Improving bonding strength by non-thermal atmospheric pressure plasma-assisted technology for A5052/PEEK direct joining

The direct bonding of A5052 aluminum (Al) alloy to the engineering polymer poly(ether ether ketone) (PEEK) using an atmospheric pressure plasma-assisted process was demonstrated. The effect of plasma irradiation on the bonding surface of metal resin on the bonding strength following thermal press fitting method was investigated. Specimens bonded by plasma irradiation on the PEEK surface only showed a high tensile shear stress of 15.5 MPa. With increasing plasma irradiation time, the bond strength of the samples bonded to the PEEK surface by plasma irradiation increased. The increase in the bond strength between metals and polymers following direct bonding is caused by the addition of oxygen functional groups on the polymer. In contrast, specimens in which only the Al was exposed to the plasma showed a decrease in bond strength compared with unirradiated samples. This reduction in bond strength is attributed to the forming magnesium oxide, which forms in the early stages of participation due to plasma irradiation.The version of record of this article, first published in International Journal of Advanced Manufacturing Technology, is available online at Publisher’s website: https://doi.org/10.1007/s00170-023-12747-

Influence of pre-treatment using non-thermal atmospheric pressure plasma jet on aluminum alloy A1050 to PEEK direct joining with hot-pressing process

The version of record of this article, first published in International Journal of Advanced Manufacturing Technology, is available online at Publisher’s website: https://doi.org/10.1007/s00170-023-12827-7.Aluminum alloy A1050 to polyetheretherketone (PEEK) direct joining with hot-pressing process via pre-treatment using non-thermal atmospheric pressure plasma jet has been performed. The effect of plasma irradiation on the tensile shear strength of A1050-PEEK direct bonded specimens joined by a combination of hot-pressing process and pre-plasma treatment using non-thermal atmospheric pressure plasma jet was investigated. A1050-PEEK bonded samples with plasma-treated PEEK only showed high tensile shear stress of 13.4 MPa. This increase in tensile shear strength is attributed to the addition of oxygen functional groups on the surface of the PEEK by reactive oxygen species produced by the plasma jet

DELAY OF GERMINATION 1-LIKE 4 acts as an inducer of seed reserve accumulation

More than 70% of global food supply depends on seeds. The major seed reserves, such as proteins, lipids, and polysaccharides, are produced during seed maturation. Here, we report that DELAY OF GERMINATION 1-LIKE 4 (DOGL4) is a major inducer of reserve accumulation during seed maturation. The DOGL family proteins are plant-specific proteins of largely unknown biochemical function. DOGL4 shares only limited homology in amino acid sequence with DOG1, a major regulator of seed dormancy. DOGL4 was identified as one of the outstanding abscisic acid (ABA)-induced genes in our RNA sequencing analysis, whereas DOG1 was not induced by ABA. Induction of DOGL4 caused the expression of 70 seed maturation-specific genes, even in germinating seeds, including the major seed reserves ALBUMIN, CRUCIFERIN and OLEOSIN. Although DOG1 affects the expression of many seed maturation genes, the major seed reserve genes induced by DOGL4 are not altered by the dog1 mutation. Furthermore, the reduced dormancy and longevity phenotypes observed in the dog1 seeds were not observed in the dogl4 mutants, suggesting that these two genes have limited functional overlap. Taken together, these results suggest that DOGL4 is a central factor mediating reserve accumulation in seeds, and that the two DOG1 family proteins have diverged over the course of evolution into independent regulators of seed maturation, but retain some overlapping function.</p