Optically Enhanced Bonding Workstation for Robust Bonding

Process control is one of the methods recommended by the FAA to reduce risk in fabrication of structurally bonded composite joints for aircraft structure based on guidance provided in circular AC-107B for certification of structurally bonded joints. An Optically Enhanced Bonding Workstation is presented here that reduces the risk in bonded joint fabrication. Results will be presented demonstrating the benefits of process monitoring and its ability to reduce risk in performing pre-bond composite surface preparation steps. This supports reduction in the timeline to certification of bonded composite structures through development of a robust bonding process upstream of any part certification steps. Sanding surface preparation has been identified as a high risk process step that is known to impact bond performance. Control of sanding during surface preparation can be performed using portable surface analysis tools previously identified including included gloss, color, Fourier Transform Infrared spectroscopy (FTIR) and optically stimulated electron emissions (OSEE). Threshold limits for the surface analysis tool measurements were determined based on an example objective bonding system utilizing a common EA9394 paste adhesive measured using standard double cantilever beam fracture toughness testing. The patented Optically Enhanced Bonding Workstation (OEBW), was tailored to monitor and control the epoxy composite surface preparation step. Surface analysis tool threshold limits were incorporated into the OEBW to demonstrate improved composite bond performance through process control. The surface analysis tools investigated here can easily be incorporated into an automated system due to their applicability to rapidly quantify the composite sanded surface treatment and their portability

Contamination and Surface Preparation Effects on Composite Bonding

Results presented here demonstrate the effect of several prebond surface contaminants (hydrocarbon, machining fluid, latex, silicone, peel ply residue, release film) on bond quality, as measured by fracture toughness and failure modes of carbon fiber reinforced epoxy substrates bonded in secondary and co-bond configurations with paste and film adhesives. Additionally, the capability of various prebond surface property measurement tools to detect contaminants and potentially predict subsequent bond performance of three different adhesives is also shown. Surface measurement methods included water contact angle, Dyne solution wettability, optically stimulated electron emission spectroscopy, surface free energy, inverse gas chromatography, and Fourier transform infrared spectroscopy with chemometrics analysis. Information will also be provided on the effectiveness of mechanical and energetic surface treatments to recover a bondable surface after contamination. The benefits and drawbacks of the various surface analysis tools to detect contaminants and evaluate prebond surfaces after surface treatment were assessed as well as their ability to correlate to bond performance. Surface analysis tools were also evaluated for their potential use as in-line quality control of adhesive bonding parameters in the manufacturing environment