Determination of radiation hardness of silicon diodes

In this paper, we describe an experiment aimed to measure the physical observables, which can be used for the assessment of the radiation hardness of commercially available silicon photo diodes commonly used as nuclear detectors in particle accelerator laboratories. The experiment adopted the methodology developed during the International Atomic Energy Agency (IAEA) Coordinated Research Project (CRP No. F11016) “Utilization of Ion Accelerators for Studying and Modelling Ion Induced Radiation Defects in Semiconductors and Insulators”. This methodology is based on the selective irradiation of micrometer-sized regions with different fluences of MeV ions using an ion microbeam and on the measurement of the charge collection efficiency (CCE) degradation by Ion Beam Induced Charge (IBIC) microscopy performed in full depletion condition, using different probing ions. The IBIC results are analyzed through a theoretical approach based on the Shockley-Read-Hall model for the free carrier recombination in the presence of ion-induced deep traps. This interpretative model allows the evaluation of the material radiation hardness in terms of recombination parameters for both electrons and holes. The device under study in this experiment was a commercial p-i-n photodiode, which was initially characterized by i) standard electronic characterization techniques to determine its doping and ii) the Angle-Resolved IBIC to evaluate its effective entrance window. Nine regions of (100 × 100) µm2 were irradiated with 11.25 MeV He ions up to a maximum fluence of 3·1012 ions/cm2. The CCE degradation was measured by the IBIC technique using 11.25 MeV He and 1.4 MeV He as probing ions. The model presented here proved to be effective for fitting the experimental data. The fitting parameters correspond to the recombination coefficients, which are the key parameters for the characterization of the effects of radiation damage in semiconductors.</p

Focused ion beam fabrication and IBIC characterisation of a diamond detector with buried electrodes

This paper reports on the fabrication and characterization of a high purity monocrystalline diamond detector with buried electrodes realized by the selective damage induced by a focused 6 MeV carbon ion beam scanned over a pattern defined at the micrometric scale. A suitable variable-thickness mask was deposited on the diamond surface in order to modulate the penetration depth of the ions and to shallow the damage profile toward the surface. After the irradiation, the sample was annealed at high temperature in order to promote the conversion to the graphitic phase of the end-of range regions which experienced an ion-induced damage exceeding the damage threshold, while recovering the sub-threshold damaged regions to the highly resistive diamond phase. This process provided conductive graphitic electrodes embedded in the insulating diamond matrix; the presence of the variable-thickness mask made the terminations of the channels emerging at the diamond surface and available to be connected to an external electronic circuit. In order to evaluate the quality of this novel microfabrication procedure based on direct ion writing, we performed frontal Ion Beam Induced Charge (IBIC) measurements by raster scanning focused MeV ion beams onto the diamond surface. Charge collection efficiency (CCE) maps were measured at different bias voltages. The interpretation of such maps was based on the Shockley-Ramo-Gunn formalism. (C) 2011 Elsevier B.V. All rights reserved

Light and heavy ion beam analysis of thin biological sections

The application of ion beam analysis (IBA) techniques to thin biological sections (ThBS) presents unique challenges in sample preparation, data acquisition and analysis. These samples are often the end product of expensive, time-consuming experiments, which involve many steps that require careful attention. Analysis via several techniques can maximise the information that is collected from these samples. Particle-induced X-ray emission (PIXE) and Rutherford backscattering (RBS) spectroscopy are two generally non-destructive IBA techniques that use the same MeV ions and can be performed simultaneously. The use of heavy ion PIXE applied to thick samples has, in the past, resulted in X-ray spectra of a poorer quality when compared to those obtained with proton beams. One of the reasons for this is the shorter probing depth of the heavy ions, which does not affect thin sample analysis. Therefore, we have investigated and compared 3-MeV proton and 36-MeV carbon ion beams on 7-µm thick mouse brain sections at the ANSTO Heavy ion microprobe (HIMP). The application of a 36-MeV C4+ ion beam for PIXE mapping of ThBS on thin Si3N4 substrate windows produced spectra of high quality that displayed close to a nine-times gain in signal yield (Z2/q) when compared to those obtained for 3-MeV protons for P, S, Cl and K but not for Fe, Cu and Zn. Image quality was overall similar; however, some elements showed better contrast and features with protons whilst others showed improved contrast with a carbon ion beam. RBS spectra with high enough counting statistics were easily obtained with 3-MeV proton beams resulting in high resolution carbon maps, however, the count rate for nitrogen and oxygen was too low. The results demonstrate that on thin samples, 36-MeV C4+ will produce good quality PIXE spectra in less time; therefore, carbon ions may be advantageous depending on which element is being studied. However, these advantages may be outweighed by the inherent disadvantages including increased ion beam damage, the necessity of very high ion energies resulting in higher neutron fields. © 2013 Published by Elsevier B.V. All rights reserved

Formation of buried conductive micro-channels in single crystal diamond with MeV C and He implantation

As demonstrated in previous works, implantation with a MeV ion microbeam through masks with graded thickness allows the formation of conductive micro-channels in diamond which are embedded in the insulating matrix at controllable depths [P. Olivero et al., Diamond Relat. Mater. 18 (5–8), 870–876 (2009)]. In the present work we report about the systematic electrical characterization of such micro-channels as a function of several implantation conditions, namely: ion species and energy, implantation fluence. The current–voltage (IV) characteristics of the buried channels were measured at room temperature with a two point probe station. Significant parameters such as the sheet resistance and the characteristic exponent (α) of the IV power-law trend were expressed as a function of damage density, with satisfactory compatibility between the results obtained in different implantation conditions

Direct fabrication of three-dimensional buried conductive channels in single crystal diamond with ion microbeam induced graphitization

We report on a novel method for the fabrication of three-dimensional buried graphitic micropaths in single crystal diamond with the employment of focused MeV ions. The use of implantation masks with graded thickness at the sub-micrometer scale allows the formation of conductive channels which are embedded in the insulating matrix at controllable depths. In particular, the modulation of the channels depth at their endpoints allows the surface contacting of the channel terminations with no need of further fabrication stages. In the present work we describe the sample masking, which includes the deposition of semi-spherical gold contacts on the sample surface, followed by MeV ion implantation. Because of the significant difference between the densities of pristine and amorphous or graphitized diamond, the formation of buried channels has a relevant mechanical effect on the diamond structure, causing localized surface swelling, which has been measured both with interferometric profilometry and atomic force microscopy. The electrical properties of the buried channels are then measured with a two point probe station: clear evidence is given that only the terminal points of the channels are electrically connected with the surface, while the rest of the channels extends below the surface. IV measurements are employed also to qualitatively investigate the electrical properties of the channels as a function of implantation fluence and annealing

Education and socioeconomic mobility in post-communist countries

Patterns of intergenerational educational mobility are studied in twelve post-communist countries of Central Europe and the former Soviet Union (FSU). No clear trend in educational inheritance emerges over the recent 50 years, covering both the period of socialism and transition to a market economy. If any, we find the decrease in intergenerational persistence up until the generation of the 1950s. In subsequent years no furhter decline is observed. On the contrary, in a number of states the correlation between parents' and children's schooling got stronger, further increasing over the period of transition