9 research outputs found
Test beam performance of a CBC3-based mini-module for the Phase-2 CMS Outer Tracker before and after neutron irradiation
The Large Hadron Collider (LHC) at CERN will undergo major upgrades to increase the instantaneous luminosity up to 5–7.5×10 cms. This High Luminosity upgrade of the LHC (HL-LHC) will deliver a total of 3000–4000 fb-1 of proton-proton collisions at a center-of-mass energy of 13–14 TeV. To cope with these challenging environmental conditions, the strip tracker of the CMS experiment will be upgraded using modules with two closely-spaced silicon sensors to provide information to include tracking in the Level-1 trigger selection. This paper describes the performance, in a test beam experiment, of the first prototype module based on the final version of the CMS Binary Chip front-end ASIC before and after the module was irradiated with neutrons. Results demonstrate that the prototype module satisfies the requirements, providing efficient tracking information, after being irradiated with a total fluence comparable to the one expected through the lifetime of the experiment
Beam test performance of a prototype module with Short Strip ASICs for the CMS HL-LHC tracker upgrade
The Short Strip ASIC (SSA) is one of the four front-end chips designed for the upgrade of the CMS Outer Tracker for the High Luminosity LHC. Together with the Macro-Pixel ASIC (MPA) it will instrument modules containing a strip and a macro-pixel sensor stacked on top of each other. The SSA provides both full readout of the strip hit information when triggered, and, together with the MPA, correlated clusters called stubs from the two sensors for use by the CMS Level-1 (L1) trigger system. Results from the first prototype module consisting of a sensor and two SSA chips are presented. The prototype module has been characterized at the Fermilab Test Beam Facility using a 120 GeV proton beam
Evaluation of planar silicon pixel sensors with the RD53A readout chip for the Phase-2 Upgrade of the CMS Inner Tracker
The Large Hadron Collider at CERN will undergo an upgrade in order to increase its luminosity to 7.5 × 10³⁴ cm⁻²s⁻¹. The increased luminosity during this High-Luminosity running phase, starting around 2029, means a higher rate of proton-proton interactions, hence a larger ionizing dose and particle fluence for the detectors. The current tracking system of the CMS experiment will be fully replaced in order to cope with the new operating conditions. Prototype planar pixel sensors for the CMS Inner Tracker with square 50 μm × 50 μm and rectangular 100 μm × 25 μm pixels read out by the RD53A chip were characterized in the lab and at the DESY-II testbeam facility in order to identify designs that meet the requirements of CMS during the High-Luminosity running phase. A spatial resolution of approximately 3.4 μm (2 μm) is obtained using the modules with 50 μm × 50 μm (100 μm × 25 μm) pixels at the optimal angle of incidence before irradiation. After irradiation to a 1 MeV neutron equivalent fluence of Φeq = 5.3 × 10¹⁵ cm⁻², a resolution of 9.4 μm is achieved at a bias voltage of 800 V using a module with 50 μm × 50 μm pixel size. All modules retain a hit efficiency in excess of 99% after irradiation to fluences up to 2.1 × 10¹⁶ cm⁻². Further studies of the electrical properties of the modules, especially crosstalk, are also presented in this paper
Test beam performance of a CBC3-based mini-module for the Phase-2 CMS Outer Tracker before and after neutron irradiation
The Large Hadron Collider (LHC) at CERN will undergo major upgrades to increase the instantaneous luminosity up to 5-7.5 cms. This High Luminosity upgrade of the LHC (HL-LHC) will deliver a total of 3000-4000 fb of proton-proton collisions at a center-of-mass energy of 13-14 TeV. To cope with these challenging environmental conditions, the strip tracker of the CMS experiment will be upgraded using modules with two closely-spaced silicon sensors to provide information to include tracking in the Level-1 trigger selection. This paper describes the performance, in a test beam experiment, of the first prototype module based on the final version of the CMS Binary Chip front-end ASIC before and after the module was irradiated with neutrons. Results demonstrate that the prototype module satisfies the requirements, providing efficient tracking information, after being irradiated with a total fluence comparable to the one expected through the lifetime of the experiment
Beam test performance of a prototype module with Short Strip ASICs for the CMS HL-LHC tracker upgrade
The Short Strip ASIC (SSA) is one of the four front-end chips designed for the upgrade of the CMS Outer Tracker for the High Luminosity LHC. Together with the Macro-Pixel ASIC (MPA) it will instrument modules containing a strip and a macro-pixel sensor stacked on top of each other. The SSA provides both full readout of the strip hit information when triggered, and, together with the MPA, correlated clusters called stubs from the two sensors for use by the CMS Level-1 (L1) trigger system. Results from the first prototype module consisting of a sensor and two SSA chips are presented. The prototype module has been characterized at the Fermilab Test Beam Facility using a 120 GeV proton beam
Evaluation of HPK - planar pixel sensors for the CMS Phase-2 upgrade
To cope with the challenging environment of the planned high luminosity upgrade
of the Large Hadron Collider (HL-LHC), scheduled to start operation in 2029, CMS will replace its entire tracking system. The requirements for the tracker are largely determined by the long operation time of 10~years with an instantaneous peak luminosity of up to
~cms in the ultimate performance scenario.
Depending on the radial distance from the interaction point, the silicon sensors will receive a particle fluence corresponding to a non-ionizing energy loss of up to ~cm. This paper focuses on planar pixel sensor design and qualification up to a fluence of ~cm.
For the development of appropriate planar pixel
sensors an R\&D program was initiated, which includes - sensors on
150 mm (6'')
wafers with an active thickness of 150~m with pixel sizes of
~m and
~m manufactured by Hamamatsu Photonics K.K.\ (HPK). Single chip
modules with ROC4Sens and RD53A readout chips were made. Irradiation with protons and neutrons, as well was an extensive test beam campaign at DESY were carried out.
