A mechanically-guided approach to three-dimensional functional mesostructures towards unconventional applications

Controlled formation of three-dimensional functional mesostructures (3DFMs) has broad engineering implications in biomedical devices, microelectromechanical systems (MEMS), optics, and energy storage. Most existing 3D techniques, however, not only lack compatibility with essential electronic materials (silicon, metals, ceramics) that exist in solid-state or crystalline forms, but also produce in a slow and inefficient manner. This is in stark contrast to the planar technologies widely adopted by the modern semiconductor industry. I propose to solve these challenges by a novel 3D assembly strategy based on the planar technologies, which involves precisely controlled 2D-to-3D transformations via the substrate-induced mechanical buckling. This lithography-based, mechanically-guided 3D approach is compatible with virtually any engineering thin films including semiconductors, metals, and polymers, applies to a wide range of length scales and geometries and produces in a high throughput. In this dissertation, I present strategies that combine fabrications and mechanics to achieve a set of complex 3D geometries. I also study the potentials of the 3DFMs in micro-robotics. I further demonstrate the unique applications in energy harvesting, bio-integrated systems, and nanoscale sensing. The results may enlighten the development of advanced, multi-functional 3D electronic micro-systems inaccessible to other 3D techniques

Compliant and stretchable thermoelectric coils for energy harvesting in miniature flexible devices

With accelerating trends in miniaturization of semiconductor devices, techniques for energy harvesting become increasingly important, especially in wearable technologies and sensors for the internet of things. Although thermoelectric systems have many attractive attributes in this context, maintaining large temperature differences across the device terminals and achieving low–thermal impedance interfaces to the surrounding environment become increasingly difficult to achieve as the characteristic dimensions decrease. Here, we propose and demonstrate an architectural solution to this problem, where thin-film active materials integrate into compliant, open three-dimensional (3D) forms. This approach not only enables efficient thermal impedance matching but also multiplies the heat flow through the harvester, thereby increasing the efficiencies for power conversion. Interconnected arrays of 3D thermoelectric coils built using microscale ribbons of monocrystalline silicon as the active material demonstrate these concepts. Quantitative measurements and simulations establish the basic operating principles and the key design features. The results suggest a scalable strategy for deploying hard thermoelectric thin-film materials in harvesters that can integrate effectively with soft materials systems, including those of the human body

Scalable Electrophysiology of Millimeter-Scale Animals with Electrode Devices

Millimeter-scale animals such as Caenorhabditis elegans, Drosophila larvae, zebrafish, and bees serve as powerful model organisms in the fields of neurobiology and neuroethology. Various methods exist for recording large-scale electrophysiological signals from these animals. Existing approaches often lack, however, real-time, uninterrupted investigations due to their rigid constructs, geometric constraints, and mechanical mismatch in integration with soft organisms. The recent research establishes the foundations for 3-dimensional flexible bioelectronic interfaces that incorporate microfabricated components and nanoelectronic function with adjustable mechanical properties and multidimensional variability, offering unique capabilities for chronic, stable interrogation and stimulation of millimeter-scale animals and miniature tissue constructs. This review summarizes the most advanced technologies for electrophysiological studies, based on methods of 3-dimensional flexible bioelectronics. A concluding section addresses the challenges of these devices in achieving freestanding, robust, and multifunctional biointerfaces

Guided Formation of 3D Helical Mesostructures by Mechanical Buckling: Analytical Modeling and Experimental Validation

Three-dimensional (3D) helical mesostructures are attractive for applications in a broad range of microsystem technologies, due to their mechanical and electromagnetic properties as stretchable interconnects, radio frequency antennas and others. Controlled compressive buckling of 2D serpentine-shaped ribbons provides a strategy to formation of such structures in wide ranging classes of materials (from soft polymers to brittle inorganic semiconductors) and length scales (from nanometer to centimeter), with an ability for automated, parallel assembly over large areas. The underlying relations between the helical configurations and fabrication parameters require a relevant theory as the basis of design for practical applications. Here, we present an analytic model of compressive buckling in serpentine microstructures, based on the minimization of total strain energy that results from various forms of spatially dependent deformations. Experiments at micro- and millimeter-scales, together with finite element analyses (FEA), were exploited to examine the validity of developed model. The theoretical analyses shed light on general scaling laws in terms of three groups of fabrication parameters (related to loading, material and 2D geometry), including a negligible effect of material parameters and a square root dependence of primary displacements on the compressive strain. Furthermore, analytic solutions were obtained for the key physical quantities (e.g., displacement, curvature and maximum strain). A demonstrative example illustrates how to leverage the analytic solutions in choosing the various design parameters, such that brittle fracture or plastic yield can be avoided in the assembly process

