Size dependence of second-order hyperpolarizability of finite periodic chain under Su-Schrieffer-Heeger model

The second hyperpolarizability $\gamma_N(-3\omega\omega,\omega,\omega)$ of $N$ double-bond finite chain of trans-polyactylene is analyzed using the Su-Schrieffer-Heeger model to explain qualitative features of the size-dependence behavior of $\gamma_N$. Our study shows that $\gamma_N/N$ is {\it nonmonotonic} with $N$ and that the nonmonotonicity is caused by the dominant contribution of the intraband transition to $\gamma_N$ in polyenes. Several important physical effects are discussed to reduce quantitative discrepancies between experimental and our resultsComment: 3 figures, 1 tabl

Characterization Of Thermal Stresses And Plasticity In Through-Silicon Via Structures For Three-Dimensional Integration

Through-silicon via (TSV) is a critical element connecting stacked dies in three-dimensional (3D) integration. The mismatch of thermal expansion coefficients between the Cu via and Si can generate significant stresses in the TSV structure to cause reliability problems. In this study, the thermal stress in the TSV structure was measured by the wafer curvature method and its unique stress characteristics were compared to that of a Cu thin film structure. The thermo-mechanical characteristics of the Cu TSV structure were correlated to microstructure evolution during thermal cycling and the local plasticity in Cu in a triaxial stress state. These findings were confirmed by microstructure analysis of the Cu vias and finite element analysis (FEA) of the stress characteristics. In addition, the local plasticity and deformation in and around individual TSVs were measured by synchrotron x-ray microdiffraction to supplement the wafer curvature measurements. The importance and implication of the local plasticity and residual stress on TSV reliabilities are discussed for TSV extrusion and device keep-out zone (KOZ).Microelectronics Research Cente

Olig2/Plp-positive progenitor cells give rise to Bergmann glia in the cerebellum.

NG2 (nerve/glial antigen2)-expressing cells represent the largest population of postnatal progenitors in the central nervous system and have been classified as oligodendroglial progenitor cells, but the fate and function of these cells remain incompletely characterized. Previous studies have focused on characterizing these progenitors in the postnatal and adult subventricular zone and on analyzing the cellular and physiological properties of these cells in white and gray matter regions in the forebrain. In the present study, we examine the types of neural progeny generated by NG2 progenitors in the cerebellum by employing genetic fate mapping techniques using inducible Cre-Lox systems in vivo with two different mouse lines, the Plp-Cre-ER(T2)/Rosa26-EYFP and Olig2-Cre-ER(T2)/Rosa26-EYFP double-transgenic mice. Our data indicate that Olig2/Plp-positive NG2 cells display multipotential properties, primarily give rise to oligodendroglia but, surprisingly, also generate Bergmann glia, which are specialized glial cells in the cerebellum. The NG2+ cells also give rise to astrocytes, but not neurons. In addition, we show that glutamate signaling is involved in distinct NG2+ cell-fate/differentiation pathways and plays a role in the normal development of Bergmann glia. We also show an increase of cerebellar oligodendroglial lineage cells in response to hypoxic-ischemic injury, but the ability of NG2+ cells to give rise to Bergmann glia and astrocytes remains unchanged. Overall, our study reveals a novel Bergmann glia fate of Olig2/Plp-positive NG2 progenitors, demonstrates the differentiation of these progenitors into various functional glial cell types, and provides significant insights into the fate and function of Olig2/Plp-positive progenitor cells in health and disease

Magnetization Losses in Multifilament Coated Superconductors

We report the results of a study of the magnetization losses in experimental multifilament, as well as control (uniform), coated superconductors exposed to time-varying magnetic field of various frequencies. Both the hysteresis loss, proportional to the sweep rate of the applied magnetic field, and the coupling loss, proportional to the square of the sweep rate, have been observed. A scaling is found that allows us to quantify each of these contributions and extrapolate the results of the experiment beyond the envelope of accessible field amplitude and frequency. The combined loss in the multifilament conductor is reduced by about 90% in comparison with the uniform conductor at full field penetration at sweep rate as high as 3T/s

Thermomechanical Characterization And Modeling For TSV Structures

Continual scaling of devices and on-chip wiring has brought significant challenges for materials and processes beyond the 32-nm technology node in microelectronics. Recently, three-dimensional (3-D) integration with through-silicon vias (TSVs) has emerged as an effective solution to meet the future technology requirements. Among others, thermo-mechanical reliability is a key concern for the development of TSV structures used in die stacking as 3-D interconnects. This paper presents experimental measurements of the thermal stresses in TSV structures and analyses of interfacial reliability. The micro-Raman measurements were made to characterize the local distribution of the near-surface stresses in Si around TSVs. On the other hand, the precision wafer curvature technique was employed to measure the average stress and deformation in the TSV structures subject to thermal cycling. To understand the elastic and plastic behavior of TSVs, the microstructural evolution of the Cu vias was analyzed using focused ion beam (FIB) and electron backscattering diffraction (EBSD) techniques. Furthermore, the impact of thermal stresses on interfacial reliability of TSV structures was investigated by a shear-lag cohesive zone model that predicts the critical temperatures and critical via diameters.Microelectronics Research Cente

Transfer Learning for Content-Based Recommender Systems using Tree Matching

In this paper we present a new approach to content-based transfer learning for solving the data sparsity problem in cases when the users' preferences in the target domain are either scarce or unavailable, but the necessary information on the preferences exists in another domain. We show that training a system to use such information across domains can produce better performance. Specifically, we represent users' behavior patterns based on topological graph structures. Each behavior pattern represents the behavior of a set of users, when the users' behavior is defined as the items they rated and the items' rating values. In the next step we find a correlation between behavior patterns in the source domain and behavior patterns in the target domain. This mapping is considered a bridge between the two domains. Based on the correlation and content-attributes of the items, we train a machine learning model to predict users' ratings in the target domain. When we compare our approach to the popularity approach and KNN-cross-domain on a real world dataset, the results show that on an average of 83$$ of the cases our approach outperforms both methods

Prescribed pattern transformation in swelling gel tubes by elastic instability

We present a study on swelling-induced circumferential buckling of tubular shaped gels. Inhomogeneous stress develops as gel swells under mechanical constraints, which gives rise to spontaneous buckling instability without external force. Full control over the post-buckling pattern is experimentally demonstrated. A simple analytical model is developed using elastic energy to predict stability and post-buckling patterns upon swelling. Analysis reveals that height to diameter ratio is the most critical design parameter to determine buckling pattern, which agrees well with experimental and numerical results.Comment: 32 pages, 7 figure