Radio-frequency capacitance spectroscopy of metallic nanoparticles.

Recent years have seen great progress in our understanding of the electronic properties of nanomaterials in which at least one dimension measures less than 100 nm. However, contacting true nanometer scale materials such as individual molecules or nanoparticles remains a challenge as even state-of-the-art nanofabrication techniques such as electron-beam lithography have a resolution of a few nm at best. Here we present a fabrication and measurement technique that allows high sensitivity and high bandwidth readout of discrete quantum states of metallic nanoparticles which does not require nm resolution or precision. This is achieved by coupling the nanoparticles to resonant electrical circuits and measurement of the phase of a reflected radio-frequency signal. This requires only a single tunnel contact to the nanoparticles thus simplifying device fabrication and improving yield and reliability. The technique is demonstrated by measurements on 2.7 nm thiol coated gold nanoparticles which are shown to be in excellent quantitative agreement with theory.The work in the UK has been supported by EPSRC. The work in Japan has been partially supported by Elements Strategy Initiative to Form a Core Research Center, funded by The Ministry of Education, Culture, Sports, Science and Technology (MEXT); the Collaborative Research Project of Materials and Structures Laboratory, Tokyo Institute of Technology; the Collaborative Research Program of the Institute for Chemical Research, Kyoto University; and the BK21 plus Program through the Ministry of Education, Science and Technology of Korea

Characterization of copper microelectrodes, following a homemade lithography, technique, and gold electroless deposition

We report the fabrication and characterization of copper microelectrodes obtained by a homemade lithography technique and after gold electroless deposition. For the fabrication, planes consisting of arrays of electrodes (black in color) with bow tie shape were designed and printed on a transparent paper (Canson ltd.). Using an embroidery frame with a silk fabric, a photographic emulsion was spread on the silk and simultaneously pressing the Canson paper on it. The system was introduced into a closed box and exposed with a UV light. The designed electrode templates prevented direct exposition of the UV light over copper films and indelible ink was spread over it. After the ink was dried, the copper film is immersed into ferric acid to attack the uncovered copper parts (where there is no ink). In this way, we obtained copper electrodes with initial gap separation of ~142μm and subsequently, they followed electroless deposition of gold to make the copper electrodes to contact. For the characterization, electrical measurements were performed. They present ohmic resistance values in the order of 106 Ω produced by surface scattering of the electrons within the gold microwire and enhanced by oxidation of the copper electrodes

Characterization of copper microelectrodes, following a homemade lithography, technique, and gold electroless deposition

ABSTRACT We report the fabrication and characterization of copper microelectrodes obtained by a homemade lithography technique and after gold electroless deposition. For the fabrication, planes consisting of arrays of electrodes (black in color) with bow tie shape were designed and printed on a transparent paper (Canson ltd.). Using an embroidery frame with a silk fabric, a photographic emulsion was spread on the silk and simultaneously pressing the Canson paper on it. The system was introduced into a closed box and exposed with a UV light. The designed electrode templates prevented direct exposition of the UV light over copper films and indelible ink was spread over it. After the ink was dried, the copper film is immersed into ferric acid to attack the uncovered copper parts (where there is no ink). In this way, we obtained copper electrodes with initial gap separation of ~142μm and subsequently, they followed electroless deposition of gold to make the copper electrodes to contact. For the characterization, electrical measurements were performed. They present ohmic resistance values in the order of 10 6 Ω produced by surface scattering of the electrons within the gold microwire and enhanced by oxidation of the copper electrodes