52 research outputs found

    Non-destructive imaging of buried electronic interfaces using a decelerated scanning electron beam

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    Recent progress in nanotechnology enables the production of atomically abrupt interfaces in multilayered junctions, allowing to increase the number of transistors in a processor, as known as Moore’s law, for example. However, uniform electron transport has never been achieved across the entire interfacial area in junctions due to the existence of local defects, causing local heating and reduction in transport efficiency. To date, junction uniformity has been predominantly assessed by cross-sectional transmission electron microscopy, which requires slicing and milling processes with potentially introducing additional damage and deformation. It is therefore essential to develop an alternative non-destructive method. Here we show a non-destructive technique using scanning electron microscopy to map buried junction properties. By controlling the electron-beam energy, we demonstrate the contrast imaging of local junction resistances at a controlled depth. This technique can be applied to any buried junctions, from conventional semiconductor and metal devices to organic devices

    Fabrication of ‘finger-geometry’ silicon solar cells by electrochemical anodisation

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    Cells made from crystalline silicon dominate the market for photovoltaics, but improvements in cost-effectiveness are still necessary for uptake to increase. In this paper, we investigate the fabrication of a cell structure which has the potential to be compatible with cheap low-purity silicon substrates. In our cell design the charge-collecting p–n junction protrudes into the substrate like fingers, thus significantly reducing the required carrier diffusion length compared to a front planar junction cell. The macroporous structure is created by electrochemical anodisation of an n-type silicon substrate in an HF and H2O2 (aqueous) electrolyte. The pores are loaded with a boron-containing glass which is then annealed to diffuse the dopant into the silicon substrate forming a volume junction. The anodisation conditions have been optimised using intentionally contaminated single-crystal silicon as a model system. We characterise the junction formed by electron beam induced current and current–voltage measurements. The anodisation study is extended to n-type multicrystalline silicon and it is found that the orientation of the grains strongly influences the geometry of the pores formed. The potential for using this cell structure for low-cost photovoltaics is discussed and potential problems are highlighted
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