21 research outputs found

    Microstructure evolution during high-pressure spark plasma sintering (HPSPS) of transparent alumina

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    Applying high-pressure during spark plasma sintering (so-called HPSPS) enables rapid densification of a ceramic powder at relatively lower temperatures, limiting grain growth and allowing fabrication of fine-grained highly transparent ceramics. The present work focuses on the fabrication of fine submicron transparent alumina from untreated commercial powder by HPSPS and the microstructure evolution during consolidation under high applied pressure. The sintering was conducted at relatively low temperatures (1000-1100°C) under high pressure varied from 250 to 800 MPa. We review unique sintering phenomena such as stress-enhanced grain growth and de-sintering, which are related to creep taking place during the final stage of pressure-assisted densification. In addition, optical and mechanical properties of obtained samples are discussed. Please click Additional Files below to see the full abstract

    Photoluminescence in SPS-processed transparent Ce:YAG ceramics

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    Ceramic phosphors display great promise for the realization of high-power lighting devices. Cerium-doped yttrium aluminum garnet (Ce:YAG) is commonly used as a phosphor in white light emitting diodes. Therefore, it was chosen as a case study to investigate photoluminescence of transparent ceramic phosphors fabricated by spark plasma sintering (SPS). In the present work, 0.5 at.% Ce:YAG nano-powder was synthesized by a co-precipitation method and subsequently consolidated by SPS into highly transparent ceramic samples. The effect of varying sintering parameters (temperature and pressure) and post-sintering treatments (hot isostatic pressing and air atmosphere thermal treatment) on optical properties was investigated. Correlations between in-line transmittance, photoluminescence (PL) and residual porosity characteristics (pore size and volume fraction) were established. It was also found that PL emission intensity and external quantum efficiency were significantly affected by intentionally created surface roughness. Please click Additional Files below to see the full abstract

    Effect of Mn doping on densification and properties of transparent alumina by high- pressure SPS (HPSPS)

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    Spark Plasma Sintering Apparatus Used for High-temperature Compressive Creep Tests

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    Creep is a time dependent, temperature-sensitive mechanical response of a material in the form of continuous deformation under constant load or stress. To study the creep properties of a given material, the load/stress and temperature must be controlled while measuring strain over time. The present study describes how a spark plasma sintering (SPS) apparatus can be used as a precise tool for measuring compressive creep of materials. Several examples for using the SPS apparatus for high-temperature compressive creep studies of metals and ceramics under a constant load are discussed. Experimental results are in a good agreement with data reported in literature, which verifies that the SPS apparatus can serve as a tool for measuring compressive creep strain of materials

    Creep of Polycrystalline Magnesium Aluminate Spinel Studied by an SPS Apparatus

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    A spark plasma sintering (SPS) apparatus was used for the first time as an analytical testing tool for studying creep in ceramics at elevated temperatures. Compression creep experiments on a fine-grained (250 nm) polycrystalline magnesium aluminate spinel were successfully performed in the 1100–1200 °C temperature range, under an applied stress of 120–200 MPa. It was found that the stress exponent and activation energy depended on temperature and applied stress, respectively. The deformed samples were characterized by high resolution scanning electron microscope (HRSEM) and high resolution transmission electron microscope (HRTEM). The results indicate that the creep mechanism was related to grain boundary sliding, accommodated by dislocation slip and climb. The experimental results, extrapolated to higher temperatures and lower stresses, were in good agreement with data reported in the literature

    Bonding of TRIP-Steel/Al2O3-(3Y)-TZP Composites and (3Y)-TZP Ceramic by a Spark Plasma Sintering (SPS) Apparatus

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    A combination of the high damage tolerance of TRIP-steel and the extremely low thermal conductivity of partially stabilized zirconia (PSZ) can provide controlled thermal-mechanical properties to sandwich-shaped composite specimens comprising these materials. Sintering the (TRIP-steel-PSZ)/PSZ sandwich in a single step is very difficult due to differences in the sintering temperature and densification kinetics of the composite and the ceramic powders. In the present study, we successfully applied a two-step approach involving separate SPS consolidation of pure (3Y)-TZP and composites containing 20 vol % TRIP-steel, 40 vol % Al2O3 and 40 vol % (3Y)-TZP ceramic phase, and subsequent diffusion joining of both sintered components in an SPS apparatus. The microstructure and properties of the sintered and bonded specimens were characterized. No defects at the interface between the TZP and the composite after joining in the 1050–1150 °C temperature range were observed. Only limited grain growth occurred during joining, while crystallite size, hardness, shear strength and the fraction of the monoclinic phase in the TZP ceramic virtually did not change. The slight increase of the TZP layer’s fracture toughness with the joining temperature was attributed to the effect of grain size on transformation toughening

    On the Role of TiC in the Carbon Steel-Titanium Joining

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    Reaction‐bonded B 4 C/SiC composites synthesized by microwave heating

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    International audienceThe reaction-bonding technique was used to synthesize boron carbide (B4C) - silicon carbide (SiC) composites by microwave heating. Preforms of porous B4C were obtained by compaction followed or not by partial densification. Then, the material was infiltrated by molten silicon under a microwave heating. The influence of the thermal cycles (T: 1400-1500°C, t: 5-120 minutes) is low. The hardness of boron carbide is comparable to that of alumina (15-19 GPa) for a much lower density (≈2.5 g/cm3 for B4C-based material instead of 3.95 g/cm3 for alumina). These properties make this composite, obtained by microwave heating, a good candidate for ballistic applications
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