49 research outputs found

    Physical Multi-Layer Phantoms for Intra-Body Communications

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    This paper presents approaches to creating tissue mimicking materials that can be used as phantoms for evaluating the performance of Body Area Networks (BAN). The main goal of the paper is to describe a methodology to create a repeatable experimental BAN platform that can be customized depending on the BAN scenario under test. Comparisons between different material compositions and percentages are shown, along with the resulting electrical properties of each mixture over the frequency range of interest for intra-body communications; 100 KHz to 100 MHz. Test results on a composite multi-layer sample are presented confirming the efficacy of the proposed methodology. To date, this is the first paper that provides guidance on how to decide on concentration levels of ingredients, depending on the exact frequency range of operation, and the desired matched electrical characteristics (conductivity vs. permittivity), to create multi-layer phantoms for intra-body communication applications

    State Dependent Statistical Timing Model for Voltage Scaled Circuits

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    This paper presents a novel statistical state-dependent timing model for voltage over scaled (VoS) logic circuits that accurately and rapidly finds the timing distribution of output bits. Using this model erroneous VoS circuits can be represented as error-free circuits combined with an error-injector. A case study of a two point DFT unit employing the proposed model is presented and compared to HSPICE circuit simulation. Results show an accurate match, with significant speedup gains

    Equi-Noise: A Statistical Model That Combines Embedded Memory Failures and Channel Noise

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    This paper exploits the predominance of embedded memories in current and emerging wireless transceivers as a means to save power via channel state aware voltage scaling. The paper presents a statistical model that captures errors in embedded memories due to voltage over-scaling and maps the errors to a Gaussian distribution that represents a combination of communication channel noise and hardware noise. Designers can use the proposed model to investigate different power management policies, that capture the performance of the system as a function of both channel and hardware dynamics, thus creating a much richer design space of power, performance and reliability. A case study of a DVB receiver is presented and the validity of the proposed model is confirmed by simulations. © 2013 IEEE

    Algorithms and Architectures of Energy-Efficient Error-Resilient MIMO Detectors for Memory-Dominated Wireless Communication Systems

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    In a broadband MIMO-OFDM wireless communication system, embedded buffering memories occupy a large portion of the chip area and a significant amount of power consumption. Due to process variations of advanced CMOS technologies, it becomes both challenging and costly to maintain perfectly functioning memories under all anticipated operating conditions. Thus, Voltage over Scaling (VoS) has emerged as a means to achieve energy efficient systems resulting in a tradeoff between energy efficiency and reliability. In this paper we present the algorithm and VLSI architecture of a novel error-resilient K-Best MIMO detector based on the combined distribution of channel noise and induced errors due to VoS. The simulation results show that, compared with a conventional MIMO detector design, the proposed algorithm provides up-to 4.5 dB gain to achieve the near-optimal Packet Error Rate (PER) performance in the 4 × 4 64-QAM system. Furthermore, based on experimental results, when jointly considering the detector and memory power consumption, the proposed resilient scheme with VoS memory can achieve up to 32.64% savings compared to the conventional K-Best detector with perfect memory. © 2014 IEEE

    A survey of cross-layer power-reliability tradeoffs in multi and many core systems-on-chip

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    As systems-on-chip increase in complexity, the underlying technology presents us with significant challenges due to increased power consumption as well as decreased reliability. Today, designers must consider building systems that achieve the requisite functionality and performance using components that may be unreliable. In order to do so, it is crucial to understand the close interplay between the different layers of a system: technology, platform, and application. This will enable the most general tradeoff exploration, reaping the most benefits in power, performance and reliability. This paper surveys various cross layer techniques and approaches for power, performance, and reliability tradeoffs are technology, circuit, architecture and application layers. © 2013 Elsevier B.V. All rights reserved

    Register-Transfer Synthesis of Pipelined Data Paths

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    We present a new approach to the problem of register-transfer level design optimization of pipelined data paths. The output of high level synthesis procedures, such as Sehwa, consists of a schedule of operations into time steps, and a fixed set of hardware operators. In order to obtain a register-transfer level design, we must assign operations to specific operators, values to registers, and finish the interconnections. We first perform module assignment with the goal of minimizing the interconnect requirements between RT-level components as a preprocessing procedure to the RT-level design. This will result in a smaller netlist which makes the design more compact and the design process more efficient. In addition to reducing the total number of interconnects, this approach will also reduce the total number of multiplexors in the design by eliminating unnecessary multiplexing at the inputs of shared modules. The interconnect sharing task is modeled as a constrained clique partitioning problem. We developed a fast and efficient polynomial time heuristic procedure to solve this problem. This procedure is 30–50 times faster than other existing heuristics while still producing better results for our purposes. Using this procedure, we can produce near optimal interconnect sharing schemes in a few seconds for most practical size pipelined designs. This efficient approach will enable designers to explore a larger portion of the design space and trade off various design parameters effectively
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