passivation is performed impacts the final degradation strength. The best result is obtained when the activation step is done at the end of the process together with the Al-neal thermal treatment, which results in SRV of 1.7 cm s(-1). The results correlate well with the measured interface defect density, indicating that the Al-neal affects defects at the Si/SiO x /Al2O3 interface. The root causes for the defect reactions are discussed and possible reasons for the observed phenomena are suggested.Peer reviewe

Passivation of Detector-Grade Float Zone Silicon with Atomic Layer Deposited Aluminum Oxide

Silicon radiation and particle detectors are traditionally passivated with thermal silicon dioxide. It has been shown that aluminum oxide (Al2O3) films provide better surface passivation due to their high negative charge, but studies on Al2O3 surface passivation are usually performed on low-resistivity substrates. Herein, the passivation of high-resistivity, detector-grade float zone silicon (FZ-Si) with Al2O3 is studied, with a specific emphasis on the effect of post-annealing temperature on carrier lifetimes and film properties. It is confirmed that Al2O3 provides excellent surface passivation also on high-resistivity FZ-Si substrates, with a low interface defect density of around (2-4) x 10(11) cm(-2) eV(-1) and a high negative oxide charge of 1 x 10(12) to 3 x 10(12) q cm(-2), when post-annealed at temperatures of up to 450-500 degrees C. In addition, high-resistivity samples are studied for the phenomenon of bulk lifetime degradation occurring at typical post-annealing or metal sintering temperatures, which has been reported for low-resistivity FZ-Si. At post-annealing temperatures of >500 degrees C, reduced bulk lifetimes are observed if the substrates did not receive high-temperature treatment prior to surface passivation. Furthermore, it is noticed that n-type samples exhibit lower bulk lifetimes even when a high-temperature treatment is performed, which indicates a connection between FZ-Si bulk lifetime degradation and doping type.Peer reviewe

Impact of doping and silicon substrate resistivity on the blistering of atomic-layer-deposited aluminium oxide

Aluminium oxide (Al2O3) thin films grown at low temperatures using atomic layer deposition (ALD) are known to often suffer from local delamination sites, referred to as "blisters", after post-deposition annealing during device processing. In this work, we report our observation that doping of the silicon substrate has an effect on blister formation. The introduction of a highly doped layer by diffusion or implantation is found to significantly reduce blistering, compared to the non-doped regions in the immediate vicinity. Similar behavior is observed for both phosphorus and boron doping. Further investigation of this phenomenon using substrates with different resistivities reveals that even when introduced already during silicon crystal growth, doping affects the blistering of aluminium oxide films. Changes in several properties of silicon affected by doping, most importantly surface terminating groups, native oxide growth, and passivation of defects with hydrogen, are discussed as potential reasons behind the observed effect on blistering.Peer reviewe

Black ultra-thin crystalline silicon wafers reach the 4n2 absorption limit–application to IBC solar cells

Cutting costs by progressively decreasing substrate thickness is a common theme in the crystalline silicon photovoltaic industry for the last decades, since drastically thinner wafers would significantly reduce the substrate-related costs. In addition to the technological challenges concerning wafering and handling of razor-thin flexible wafers, a major bottleneck is to maintain high absorption in those thin wafers. For the latter, advanced light-trapping techniques become of paramount importance. Here we demonstrate that by applying state-of-the-art black-Si nanotexture produced by DRIE on thin uncommitted wafers, the maximum theoretical absorption (Yablonovitch's 4n2 absorption limit), that is, ideal light trapping, is reached with wafer thicknesses as low as 40, 20, and 10 µm when paired with a back reflector. Due to the achieved promising optical properties the results are implemented into an actual thin interdigitated back contacted solar cell. The proof-of-concept cell, encapsulated in glass, achieved a 16.4% efficiency with an JSC = 35 mA cm-2, representing a 43% improvement in output power with respect to the reference polished cell. These results demonstrate the vast potential of black silicon nanotexture in future extremely-thin silicon photovoltaics.Peer ReviewedPostprint (published version

