Anisotropy of free-carrier absorption and diffusivity in m-plane GaN

Polarization-dependent free-carrier absorption (FCA) in bulk m-plane GaN at 1053 nm revealed approximately 6 times stronger hole-related absorption for E⊥c than for E||c probe polarization both at low and high carrier injection levels. In contrast, FCA at 527 nm was found isotropic at low injection levels due to electron resonant transitions between the upper and lower conduction bands, whereas the anisotropic impact of holes was present only at high injection levels by temporarily blocking electron transitions. Carrier transport was also found to be anisotropic under two-photon excitation, with a ratio of 1.17 for diffusivity perpendicular and parallel to the c-axis

On carrier spillover in c- and m-plane InGaN light emitting diodes

The internal quantum efficiency(IQE) and relative external quantum efficiency (EQE) in InGaNlight-emitting diodes(LEDs) emitting at 400 nm with and without electron blocking layers (EBLs) on c-plane GaN and m-plane GaN were investigated in order to shed some light on any effect of polarizationcharge induced field on efficiency killer carrier spillover. Without an EBL the EQE values suffered considerably (by 80%) for both orientations, which is clearly attributable to carrier spillover. Substantial carrier spillover in both polarities, therefore, suggests that the polarizationcharge is not the major factor in efficiency degradation observed, particularly at high injection levels. Furthermore, the m-plane variety with EBL did not show any discernable efficiency degradation up to a maximum current density of 2250 A cm−2 employed while that on c-plane showed a reduction by ∼40%. In addition, IQE of m-plane LED structure determined from excitation power dependent photoluminescence was ∼80% compared to 50% in c-plane LEDs under resonant and moderate excitation condition. This too is indicative of the superiority of m-plane LED structures, most probably due to relatively larger optical matrix elements for m-plane orientation

Efficiency retention at high current injection levels in m-plane InGaN light emitting diodes

We investigated the internal quantum efficiency (IQE) and the relative external quantum efficiency (EQE) of m-plane InGaN light emitting diodes(LEDs) grown on m-plane freestanding GaN emitting at ∼400 nm for current densities up to 2500 A/cm2. IQE values extracted from intensity and temperature dependent photoluminescencemeasurements were consistently higher, by some 30%, for the m-plane LEDs than for reference c-plane LEDs having the same structure, e.g., 80% versus 60% at an injected steady-state carrier concentration of 1.2×1018 cm−3. With increasing current injection up to 2500 A/cm2, the maximum EQE is nearly retained in m-plane LEDs, whereas c-plane LEDs exhibit approximately 25% droop. The negligible droop in m-plane LEDs is consistent with the reported enhanced hole carrier concentration and light holes in m-plane orientation, thereby enhanced hole transport throughout the active region, and lack of polarization induced field. A high quantum efficiency and in particular its retention at high injection levels bode well for m-plane LEDs as candidates for general lighting applications

Carrier velocity in InAlN/AlN/GaN heterostructure field effect transistors on Fe-doped bulk GaN substrates

We report microwave characteristics of field effect transistors employing InAlN/AlN/GaN heterostructures grown on low-defect-density bulk Fe-doped GaN substrates. We achieved unity current gain cutoff frequencies of 14.3 and 23.7 GHz for devices with gate lengths of 1 and 0.65 μm, respectively. Measurements as a function of applied bias allow us to estimate the average carrier velocity in the channel to be ∼1.0×107 cm/sec for a 1 μm device. Additionally, we found nearly no gate lag in the devices, which is considered a precondition for good performance under large signal operation

InGaN staircase electron injector for reduction of electron overflow in InGaN light emitting diodes

