Arrangement relating to conductor carriers and methods for the manufacture of such carriers.

Method and arrangements for reducing crosstalk between conductors on a conductor carrier, and methods for manufacturing conductor carriers including these arrangements are presented. Crosstalk between the conductors is prevented by providing a dielectric material in the space between each conductor and an earth plane so that the electric field can be tied down within this space and thus prevent leakage of field lines to the co-lateral conductors. The capacitance is increased by an arrangement in the space immediately beneath the conductor so as to reduce the distance between conductors and the earth plane and/or through the medium of a dielectric material that has a higher dielectric index than the dielectric material

Tunable microwave arrangement (surface mounted resonator)

The present invention relates to a tunable microwave arrangement (100) comprising a waveguide arrangement and tuning elements comprising a number of varactors for tuning an electromagnetic signal input to the waveguide arrangement. It comprises a substrate (1), a layered structure (20) comprising at least two conducting layers (2,3) and at least one dielectric layer (4) which are arranged in an alternating manner. The layered structure is arranged on the substrate (1) such that a first of said conducting layers (2) is closest to the substrate (1). It also comprises at least one surface mounted waveguide (5), a second of the conducting layers (3), most distant from the substrate, being adapted to form a wall of the surface mounted waveguide (5), which wall incorporates said tuning elements which are arranged to enable control of surface currents generated in said wall, hence loading the waveguide (5) with a tunable, controllable impedance

Tunable microwave arrangements

The present invention relates to a tunable microwave arrangement (100) comprising a waveguide arrangement and tuning elements comprising a number of varactors for tuning an electromagnetic signal input to the waveguide arrangement. It comprises a substrate (1), a layered structure (20) comprising at least two conducting layers (2,3) and at least one dielectric layer (4) which are arranged in an alternating manner. The layered structure is arranged on the substrate (1) such that a first of said conducting layers (2) is closest to the substrate (1). It also comprises at least one surface mounted waveguide (5), a second of the conducting layers (3), most distant from the substrate, being adapted to form a wall of the surface mounted waveguide (5), which wall incorporates said tuning elements which are arranged to enable control of surface currents generated in said wall, hence loading the waveguide (5) with a tunable, controllable impedance

Tunable microwave arrangement (surface mounted resonator)

The present invention relates to a tunable microwave arrangement (100) comprising a waveguide arrangement and tuning elements comprising a number of varactors for tuning an electromagnetic signal input to the waveguide arrangement. It comprises a substrate (1), a layered structure (20) comprising at least two conducting layers (2,3) and at least one dielectric layer (4) which are arranged in an alternating manner. The layered structure is arranged on the substrate (1) such that a first of said conducting layers (2) is closest to the substrate (1). It also comprises at least one surface mounted waveguide (5), a second of the conducting layers (3), most distant from the substrate, being adapted to form a wall of the surface mounted waveguide (5), which wall incorporates said tuning elements which are arranged to enable control of surface currents generated in said wall, hence loading the waveguide (5) with a tunable, controllable impedance

Tunable microwave arrangements

The present invention relates to a tunable microwave arrangement (100) comprising a waveguide arrangement and tuning elements comprising a number of varactors for tuning an electromagnetic signal input to the waveguide arrangement. It comprises a substrate (1), a layered structure (20) comprising at least two conducting layers (2,3) and at least one dielectric layer (4) which are arranged in an alternating manner. The layered structure is arranged on the substrate (1) such that a first of said conducting layers (2) is closest to the substrate (1). It also comprises at least one surface mounted waveguide (5), a second of the conducting layers (3), most distant from the substrate, being adapted to form a wall of the surface mounted waveguide (5), which wall incorporates said tuning elements which are arranged to enable control of surface currents generated in said wall, hence loading the waveguide (5) with a tunable, controllable impedance

Modular interconnection system for optical PCB and backplane communication

This paper presents a way of building modular systems with a powerful optical interconnection network. Each module, placed on a Printed Circuit Board (PCB), has a generic optical communication interface with a simple electronic router. Together with optical switching using micro-electromechanical system (MEMS) technology, packet switching over reconfigurable topologies is possible. The interconnection system gives the possibility to integrate electronics with optics without changing existing PCB technology. Great interest from industry is therefore expected and the cost advantages are several: reuse of module designs, module upgrades without changing the PCB, low-cost conventional PCB technology, etc. In the version described in this paper, the interconnection system has 48 bidirectional optical channels for intra-PCB communication on each board. For inter-PCB communication, a backplane with 192 bidirectional optical channels supports communication between twelve PCBs. With 2.5 Gbit/s per optical channel in each direction, the aggregated intra-PCB bit rate is 120 Gbit/s full duplex (on each PCB) while the aggregated inter-PCB bit rate is 480 Gbit/s full duplex. A case study shows the feasibility of the interconnection system in a parallel processing system for radar signal processing.©2002 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.</p

RF-MEMS Tuned GaN HEMT based Cavity Oscillator for X-band

This letter presents a radio frequency micro-electromechanical systems (RF-MEMS) tuned cavity oscillator for X-band. The active part of the oscillator is implemented in GaN-HEMT MMIC technology. The RF-MEMS-switches are realized on a quartz substrate that is surface mounted on a low loss PCB. The PCB is intruded in an aluminum cavity acting as an electrically moveable wall. For a three-row RF-MEMS setup, a tuning range of 5 % around an oscillation frequency of 10 GHz is demonstrated in measurements. The phase noise is as low as -140 dBc/Hz to -129 dBc/Hz at 100 kHz from the carrier, depending on the configuration of the RF-MEMS