Printed Electronics (PE) as an enabling technology to realize flexible mass customized smart applications

Printed Electronics (PE) involves additive deposition of functional materials on a substrate via printing processes to realize electronic circuits, interconnects, electrical components or devices. This methodology is opposite to the conventional microelectronics industry which is based on subtractive manufacturing techniques (e.g. etching). Some of the advantages of PE over conventional electronics are low prototyping costs, short time to market, less processing steps, etc. One of the features is the ability to manufacture flexible and customized products and devices. The applications of Printed Electronics apply to different sectors of industry like electronics, packaging, bio-medical, automotive, communication, etc. In this work, we present Aerosol Jet® Printing (AJ®P) and Screen Printing as two techniques for the realization of flexible and mass customized PE devices. Whereas the use of AJ®P is focused on rapid prototyping, Screen Printing allows to upscale for mass production. The two technologies are here implemented to realise conductive antennas on paper substrates, potentially to integrate into a delivery parcel box for the development of “smart packaging”. This antenna design is based on the 13.56 MHz working frequency, which lies in the frequency spectrum of HF RFID/NFC applications. The print quality, electrical resistance and the basic functional characterization (working frequency) of these paper-based antennas are here investigated and reported. Keywords: Printed Electronics; Screen Printing; Aerosol Jet® Printing; Customized printed antennastatus: accepte

Screen Printed Antennas on Fiber-Based Substrates for Sustainable HF RFID Assisted E-Fulfilment Smart Packaging

Intelligent packaging is an emerging technology, aiming to improve the standard communication function of packaging. Radio frequency identification (RFID) assisted smart packaging is of high interest, but the uptake is limited as the market needs cost-efficient and sustainable applications. The integration of screen printed antennas and RFID chips as smart labels in reusable cardboard packaging could offer a solution. Although paper is an interesting and recyclable material, printing on this substrate is challenging as the ink conductivity is highly influenced by the paper properties. In this study, the best paper/functional silver ink combinations were first selected out of 76 paper substrates based on the paper surface roughness, air permeance, sheet resistance and SEM characterization. Next, a flexible high frequency RFID chip (13.56 MHz) was connected on top of screen printed antennas with a conductive adhesive. Functional RFID labels were integrated in cardboard packaging and its potential application as reusable smart box for third party logistics was tested. In parallel, a web-based software application mimicking its functional abilities in the logistic cycle was developed. This multidisciplinary approach to developing an easy-scalable screen printed antenna and RFID-assisted smart packaging application is a good example for future implementation of hybrid electronics in sustainable smart packaging