Ballistic and quasiballistic electron transport across the active InGaN layer are shown to be responsible for electron overflow and electroluminescence efficiency droop at high current levels in InGaN light emitting diodes both experimentally and by first-order calculations. An InGaN staircase electron injector with step-like increased In composition, an “electron cooler,” is proposed for an enhanced thermalization of the injected hot electrons to reduce the overflow and mitigate the efficiency droop. The experimental data show that the staircase electron injector results in essentially the same electroluminescence performance for the diodes with and without an electron blocking layer, confirming substantial electron thermalization. On the other hand, if no InGaN staircase electron injector is employed, the diodes without the electron blocking layer have shown significantly lower (three to five times) electroluminescence intensity than the diodes with the blocking layer. These results demonstrate a feasible method for the elimination of electron overflow across the active region, and therefore, the efficiency droop in InGaN light emitting diodes

Internal quantum efficiency of c-plane InGaN and m-plane InGaN on Si and GaN

We investigated internal quantum efficiency (IQE) of polar (0001) InGaN on c-sapphire, and (11¯00) nonpolar m-plane InGaN on both m-plane GaN and specially patterned Si. The IQE values were extracted from the resonant photoluminescence intensity versus the excitation power. Data indicate that at comparable generatedcarrier concentrations the efficiency of the m-plane InGaN on patterned Si is approximately a factor of 2 higher than that of the highly optimized c-plane layer. At the highest laser excitation employed (∼1.2×1018 cm−3), the IQE of m-plane InGaN double heterostructure on Si is approximately 65%. We believe that the m-plane would remain inherently advantageous, particularly at high electrical injection levels, even with respect to highly optimized c-plane varieties. The observations could be attributed to the lack of polarization induced field and the predicted increased optical matrix elements in m-plane orientation

Effect of hot phonon lifetime on electron velocity in InAlN/AlN/GaN heterostructure field effect transistors on bulk GaN substrates

We report on electron velocities deduced from current gain cutoff frequency measurements on GaN heterostructurefield effect transistors(HFETs) with InAlN barriers on Fe-doped semi-insulating bulk GaN substrates. The intrinsic transit time is a strong function of the applied gate bias, and a minimum intrinsic transit time occurs for gate biases corresponding to two-dimensional electron gas densities near 9.3×1012 cm−2. This value correlates with the independently observed density giving the minimum longitudinal optical phonon lifetime. We expect the velocity, which is inversely proportional to the intrinsic transit time, to be limited by scattering with non equilibrium (hot) phonons at the high fields present in the HFET channel, and thus, we interpret the minimum intrinsic transit time in terms of the hot phonon decay. At the gate bias associated with the minimum transit time, we determined the average electron velocity for a 1.1 μm gate length device to be 1.75±0.1×107 cm/sec

Anisotropic strain and phonon deformation potentials in GaN

We report optical phonon frequency studies in anisotropically strained c-plane- and a-plane-oriented GaN films by generalized infrared spectroscopic ellipsometry and Raman scattering spectroscopy. The anisotropic strain in the films is obtained from high-resolution x-ray diffraction measurements. Experimental evidence for splitting of the GaN E1(TO), E1(LO), and E2 phonons under anisotropic strain in the basal plane is presented, and their phonon deformation potentials cE1(TO) , cE1(LO) , and cE2 are determined. A distinct correlation between anisotropic strain and the A1(TO) and E1(LO) frequencies of a-plane GaN films reveals theaA1TO, bA1TO, aE1LO, andbE1LO phonon deformation potentials. The aA1TO and bA1TOaA1TO and aE1LO phonon deformation potentials agree well with recently reported theoretical estimations [J.-M. Wagner and F. Bechstedt, Phys. Rev. B 66, 115202 (2002)], while bA1TO and bE1LO are found to be significantly larger than the theoretical values. A discussion of the observed differences is presented

Reliability of AlGaN/GaN high electron mobility transistors on low dislocation density bulk GaN substrate: Implications of surface step edges

To enable gaining insight into degradation mechanisms of AlGaN/GaN high electron mobility transistors, devices grown on a low-dislocation-density bulk-GaN substrate were studied. Gateleakage current and electroluminescence (EL) monitoring revealed a progressive appearance of EL spots during off-state stress which signify the generation of gate current leakage paths.Atomic force microscopy evidenced the formation of semiconductor surface pits at the failure location, which corresponds to the interaction region of the gate contact edge and the edges ofsurface steps