Predictors of Failure from Primary Therapy for Giardiasis in San Diego: A Single Institution Retrospective Review.

This study aimed to determine the presence of giardiasis among HIV patients in San Diego, the rate of failure of metronidazole treatment, and factors associated with treatment failure. We used a 7 year retrospective single-center case series of HIV-infected individuals with giardiasis at University of California San Diego Medical Center. Data were analyzed for the changes in the hematological, biochemical, and immunologic results at pre- and at-diagnosis levels. We also compared the changes at the diagnosis level among patients who were treated successfully and those who experienced treatment failure as defined by retreatment with a second course of antibiotics. In 29 Giardia lamblia-infected HIV patients, following diagnosis of G. lamblia, there was a non-significant decrement in cluster of differentiation 4 (CD4), but a statistically significant increase in the number of white blood cell (WBC). Other indices did not differ between pre- and at-diagnosis levels. Twenty patients (69%) were treated with a single course of metronidazole or tinidazole and seven patients (24.1%) were treated with more than one course of metronidazole. These seven patients had statistically significant higher hemoglobin at the time of diagnosis, but further studies are required to confirm if this is a consistent finding and if this can predict failure from primary therapy

Integrated Reservoir Management under Stochastic Conditions

Economic optimization, Lake levels, Marketed and non-marketed water uses, Non-linear programming, Recreational benefits, Reservoir management, Stochastic inflows, Value of a visitor day, Environmental Economics and Policy, International Development, Land Economics/Use, Production Economics, Productivity Analysis, Public Economics, Resource /Energy Economics and Policy, Risk and Uncertainty,

Optimal Allocation of Reservoir Water

The purpose of this paper is to determine the optimal allocation of reservoir water among consumptive and non-consumptive uses. A non-linear mathematical programming model is developed to optimally allocate Lake Tenkiller water among competing uses that maximize the net social benefit. A mass balance is used to determine the level and volume of water in the lake. This paper examines the effect of water management on lake resources when recreational values are and are not included as control variables in the optimization process. Results show that maintaining the lake level to the ‘normal lake level’ of 632 feet during the summer months generates more recreational benefit rather than reducing the lake level by releasing water for hydro power generation.consumptive and non-consumptive use, mass balance equation, non-linear mathematical programming, optimization, recreational uses, water allocation, Resource /Energy Economics and Policy,

Group IV functionalization of low index waveguides

Low fabrication error sensitivity, integration density, channel scalability, low switching energy and low insertion loss are the major prerequisites for future on-chip WDM systems and interfacing with optical fibres. A number of device geometries have already been demonstrated that fulfil these criteria, at least in part, but combining all of the requirements is still a difficult challenge.Two contenders that could fulfil these criteria are the low loss nitride waveguiding platform and the high index group IV compounds for active photonic devices. Silicon Oxynitride (SiON) and Silicon Nitride (SiN) based waveguides are extremely powerful and central to today’s optical communications networks. The intermediate refractive index provides low footprint devices but eases the fabrication demands that can result in phase errors and repeatability problems in the all silicon approach. This enables multiplexers and demultiplexers with very low crosstalk and insertion loss and extremely low loss long range waveguides, making them very attractive for the optical backplanes and rack to rack links inside supercomputers and data centers. Group IV Photonics GeSi has a number of attractive optical characteristics for modulation, absorption and detection in a small volume area enabling low power and high density integration.Here, we propose and demonstrate a novel architecture consisting of the interfacing of a range of deposition method using low temperature PECVD and HWCVD nitride waveguides, Photonic crystal modulators [1] but also detectors [2] connected by a silicon nitride bus waveguide. The architecture features very high scalability due to the small size of the devices (~100 micrometre square) and the modulators operate with an AC energy consumption of less than 1fJ/bit

Stress intensity factors for an interfacial crack between an orthotropic half-plane bonded to a dissimilar orthotropic layer with a punch

AbstractThe plane strain problem of determining Stress Intensity Factors (SIF) for a moving interfacial Griffith crack between an elastic orthotropic half-plane and a dissimilar orthotropic layer with a moving punch situated along the boundary of the layer have been considered. The problem is reduced to the solution of three simultaneous singular integral equations with Cauchy-type singularities. Expressions for SIF for the case of a general loading are obtained. Numerical results for some particular cases are also presented graphically

