Influence of microstructure on the cutting behaviour of silicon

We use molecular dynamics simulation to study the mechanisms of plasticity during cutting of monocrystalline and polycrystalline silicon. Three scenarios are considered: (i) cutting a single crystal silicon workpiece with a single crystal diamond tool, (ii) cutting a polysilicon workpiece with a single crystal diamond tool, and (iii) cutting a single crystal silicon workpiece with a polycrystalline diamond tool. A long-range analytical bond order potential is used in the simulations, providing a more accurate picture of the atomic-scale mechanisms of brittle fracture, ductile plasticity, and structural changes in silicon. The MD simulation results show a unique phenomenon of brittle cracking typically inclined at an angle of 45°–55° to the cut surface, leading to the formation of periodic arrays of nanogrooves in monocrystalline silicon, which is a new insight into previously published results. Furthermore, during cutting, silicon is found to undergo solid-state directional amorphisation without prior Si–I to Si-II (beta tin) transformation, which is in direct contrast to many previously published MD studies on this topic. Our simulations also predict that the propensity for amorphisation is significantly higher in single crystal silicon than in polysilicon, signifying that grain boundaries eases the material removal process

Suppressing scratch-induced brittle fracture in silicon by geometric design modification of the abrasive grits

The overarching goal of this research was to investigate the application of spherically shaped abrasive particles in achieving ductile-mode cutting. Scratching experiments were carried out to assess the differences between arbitrarily and spherically shaped diamond and tungsten carbide (WC) grits in inducing brittle fracture or ductile plasticity in single-crystal silicon. It was observed that the arbitrarily shaped particles produce brittle fracture in contrast to the spherically shaped grits. The sharp edges and corners of grits result in high tensile stress-concentrated regions causing cracking and spalling. Contrary to this, spherically shaped WC particles induce uniform cutting pressure, which suppresses the extent of the brittle fracture and the mode of material removal was completely dominated by ductile-cutting until a threshold load for ductile-to-brittle transition (the first cracks appearance). These observations are expected to provide a suitable pathway in making the Diamond Wire Sawing machining operations more robust by providing a control on brittle damage