Improvement of thick printed copper substrates solderability by formic acid

This paper deals with solderability of thick printed copper substrates using formic acid vapours in combination with vacuum soldering technology. The topic of low void, preferably void free joints in the field of electronics is important, because of rising demand in high-power applications. Void presence can cause many negative effects such as localized overheating or mechanical stress vulnerability which can result into cracks and splits. If the joints are partially or fully destroyed, the product is non-functional and can lead to its total destruction. This condition can result even in life threatening situation

Antimony Hall sensor testing at ITER and DEMO relevant temperatures

Measurements of the steady-state magnetic field of ITER and DEMO reactors will be performed by Hall sensors that will be part of the magnetic diagnostics. The sensors will contribute to the measurement of the plasma current, plasma-wall clearance, and local perturbations of the magnetic flux surfaces near the wall. The paper describes new ceramic-metal Hall sensors with an antimony sensing layer. The results of temperature tests of second-generation antimony sensors based on thick printed copper technology are presented, including testing of the long-term stability of the sensors

Preliminary design of the COMPASS upgrade tokamak

COMPASS Upgrade is a new medium size, high magnetic field tokamak (R = 0.9 m, Bt = 5 T, Ip = 2 MA) currently under design in the Czech Republic. It will provide unique capabilities for addressing some of the key challenges in plasma exhaust physics, advanced confinement modes and advanced plasma configurations as well as testing new plasma facing materials and liquid metal divertor concepts. This paper contains an overview of the preliminary engineering design of the main systems of the COMPASS Upgrade tokamak (vacuum vessel, central solenoid and poloidal field coils, toroidal field coils, support structure, cryostat, cryogenic system, power supply system and machine monitoring and protection system). The description of foreseen auxiliary plasma heating systems and plasma diagnostics is also provided as well as a summary of expected plasma performance and available plasma configurations