Thermal Characterization of Polycrystalline CVD Diamond Thin Films

An experimental thermal characterization method is developed for high thermal conductivity thin films. The method utilizes Ta/Pt resistors on microfabricated free-standing thin film structures both for heating and temperature monitoring at different positions on the structures. The steady-state temperature at the heater and the sensor positions are monitored as a function of the power dissipated by the heater under vacuum environment, and the thermal conductivity is estimated by comparing these results to FEA and/or analytical models. The developed method is used to characterize the thermal conductivity of various different CVD diamond films of different grain sizes and films thicknesses. The measured thermal conductivity values range from 15 W/m·K to 300 W/m·K, which are at least one order of magnitude lower than that of natural diamond. It is also shown that the thermal conductivity of such films in the in-plane direction increases with increasing grain size and film

SCALABLE CASCADED SNAP-IN ACTUATORS FOR LARGE-STROKE DISPLACEMENTS

This paper will focus on the design, and first measurements of a cascaded in-plane parallel plate snap-in actuator. The actuator is based on a rather simple microfabrication process and can achieve a total displacement of several tenths of microns. Compared to classical noncascaded transducer device based on parallel plates or comb-drive actuator, the actuation voltage is relatively low due to the snap-in phenomenon of electrostatic actuators. The electromechanical response of such a device is sequential. The fabricated 4-stage device shows a total stroke of 75 μm at 60 V. It is possible to easily increase the total stroke of the actuator by increasing the number of stages. Only one input electrode is required. Simulations with CoventorWare showed easy scalability of the concept for up to 19 stages with a total displacement of 350 μm

A microchip optomechanical accelerometer

The monitoring of accelerations is essential for a variety of applications ranging from inertial navigation to consumer electronics. The basic operation principle of an accelerometer is to measure the displacement of a flexibly mounted test mass; sensitive displacement measurement can be realized using capacitive, piezo-electric, tunnel-current, or optical methods. While optical readout provides superior displacement resolution and resilience to electromagnetic interference, current optical accelerometers either do not allow for chip-scale integration or require bulky test masses. Here we demonstrate an optomechanical accelerometer that employs ultra-sensitive all-optical displacement read-out using a planar photonic crystal cavity monolithically integrated with a nano-tethered test mass of high mechanical Q-factor. This device architecture allows for full on-chip integration and achieves a broadband acceleration resolution of 10 \mu g/rt-Hz, a bandwidth greater than 20 kHz, and a dynamic range of 50 dB with sub-milliwatt optical power requirements. Moreover, the nano-gram test masses used here allow for optomechanical back-action in the form of cooling or the optical spring effect, setting the stage for a new class of motional sensors.Comment: 16 pages, 9 figure

Centrality dependence of charged hadron transverse momentum spectra in d+Au collisions at sqrt(s_NN) = 200 GeV

We have measured transverse momentum distributions of charged hadrons produced in d+Au collisions at sqrt(s_NN) = 200 GeV. The spectra were obtained for transverse momenta 0.25 < p_T < 6.0 GeV/c, in a pseudorapidity range of 0.2 < eta < 1.4 in the deuteron direction. The evolution of the spectra with collision centrality is presented in comparison to p+pbarcollisions at the same collision energy. With increasing centrality, the yield at high transverse momenta increases more rapidly than the overall particle density, leading to a strong modification of the spectral shape. This change in spectral shape is qualitatively different from observations in Au+Au collisions at the same energy. The results provide important information for discriminating between different models for the suppression of high-p_T hadrons observed in Au+Au collisions.Comment: 5 pages, 4 figures, submitted to PR

Fabrication and characterization of linear diffusers based on concave micro lens arrays

Abstract: We present a new approach of beam homogenizing elements based on a statistical array of concave cylindrical microlens arrays. Those elements are used to diffuse light in only one direction and can be employed together with fly’s eye condensers to generate a uniform flat top line for high power coherent light sources. Conception, fabrication and characterization for such 1D diffusers are presented in this paper

Applications of SOI-based optical MEMS

After microelectromechanical systems (MEMS) devices have been well established, components of higher complexity are now developed. Particularly, the combination with optical components has been very successful and have led to optical MEMS. The technology of choice for us is the silicon-on-insulator (SOI) technology, which has also been successfully used by other groups. The applications presented here give an overview over what is possible with this technology. In particular, we demonstrate four completely different devices: a) a 2 × 2 optical cross connector (OXC) with an insertion loss of about 0.4 dB at a switching time of 500 μs and its extension to a 4 × 4 OXC, b) a variable optical attenuators (VOA), which has an attenuation range of more than 50 dB, c) a Fourier transform spectrometer (FTS) with a spectral resolution of 6 nm in the visible, and d) an accelerometer with optical readout that achieves a linear dynamic range of 40 dB over ±6 g. Except for the FTS, all the applications utilized optical fibers, which are held and self-aligned within the MEMS component by U-grooves and small leaf springs. All devices show high reliability and a very low power consumption