Ternary intermetallic compounds synthesized by molten-metal-solution growth

Several new ternary compounds have been synthesized by growing crystals of metallic compounds in a molten-metal solution. Quantum-stability diagrams predict whether a ternary intermetallic compound, a quasi-ternary compound or a binary compound will crystallize from the solution upon slow cooling

Three-port interferometer in silicon-on-insulator for wavelength monitoring and displacement measurement

The wavelength of a narrow-band optical signal can be accurately tracked by means of an interferometer having a fixed path length difference. For example, a low-cost Fiber Bragg Grating (FBG) interrogation system which tracks the FBG reflection wavelength over time can be based on such an interferometer. Alternatively, an interferometer is operated at fixed wavelength to monitor displacement, as applied in metrology. © 2011 IEEE

Integrated 3x3 Interferometer

The interferometer based on the fiber 3x3 coupler is already a well-known device for measuring displacements and wavelength shifts. TNO is currently working on the fabrication of an integrated version of this versatile interferometer on Silicon-On-Insulator. The integrated interferometer is expected to be far more stable then the fiber version, making it less sensitive to vibrations, temperature and pressure variations. Also the size of the component is much smaller, making it ideal for a variety of new and smaller sensors. This paper describes the current progress on building such an interferometer for measuring small displacement and using it as a Fiber Bragg interrogator

Low-cost packaging concepts for integrated nanophotonics

Coupling an optical chip to its surroundings is very hard compared to an electrical chip. This complexity is mainly caused by alignment and accuracy challenges and is driving the cost price up to levels at which the commercial benefits of optical chips are no longer obvious, despite their many great technological advantages. Up to 80% of an optical system’s cost price consists of packaging, in which the coupling of chip to fiber is done on chip level instead of per wafer. We investigate reducing these packaging costs to make optical chips commercially more attractive

Ternary intermetallic compounds synthesized by molten-metal-solution growth

Several new ternary compounds have been synthesized by growing crystals of metallic compounds in a molten-metal solution. Quantum-stability diagrams predict whether a ternary intermetallic compound, a quasi-ternary compound or a binary compound will crystallize from the solution upon slow cooling

Sensing platform based on micro-ring resonator and on-chip reference sensors in SOI

This article presents work on a Silicon-On-Insulator (SOI) compact sensing platform based on Micro Ring Resonators (MRRs). In order to enable correction for variations in environmental conditions (temperature, mechanical stress etc), a study has been performed on the performance of uncoated sensing MRRs, and of SU8- and SiO2-covered reference MRRs. Excellent shielding for both cover materials has been obtained, however, water permeation into the SU8 causes a slow drift in sensor response. We believe that a user-friendly, low-cost and robust way for optical interfacing to MRR sensor chips is required for practical application in Point-Of-Care diagnostics, and that the cost and complexity of optical-electrical read-out systems must decrease. We have taken first steps to realize that vision, by building a prototype free-space optical coupling set-up, which enables non-photonic experts to characterize surface activation processes using MRRs. Moreover, we present our first steps towards on-chip read-out systems. © 2014 SPIE

ePIXfab:The silicon photonics platform

ePIXfab-The European Silicon Photonics Support Center continues to provide state-of-the-art silicon photonics solutions to academia and industry for prototyping and research. ePIXfab is a consortium of EU research centers providing diverse expertise in the silicon photonics food chain, from training users in designing silicon photonics chips to fiber pigtailed chips. While ePIXfab provides world-wide users access to advanced silicon photonics it also focuses its attention to expanding the silicon photonics infrastructure through a network of design houses, access partners and industrial collaborations. © 2013 SPIE