Electron capture in GaAs quantum wells via electron-electron and optic phonon scattering

Electron capture times in a separate confinement quantum well (QW) structure with finite electron density are calculated for electron-electron (e-e) and electron-polar optic phonon (e-pop) scattering. We find that the capture time oscillates as function of the QW width for both processes with the same period, but with very different amplitudes. For an electron density of 10^11 cm^-2 the e-e capture time is 10-1000 times larger than the e-pop capture time except for QW widths near the resonance minima, where it is only 2-3 times larger. With increasing electron density the e-e capture time decreases and near the resonance becomes smaller than the e-pop capture time. Our e-e capture time values are two-to-three orders of magnitude larger than previous results of Blom et al. [Appl. Phys. Lett. 62, 1490 (1993)]. The role of the e-e capture in QW lasers is therefore readdressed.Comment: 5 pages, standard LaTeX file + 5 PostScript figures (tarred, compressed and uuencoded) or by request from [email protected], accepted to Appl. Phys. Let

Assessment of circuit board surface finishes for electronic assembly with lead-free solders

The suitability of various metallic printed wiring board surface finishes was assessed for new technology applications that incorporate assembly with Lead-free solders. The manufacture of a lead-free product necessitates elimination of lead (Pb) from the solder, the circuit board as well as the component lead termination. It is critical however for the selected interconnect Pb-free solder and the corresponding printed wiring board (PWB) and component lead finishes to be mutually compatible. Baseline compatibility of select Pb-free solders with Pb containing PWB surface finish and components was assessed. This was followed by examining the compatibility of the commercially available CASTIN{trademark} (SnAgCuSb) Pb-free solder with a series of PWB metallic finishes: Ni/Au, Ni/Pd, and Pd/Cu. The compatibility was assessed with respect to assembly performance, solder joint integrity and long term attachment reliability. Solder joint integrity and mechanical behavior of representative 50 mil pitch 20I/O SOICs was determined before and after thermal stress. Mechanical pull test studies demonstrated that the strength of SnAgCuSb solder interconnections is notably greater than that of SnPb interconnections

Spatio-temporal dynamics of quantum-well excitons

We investigate the lateral transport of excitons in ZnSe quantum wells by using time-resolved micro-photoluminescence enhanced by the introduction of a solid immersion lens. The spatial and temporal resolutions are 200 nm and 5 ps, respectively. Strong deviation from classical diffusion is observed up to 400 ps. This feature is attributed to the hot-exciton effects, consistent with previous experiments under cw excitation. The coupled transport-relaxation process of hot excitons is modelled by Monte Carlo simulation. We prove that two basic assumptions typically accepted in photoluminescence investigations on excitonic transport, namely (i) the classical diffusion model as well as (ii) the equivalence between the temporal and spatial evolution of the exciton population and of the measured photoluminescence, are not valid for low-temperature experiments.Comment: 8 pages, 6 figure

Wave soldering with Pb-free solders

The manufacturing feasibility and attachment reliability of a series of newly developed lead-free solders were investigated for wave soldering applications. Some of the key assembly aspects addressed included: wettability as a function of board surface finish, flux activation and surface tension of the molten solder, solder joint fillet quality and optimization of soldering thermal profiles. Generally, all new solder formulations exhibited adequate wave soldering performance and can be considered as possible alternatives to eutectic SnPb for wave soldering applications. Further process optimization and flux development is necessary to achieve the defect levels associated with the conventional SnPb process

Assessment of NiPd finished components for surface mount assembly applications

Recent trends towards finer pitch devices and assembly with lead free solders have resulted in increased interest in NiPd plated component leads by the electronics industry. This paper discusses the performance of NiPd fine pitch components as determined by wettability, assembly performance and solder joint reliability. Assembly evaluations were performed with a lead free solder as well as with eutectic SnPb solder. The compatibility of the NiPd component leads with different circuit board finishes (metallic and organic azole) will also be discussed