The Effect of Thin Film Adhesives on Mode II Interlaminar Fracture Toughness in Carbon Fiber Composites with Shape Memory Alloy Inserts

A single sheet of nickel-titanium (NiTi) shape memory alloy (SMA) was introduced within an IM7/8552 polymer matrix composite (PMC) panel in conjunction with multiple thin film adhesives to promote the interfacial bond strength between the SMA and PMC. End notched flexure (ENF) testing was performed in accordance to ASTM D7905 method for evaluation of mode II interlaminar fracture toughness (GIIC) of unidirectional fiber-reinforced polymer matrix composites. Acoustic emissions (AE) were monitored during testing with two acoustic sensors attached to the specimens. The composite panels examined using scanning electron microscopy techniques after part failure. GIIC values for the control composite samples were found to be higher than those of samples with embedded SMA sheets. The presence of adhesives bonded to SMA sheets further diminished the GIIC values. AE values revealed poor bonding of the panels, with little to no signals during testing

Effect of Thin-Film Adhesives on Mode II Interlaminar Fracture Toughness in Carbon Fiber Composites with Shape Memory Alloy Inserts

A single sheet of nickel-titanium (NiTi) shape memory alloy (SMA) was introduced within an IM7/8552 polymer matrix composite (PMC) panel in conjunction with multiple thin film adhesives to promote the interfacial bond strength between the SMA and PMC. End notched flexure (ENF) testing was performed in accordance to ASTM D7905 method for evaluation of mode II interlaminar fracture toughness (GIIC) of unidirectional fiber-reinforced polymer matrix composites. Acoustic emissions (AE) were monitored during testing with two acoustic sensors attached to the specimens. The composite panels were subjected to C-scan before testing, and examined using optical and scanning electron microscopy techniques after part failure. GIIC values for the control composite samples were found to be higher than those of samples with embedded SMA sheets. The presence of adhesives bonded to SMA sheets further diminished the GIIC values. AE values revealed poor bonding of the panels, with little to no signals during testing