Silicon-Organic Hybrid (SOH) and Plasmonic-Organic Hybrid (POH) integration

Silicon-organic hybrid (SOH) and plasmonic-organic hybrid (POH) integration combines organic clectro-optic materials with silicon photonic and plasmonic waveguides, The concept enables fast and power-efficient modulators that support advanced modulation formats such as QPSK and 16QAM

Silicon-Organic Hybrid (SOH) and Plasmonic-Organic Hybrid (POH) integration

Silicon photonics offers tremendous potential for inexpensive high-yield photonic-electronic integration. Besides conventional dielectric waveguides, plasmonic structures can also be efficiently realized on the silicon photonic platform, reducing device footprint by more than an order of magnitude. However, nei-ther silicon nor metals exhibit appreciable second-order optical nonlinearities, thereby making efficient electro-optic modulators challenging to realize. These deficiencies can be overcome by the concepts of silicon-organic hybrid (SOH) and plasmonic-organic hybrid integration, which combine SOI waveguides and plasmonic nanostructures with organic electro-optic cladding materials

Plasmonic-organic hybrid (POH) modulators for OOK and BPSK signaling at 40 Gbit/s

We report on high-speed plasmonic-organic hybrid Mach-Zehnder modulators comprising ultra-compact phase shifters with lengths as small as 19 my m. Choosing an optimum phase shifter length of 29 my m, we demonstrate 40 Gbit/s on-off keying (OOK) modulation with direct detection and a BER < 6 x 10 -4. Furthermore, we report on a 29 my m long binary-phase shift keying (BPSK) modulator and show that it operates error-free (BER < 1 x 10 -10) at data rates up to 40 Gbit/s and with an energy consumption of 70 fJ/bit

Silicon-organic hybrid (SOH) integration and photonic multi-chip systems: Extending the capabilities of the silicon photonic platform

Limitations of silicon photonics can be overcome by hybrid integration or by photonic multi-chip systems. We give an overview on recent progress regarding silicon-organic hybrid (SOH) integration as well as multi-chip integration enabled by photonic wire bonding