889 research outputs found

    A test chip for automatic reliability measurements of interconnect vias

    Get PDF
    A test circuit for electromigration reliability measurements was designed and tested. The device under test (DUT) is a via-hole chain. The test circuit permits simultaneous measurements of a number of DUTs, and a fatal error of one DUT does not influence the measurement results of the other DUTs. Measurements require only a few measurement instruments. Comparing the measurement results of a single DUT io the measurement results of the test circuit shows that the test circuit may be used for reliability measurements

    The Detection of Defects in a Niobium Tri-layer Process

    Get PDF
    Niobium (Nb) LTS processes are emerging as the technology for future ultra high-speed systems especially in the digital domain. As the number of Josephson Junctions (JJ) per chip has recently increased to around 90000, the quality of the process has to be assured so as to realize these complex circuits. Until now, very little or no information is available in the literature on how to achieve this. In this paper we present an approach and results of a study conducted on an RSFQ process. Measurements and SEM inspection were carried out on sample chips and a list of possible defects has been identified and described in detail. We have also developed test-structures for detection of the top-ranking defects, which will be used for yield analysis and the determination of the probability distribution of faults in the process. A test chip has been designed, based on the results of this study, and certain types of defects were introduced in the design to study the behavior of faulty junctions and interconnections

    Dependability investigation of wireless short range embedded systems: hardware platform oriented approach

    Get PDF
    A new direction in short-range wireless applications has appeared in the form of high-speed data communication devices for distances of hundreds meters. Behind these embedded applications, a complex heterogeneous architecture is built. Moreover, these short range communications are introduced into critical applications, where the dependability/reliability is mandatory. Thus, dependability concerns around reliability evaluation become a major challenge in these systems, and pose several questions to answer. Obviously, in such systems, the attribute reliability has to be investigated for various components and at different abstraction levels. In this paper, we discuss the investigation of dependability in wireless short range systems. We present a hardware platform for wireless system dependability analysis as an alternative for the time consuming simulation techniques. The platform is built using several instances of one of the commercial FPGA platforms available on the market place. We describe the different steps of building the wireless hardware platform for short range systems dependability analysis. Then, we show how this HW platform based dependability investigation framework can be a very interactive approach. Based on this platform we introduce a new methodology and a flow to investigate the different parts of system dependability at different abstraction levels. The benefits to use the proposed framework are three fold: first, it takes care of the whole system (HW/SW -digital part, mixed RF part, and wireless part); Second, the hardware platform enables to explore the application’s reliability under real environmental conditions taking into account the effect of the environment threats on the system; And last, the wireless platform built for dependability investigation present a fast investigation approach in comparison with the time consuming co-simulation technique

    Structural testing of the HYPRES Niobium process

    Get PDF
    The HYPRES 3.0 ÎĽm niobium (Nb) process has proven to be capable of realizing complex low temperature superconductor (LTS) rapid single flux quantum (RSFQ) circuits. In such a mature fabrication process, the importance of the detection of random defects is crucial as they contribute to the majority of the defects occurring while processing the chips. The global low yield in superconductor electronics (SCE) is due to the fact that little is known about the defects and fault mechanisms occurring in Nb technology. This is, however, of crucial importance in realizing the required complex systems with yields required for commercial production. For this purpose, a structural testing approach has been applied to the HYPRES Nb process. As a result, we have developed test structures for the detection of random defects in the process. Test chips were realized in the process and measurements were carried out. Test results on the processed chips leading to defect statistics in the HYPRES Nb process are presented in this paper

    Relationship between bullet diameter and bullet defect diameter in human calvariums

    Get PDF
    Existing literature on the relationship between bullet diameter and bullet defect diameter in the human calvarium is summarized and discussed. The hypothesis, derived from the literature, that bullet deformation influences bullet defect diameter was studied in a small controlled experiment. The mean defect size caused by non-deforming projectiles was found to be smaller than the mean defect size caused by deforming projectiles of equal original mass and size. The p value of the difference between the two means, measured in two different ways, was found to be 0.002 for both in a Mann-Whitney U test and was significant if the confidence level is set at 5%

    Spectroscopy of a Cooper-Pair box in the Autler-Townes configuration

    Get PDF
    A theoretical spectroscopic analysis of a microwave driven superconducting charge qubit (Cooper-pair box coupled) to an RLC oscillator model is performed. By treating the oscillator as a probe through the backreaction effect of the qubit on the oscillator circuit, we extract frequency splitting features analogous to the Autler-Townes effect from quantum optics, thereby extending the analogies between superconducting and quantum optical phenomenology. These features are found in a frequency band that avoids the need for high frequency measurement systems and therefore may be of use in qubit characterization and coupling schemes. In addition we find this frequency band can be adjusted to suit an experimental frequency regime by changing the oscillator frequency.Comment: 13 pages, 7 figures. v2: Revised version after referee comments. Accepted for publication by Physical Review
    • …
    corecore