This paper presents the investigation of various assemblies mainly with ROC4Sens readout chips.
It demonstrates that
multiple designs fulfill the requirements
in terms of breakdown voltage, leakage current and efficiency. The single
point resolution for ~m pixels
is measured as 4.0~m for non-irradiated samples,
and 6.3~m after irradiation to ~cm.To cope with the challenging environment of the planned high luminosity upgrade of the Large Hadron Collider (HL-LHC), sched-
uled to start operation in 2029, CMS will replace its entire tracking system. The requirements for the tracker are largely determined
by the long operation time of 10 years with an instantaneous peak luminosity of up to 7.5 × 1034 cm−2 s−1 in the ultimate perfor-
mance scenario. Depending on the radial distance from the interaction point, the silicon sensors will receive a particle fluence
corresponding to a non-ionizing energy loss of up to Φeq = 3.5 × 1016 cm−2. This paper focuses on planar pixel sensor design and
qualification up to a fluence of Φeq = 1.4 × 1016 cm−2.
For the development of appropriate planar pixel sensors an R&D program was initiated, which includes n+-p sensors on 150 mm
(6”) wafers with an active thickness of 150 μm with pixel sizes of 100 × 25 μm2 and 50 × 50 μm2 manufactured by Hamamatsu.
Single chip modules with ROC4Sens and RD53A readout chips were made. Irradiation with protons and neutrons, as well was an
extensive test beam campaign at DESY were carried out. This paper presents the investigation of various assemblies mainly with
ROC4Sens readout chips. It demonstrates that multiple designs fulfill the requirements in terms of breakdown voltage, leakage
current and efficiency. The single point resolution for 50 × 50 μm2 pixels is measured as 4.0 μm for non-irradiated samples, and
6.3 μm after irradiation to Φeq = 7.2 × 1015 cm−2.To cope with the challenging environment of the planned high luminosity upgrade of the Large Hadron Collider (HL-LHC), scheduled to start operation in 2029, CMS will replace its entire tracking system. The requirements for the tracker are largely determined by the long operation time of 10 years with an instantaneous peak luminosity of up to 7.5 × 1034cm−2s−1 in the ultimate performance scenario. Depending on the radial distance from the interaction point, the silicon sensors will receive a particle fluence corresponding to a non-ionising energy loss of up to Φeq= 3.5 × 1016cm−2. This paper focuses on planar pixel sensor design and qualification up to a fluence of Φeq = 1.4 × 1016cm−2. For the development of appropriate planar pixel sensors an R&D program was initiated, which includes n+-p sensors on 150mm (6”) wafers with an active thickness of 150µm with pixel sizes of 100×25 µm2 and 50×50 µm2 manufactured by Hamamatsu Photonics K.K. (HPK). Single chip modules with ROC4Sens and RD53A readout chips were made. Irradiation with protons and neutrons, as well was an extensive test beam campaign at DESY were carried out. This paper presents the investigation of various assemblies mainly with ROC4Sens readout chips. It demonstrates that multiple designs fulfil the requirements in terms of breakdown voltage, leakage current and efficiency. The single point resolution for 50×50 µm2 pixels is measured as 4.0µm for non-irradiated samples, and 6.3µm after irradiation to Φeq = 7.2 × 1015cm−2
Evaluation of HPK - planar pixel sensors for the CMS Phase-2 upgrade
International audienceTo cope with the challenging environment of the planned high luminosity upgrade of the Large Hadron Collider (HL-LHC), sched-uled to start operation in 2029, CMS will replace its entire tracking system. The requirements for the tracker are largely determinedby the long operation time of 10 years with an instantaneous peak luminosity of up to 7.5 × 1034 cm−2 s−1 in the ultimate perfor-mance scenario. Depending on the radial distance from the interaction point, the silicon sensors will receive a particle fluencecorresponding to a non-ionizing energy loss of up to Φeq = 3.5 × 1016 cm−2. This paper focuses on planar pixel sensor design andqualification up to a fluence of Φeq = 1.4 × 1016 cm−2.For the development of appropriate planar pixel sensors an R&D program was initiated, which includes n+-p sensors on 150 mm(6”) wafers with an active thickness of 150 μm with pixel sizes of 100 × 25 μm2 and 50 × 50 μm2 manufactured by Hamamatsu.Single chip modules with ROC4Sens and RD53A readout chips were made. Irradiation with protons and neutrons, as well was anextensive test beam campaign at DESY were carried out. This paper presents the investigation of various assemblies mainly withROC4Sens readout chips. It demonstrates that multiple designs fulfill the requirements in terms of breakdown voltage, leakagecurrent and efficiency. The single point resolution for 50 × 50 μm2 pixels is measured as 4.0 μm for non-irradiated samples, and6.3 μm after irradiation to Φeq = 7.2 × 1015 cm−2
Beam test performance of a prototype module with Short Strip ASICs for the CMS HL-LHC tracker upgrade
International audienceThe Short Strip ASIC (SSA) is one of the four front-endchips designed for the upgrade of the CMS Outer Tracker for the HighLuminosity LHC. Together with the Macro-Pixel ASIC (MPA) it willinstrument modules containing a strip and a macro-pixel sensorstacked on top of each other. The SSA provides both full readout ofthe strip hit information when triggered, and, together with theMPA, correlated clusters called stubs from the two sensors for useby the CMS Level-1 (L1) trigger system. Results from the firstprototype module consisting of a sensor and two SSA chips arepresented. The prototype module has been characterized at theFermilab Test Beam Facility using a 120 GeV proton beam