Developing IoT applications in the Fog:a distributed dataflow approach

In this paper we examine the development of IoT applications from the perspective of the Fog Computing paradigm, where computing infrastructure at the network edge in devices and gateways is leverage for efficiency and timeliness. Due to the intrinsic nature of the IoT: heterogeneous devices/resources, a tightly coupled perception-action cycle and widely distributed devices and processing, application development in the Fog can be challenging. To address these challenges, we propose a Distributed Dataflow (DDF) programming model for the IoT that utilises computing infrastructures across the Fog and the Cloud. We evaluate our proposal by implementing a DDF framework based on Node-RED (Distributed Node-RED or D-NR), a visual programming tool that uses a flow-based model for building IoT applications. Via demonstrations, we show that our approach eases the development process and can be used to build a variety of IoT applications that work efficiently in the Fog

TOPS - designing digital tools for personal and social interaction

Peer reviewedPublisher PD

Wafer-Level Parylene Packaging With Integrated RF Electronics for Wireless Retinal Prostheses

This paper presents an embedded chip integration technology that incorporates silicon housings and flexible Parylene-based microelectromechanical systems (MEMS) devices. Accelerated-lifetime soak testing is performed in saline at elevated temperatures to study the packaging performance of Parylene C thin films. Experimental results show that the silicon chip under test is well protected by Parylene, and the lifetime of Parylenecoated metal at body temperature (37°C) is more than 60 years, indicating that Parylene C is an excellent structural and packaging material for biomedical applications. To demonstrate the proposed packaging technology, a flexible MEMS radio-frequency (RF) coil has been integrated with an RF identification (RFID) circuit die. The coil has an inductance of 16 μH with two layers of metal completely encapsulated in Parylene C, which is microfabricated using a Parylene–metal–Parylene thin-film technology. The chip is a commercially available read-only RFID chip with a typical operating frequency of 125 kHz. The functionality of the embedded chip has been tested using an RFID reader module in both air and saline, demonstrating successful power and data transmission through the MEMS coil

High-resolution in situ observations of electron precipitation-causing EMIC waves

Electromagnetic ion cyclotron (EMIC) waves are thought to be important drivers of energetic electron losses from the outer radiation belt through precipitation into the atmosphere. While the theoretical possibility of pitch angle scattering-driven losses from these waves has been recognized for more than four decades, there have been limited experimental precipitation observations to support this concept. We have combined satellite-based observations of the characteristics of EMIC waves, with satellite and ground-based observations of the EMIC-induced electron precipitation. In a detailed case study, supplemented by an additional four examples, we are able to constrain for the first time the location, size, and energy range of EMIC-induced electron precipitation inferred from coincident precipitation data and relate them to the EMIC wave frequency, wave power, and ion band of the wave as measured in situ by the Van Allen Probes. These observations will better constrain modeling into the importance of EMIC wave-particle interactions