Guided Formation of 3D Helical Mesostructures by Mechanical Buckling: Analytical Modeling and Experimental Validation

3D helical mesostructures are attractive for applications in a broad range of microsystem technologies due to their mechanical and electromagnetic properties as stretchable interconnects, radio frequency antennas, and others. Controlled compressive buckling of 2D serpentine-shaped ribbons provides a strategy to formation of such structures in wide ranging classes of materials (from soft polymers to brittle inorganic semiconductors) and length scales (from nanometer to centimeter), with an ability for automated, parallel assembly over large areas. The underlying relations between the helical configurations and fabrication parameters require a relevant theory as the basis of design for practical applications. Here, an analytic model of compressive buckling in serpentine microstructures is presented based on the minimization of total strain energy that results from various forms of spatially dependent deformations. Experiments at micro-and millimeter scales, together with finite element analyses, have been exploited to examine the validity of developed model. The theoretical analyses shed light on general scaling laws in terms of three groups of fabrication parameters (related to loading, material, and 2D geometry), including a negligible effect of material parameters and a square root dependence of primary displacements on the compressive strain. Furthermore, analytic solutions were obtained for the key physical quantities (e.g., displacement, curvature and maximum strain). A demonstrative example illustrates how to leverage the analytic solutions in choosing the various design parameters, such that brittle fracture or plastic yield can be avoided in the assembly process.Thousand Young Talents Program of China; National Science Foundation of China [11502129]; U.S. Department of Energy, Office of Science, Basic Energy Sciences [DE-FG02-07ER46471]; NSF [CMMI-1400169]; NIH [R01EB019337]; National Basic Research Program of China [2015CB351900]SCI(E)[email protected]; [email protected]

Two-dimensional materials in functional three-dimensional architectures with applications in photodetection and imaging.

Efficient and highly functional three-dimensional systems that are ubiquitous in biology suggest that similar design architectures could be useful in electronic and optoelectronic technologies, extending their levels of functionality beyond those achievable with traditional, planar two-dimensional platforms. Complex three-dimensional structures inspired by origami, kirigami have promise as routes for two-dimensional to three-dimensional transformation, but current examples lack the necessary combination of functional materials, mechanics designs, system-level architectures, and integration capabilities for practical devices with unique operational features. Here, we show that two-dimensional semiconductor/semi-metal materials can play critical roles in this context, through demonstrations of complex, mechanically assembled three-dimensional systems for light-imaging capabilities that can encompass measurements of the direction, intensity and angular divergence properties of incident light. Specifically, the mechanics of graphene and MoS2, together with strategically configured supporting polymer films, can yield arrays of photodetectors in distinct, engineered three-dimensional geometries, including octagonal prisms, octagonal prismoids, and hemispherical domes

Two-dimensional materials in functional three-dimensional architectures with applications in photodetection and imaging

The strain tolerance and promising optoelectronic properties of 2D materials can be leveraged to design functional optical sensing devices. Here, the authors provide a demonstration of arrays of independently addressable photodetectors constructed from graphene and MoS2 engineered in 3D Kirigami geometries

Mechanically‐Guided Deterministic Assembly of 3D Mesostructures Assisted by Residual Stresses

Formation of 3D mesostructures in advanced functional materials is of growing interest due to the widespread envisioned applications of devices that exploit 3D architectures. Mechanically guided assembly based on compressive buckling of 2D precursors represents a promising method, with applicability to a diverse set of geometries and materials, including inorganic semiconductors, metals, polymers, and their heterogeneous combinations. This paper introduces ideas that extend the levels of control and the range of 3D layouts that are achievable in this manner. Here, thin, patterned layers with well-defined residual stresses influence the process of 2D to 3D geometric transformation. Systematic studies through combined analytical modeling, numerical simulations, and experimental observations demonstrate the effectiveness of the proposed strategy through ≈20 example cases with a broad range of complex 3D topologies. The results elucidate the ability of these stressed layers to alter the energy landscape associated with the transformation process and, specifically, the energy barriers that separate different stable modes in the final 3D configurations. A demonstration in a mechanically tunable microbalance illustrates the utility of these ideas in a simple structure designed for mass measurement