Efficient photon capture on germanium surfaces using industrially feasible nanostructure formation

| openaire: EC/H2020/777222/EU//ATTRACTNanostructured surfaces are known to provide excellent optical properties for various photonics devices. Fabrication of such nanoscale structures to germanium (Ge) surfaces by metal assisted chemical etching (MACE) is, however, challenging as Ge surface is highly reactive resulting often in micron-level rather than nanoscale structures. Here we show that by properly controlling the process, it is possible to confine the chemical reaction only to the vicinity of the metal nanoparticles and obtain nanostructures also in Ge. Furthermore, it is shown that controlling the density of the nanoparticles, concentration of oxidizing and dissolving agents as well as the etching time plays a crucial role in successful nanostructure formation. We also discuss the impact of high mobility of charge carriers on the chemical reactions taking place on Ge surfaces. As a result we propose a simple one-step MACE process that results in nanoscale structures with less than 10% surface reflectance in the wavelength region between 400 and 1600 nm. The method consumes only a small amount of Ge and is thus industrially viable and also applicable to thin Ge layers.Peer reviewe

Black silicon significantly enhances phosphorus diffusion gettering

Black silicon (b-Si) is currently being adopted by several fields of technology, and its potential has already been demonstrated in various applications. We show here that the increased surface area of b-Si, which has generally been considered as a drawback e.g. in applications that require efficient surface passivation, can be used as an advantage: it enhances gettering of deleterious metal impurities. We demonstrate experimentally that interstitial iron concentration in intentionally contaminated silicon wafers reduces from 1.7 × 1e13 cm−3 to less than 1e10 cm−3 via b-Si gettering coupled with phosphorus diffusion from a POCl3 source. Simultaneously, the minority carrier lifetime increases from less than 2 μs of a contaminated wafer to more than 1.5 ms. A series of different low temperature anneals suggests segregation into the phosphorus-doped layer to be the main gettering mechanism, a notion which paves the way of adopting these results into predictive process simulators. This conclusion is supported by simulations which show that the b-Si needles are entirely heavily-doped with phosphorus after a typical POCl3 diffusion process, promoting iron segregation. Potential benefits of enhanced gettering by b-Si include the possibility to use lower quality silicon in high-efficiency photovoltaic devices.Peer reviewe

Low-T anneal as cure for LeTID in Mc-Si PERC cells

Light and elevated temperature induced degradation (LeTID) is known to be affected by the last dark anneal that the silicon wafers or cells experience prior to illumination. Here we study how low-temperature dark anneal performed on fully processed multicrystalline silicon (mc-Si) passivated emitter and rear solar cells (PERC) influences LeTID characteristics, both the intensity of the degradation and the degradation kinetics. Our results show that a relatively long anneal at 300 °C provides an efficient means to minimize LeTI D while too short dark anneal at the same temperature seems to have a negative impact on the subsequent degradation under light soaking. Finally, we compare the experimental results with the model originally developed for metal precipitation and discuss the possibility of metals being involved in LeTID mechanism.Peer reviewe

(poster) Low-T anneal as cure for LeTID in Mc-Si PERC cells

| openaire: EC/FP7/307315/EU//SOLARXPeer reviewe

Economic advantages of dry-etched black silicon in passivated emitter rear cell (PERC) photovoltaic manufacturing

Industrial Czochralski silicon (Cz-Si) photovoltaic (PV) efficiencies have routinely reached \u3e20% with the passivated emitter rear cell (PERC) design. Nanostructuring silicon (black-Si) by dry-etching decreases surface reflectance, allows diamond saw wafering, enhances metal gettering, and may prevent power conversion efficiency degradation under light exposure. Black-Si allows a potential for \u3e20% PERC cells using cheaper multicrystalline silicon (mc-Si) materials, although dry-etching is widely considered too expensive for industrial application. This study analyzes this economic potential by comparing costs of standard texturized Cz-Si and black mc-Si PERC cells. Manufacturing sequences are divided into steps, and costs per unit power are individually calculated for all different steps. Baseline costs for each step are calculated and a sensitivity analysis run for a theoretical 1 GW/year manufacturing plant, combining data from literature and industry. The results show an increase in the overall cell processing costs between 15.8% and 25.1% due to the combination of black-Si etching and passivation by double-sided atomic layer deposition. Despite this increase, the cost per unit power of the overall PERC cell drops by 10.8%. This is a significant cost saving and thus energy policies are reviewed to overcome challenges to accelerating deployment of black mc-Si PERC across the PV industry