7 research outputs found

    Studies of resistance switching effects in metal/YBa2Cu3O7-x interface junctions

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    Current-voltage characteristics of planar junctions formed by an epitaxial c-axis oriented YBa2Cu3O7-x thin film micro-bridge and Ag counter-electrode were measured in the temperature range from 4.2 K to 300 K. A hysteretic behavior related to switching of the junction resistance from a high-resistive to a low-resistive state and vice-versa was observed and analyzed in terms of the maximal current bias and temperature dependence. The same effects were observed on a sub-micrometer scale YBa2Cu3O7-x thin film - PtIr point contact junctions using Scanning Tunneling Microscope. These phenomena are discussed within a diffusion model, describing an oxygen vacancy drift in YBa2Cu3O7-x films in the nano-scale vicinity of the junction interface under applied electrical fields.Comment: To be published in Applied Surface Science

    Effect of crystallographic anisotropy on the resistance switching phenomenon in perovskites

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    Resistance switching effects in metal/perovskite contacts based on epitaxial c-axis oriented Y-Ba-Cu-O (YBCO) thin films with different crystallographic orientations have been studied. Three types of Ag/YBCO junctions with the contact restricted to (i) c-axis direction, (ii) ab-plane direction, and (iii) both were designed and fabricated, and their current-voltage characteristics have been measured. The type (i) junctions exhibited conventional bipolar resistance switching behavior, whereas in other two types the low-resistance state was unsteady and their resistance quickly relaxed to the initial high-resistance state. Physical mechanism based on the oxygen diffusion scenario, explaining such behavior, is discussed.Comment: The final version was published in Journal of Applied Physics (2012

    SrTiO3 thin films on Si(110) and Si(100) substrates

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    We present the preparation and structural properties of SrTiO3 thin films deposited on Si(100) and Si(110) substrates by on-axis rf magnetron sputtering. In order to reduce the oxide layer at the substrate-film interface, a l0nm thick Sr layer is deposited in-situ by electron beam evaporation prior to the deposition of the SrTiO3 films. The growth of the SrTiO3 films is influenced by the deposition temperature. XRD measurements reveal preferred (110) orientation for the SrTiO3 films grown at substrate temperature 750°C. Beside X-ray diffraction method the layers are investigated by Transmission Electron Microscopy in more detail. We observe epitaxial growth of the SrTiO3 layer if it is deposited on Si(110) substrate

    Highly Homogeneous 2D/3D Heterojunction Diodes by Pulsed Laser Deposition of MoS2 on Ion Implantation Doped 4H-SiC

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    In this paper, 2D/3D heterojunction diodes have been fabricated by pulsed laser deposition (PLD) of MoS2 on 4H-SiC(0001) surfaces with different doping levels, i.e., n− epitaxial doping (≈1016 cm−3) and n+ ion implantation doping (>1019 cm−3). After assessing the excellent thickness uniformity (≈3L-MoS2) and conformal coverage of the PLD-grown films by Raman mapping and transmission electron microscopy, the current injection across the heterojunctions is investigated by temperature-dependent current–voltage characterization of the diodes and by nanoscale current mapping with conductive atomic force microscopy. A wide tunability of the transport properties is shown by the SiC surface doping, with highly rectifying behavior for the MoS2/n− SiC junction and a strongly enhanced current injection for MoS2/n+ SiC one. Thermionic emission is found the dominant mechanism ruling forward current in MoS2/n− SiC diodes, with an effective barrier ΦB = (1.04 ± 0.09) eV. Instead, the significantly lower effective barrier ΦB = (0.31 ± 0.01) eV and a temperature-dependent ideality factor for MoS2/n+ SiC junctions is explained by thermionic-field-emission through the thin depletion region of n+ doped SiC. The scalability of PLD MoS2 deposition and the electronic transport tunability by implantation doping of SiC represents key steps for industrial development of MoS2/SiC devices
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