Magneto-thermoelastic surface waves in micropolar elastic media

AbstractThis paper deals with a study of magneto-thermoelastic surface waves in a micropolar, elastic isotropic, homogeneous, and centro-symmetric medium in the presence of a constant magnetic field. The general frequency equation is derived. As special cases of this analysis, we derive the velocities of the Rayleigh waves, and Love waves in various configurations

Material Selection for Interfacial Bond Layer in Electronic Packaging

In electronic packaging, typically two or more thin dissimilar plates or layers are bonded together by an extremely thin adhesive bond layer. Electronic assemblies are usually operated under high power conditions which predictably produces a high temperature environment in the electronic devices. Therefore, thermal mismatch shear and peeling stress inevitably arise at the interfaces of the bonded dissimilar materials due to differences in Coefficient of Thermal Expansion (CTE) typically during the high temperature change in the bond process. As a result, delamination failure may occur during manufacturing, machining, and field use. As such, these thermo-mechanical stresses play a very significant role in the design and reliability of the electronic packaging assembly. Consequently, critical investigations of interfacial stresses under variable load conditions in composite structure can result in a better design of electronic packaging with higher reliability and minimize or eliminate the risk of functional failure. In order to formulize bond material selection, analytical studies are carried out in order to study the influence of bond layer parameters on interfacial thermal stresses of a given package. These parameters include Coefficient of thermal expansion (CTE), poison's ratio, temperature, thickness, and stiffness (compliant and stiff) of the bond layer. From the study, stiffness and bond layer thickness are identified as the key parameters influencing interfacial shearing and peeling stresses. The other parameters namely CTE, poisons ratio has shown insignificant influence on interfacial stresses due to the very thin section of bond layer compared to the top and bottom layers. The results also show that the interfacial stresses increases proportionally with the increase of temperature in the layers. Therefore, it is very important that the temperature is maintained as low as possible during the chip manufacturing and operating stages. Since only two parameters namely stiffness and bond layer thickness are identified as the key parameters, the interface thermal mismatch stresses can be reduced or eliminated by controlling these two parameters only. Therefore the identification of suitable bond layer parameters selection with reasonable accuracy is possible even without performing optimization process. Finally, this paper proposes a Metal Matrix Composite (MMC) bond material selection approach using rule of mixture material design. The outcome of this research can be seen in the forms of practical and beneficial tools for interfacial stress evaluation and physical design and fabrication of layered assemblies. The Engineers can utilize this research outcome in conjunction with guidelines for electronic packaging under variable thermal properties of layered composites

Bond Layer Properties and Geometry Effect on Interfacial Thermo-mechanical Stresses in Bi-material Electronic Packaging Assembly

Thermo-mechanical mismatch stress is one of the reasons for mechanical as well as functional failure between two or more connected devices. In electronic packaging, two or more plates or layers are bonded together by an extremely thin layer. This thin bonding layer works as an interfacial stress compliance which is expected to alleviate the interfacial stresses between the layers. Therefore, it is very important to identify the suitable interfacial bonding characteristics for reducing the interfacial thermal mismatch stresses to maintain the structural integrity. This research work examines the influences of bond layer properties and geometry on the interfacial shearing and peeling stresses in a bi-material assembly. In this study a closed form model of bi-layered assembly is used with the up-to-date bond layer shear stress compliance expression. The key bond layer properties namely Young's modulus, coefficient of thermal expansion, Poisson's ratio, and physical parameters like temperature and thickness are considered for interfacial stress evaluation. It is observed that the Young's modulus, the thickness and the temperature of the bond layer have significant influence on the interfacial shearing and peeling stress. The results obtained are likely to be useful in designing bond layer properties in microelectronics and photonics applications

Utilization of Agro-Industrial Waste in Metal Matrix Composites: Towards Sustainability

The application of agro-industrial waste in Aluminum Metal Matrix Composites has been getting more attention as they can reinforce particles in metal matrix which enhance the strength properties of the composites. In addition, by applying these agro-industrial wastes in useful way not only save the manufacturing cost of products but also reduce the pollutions on environment. This paper represents a literature review on a range of industrial wastes and their utilization in metal matrix composites. The paper describes the synthesis methods of agro-industrial waste filled metal matrix composite materials and their mechanical, wear, corrosion, and physical properties. It also highlights the current application and future potential of agro-industrial waste reinforced composites in aerospace, automotive and other construction industries