Assessment of NiPd finished components for surface mount assembly applications

Abstract

Recent trends towards finer pitch devices and assembly with lead free solders have resulted in increased interest in NiPd plated component leads by the electronics industry. This paper discusses the performance of NiPd fine pitch components as determined by wettability, assembly performance and solder joint reliability. Assembly evaluations were performed with a lead free solder as well as with eutectic SnPb solder. The compatibility of the NiPd component leads with different circuit board finishes (metallic and organic azole) will also be discussed