The complex DSC analysis of the first crystallization peak of Fe80Si10B10 metallic glass

The crystallization of Fe-80 Si-10 B-10 glass was studied both by linear heating and isothermal differential scanning calorimetry (DSC). Two well separated crystallization peaks were always observed. On the basis of the classical isothermal Johnson-Mehl-Avrami (JMA) procedure both transient nucleation and transient growth kinetics with the complex exponent n similar to 2.8 and mean activation energy E(JMA)* = 323 kJ mol(-1) were determined for the first crystallization peak. Because for the degree of conversion alpha > 0.55 E *(alpha) dependence was observed, the deconvolution of the isothermal peak into the subsequent JMA nucleation-and-growth and grain-growth effects was used to fit the measured data. Simple JMA kinetics could not be determined for the linear heating first crystallization peak. All these results correlate with structural analysis studies

The influence of silver content on structure and properties of Sn-Bi-Ag solder and Cu/solder/Cu joints

The authors gratefully acknowledge the financial support of the Slovak Grant Agency under the Contracts VEGA 2/6160/26 and 2/0111/11. This work was also supported by the Slovak Research and Development Agency under the Contracts APVV-0102-07, APVV-0076-11, APVV-0492-11 and APVV-SK-UA-0043-09 and by CEX FUN-MAT. V.S. gratefully acknowledges the fellowship of the Slovak Academic Information Agency. This research contributes to the European COST Action MP0602 on Advanced Solder Materials for High Temperature Applications.The effect of silver content on structure and properties of Sn100-xBi10Agx (x=3-10 at%) lead-free solder and Cu-solder-Cu joints was investigated. The microstructure of the solder in both bulk and rapidly solidified ribbon forms was analyzed by scanning electron microscopy (SEM) and X-ray diffraction. The peculiarities in melting kinetic, studied by differential scanning calorimetry (DSC), and silver influence on it are described and discussed. The wetting of a copper substrate was examined by the sessile drop method in the temperature range of 553-673 K in air and deoxidizing gas (N-2+10%H-2) at atmospheric pressure. Cu-solder-Cu joints were also prepared in both atmospheres, and their shear strength was measured by the push-off method. The produced solders consisted of tin, bismuth and Ag3Sn phases. The product of the interaction between the solder and the copper substrate consists of two phases: Cu3Sn, which is adjacent to the substrate, and a Cu6Sn5 phase. The wetting angle in air increased slightly as the silver concentration in the solder increased. Wetting of the copper substrate in N-2+10H(2) gas shows the opposite tendency: the wetting angle slightly decreased as the silver content in the solder increased. The shear strength of the joints prepared in air (using flux) tends to decrease with increasing production temperature and increasing silver content in the solder. The equivalent decrease in the shear strength of the joints prepared in N-2+10H(2) is more apparent. (C) 2013 Elsevier B.V. All rights reserved

The influence of silver content on structure and properties of Sn-Bi-Ag solder and Cu/solder/Cu joints

The authors gratefully acknowledge the financial support of the Slovak Grant Agency under the Contracts VEGA 2/6160/26 and 2/0111/11. This work was also supported by the Slovak Research and Development Agency under the Contracts APVV-0102-07, APVV-0076-11, APVV-0492-11 and APVV-SK-UA-0043-09 and by CEX FUN-MAT. V.S. gratefully acknowledges the fellowship of the Slovak Academic Information Agency. This research contributes to the European COST Action MP0602 on Advanced Solder Materials for High Temperature Applications.The effect of silver content on structure and properties of Sn100-xBi10Agx (x=3-10 at%) lead-free solder and Cu-solder-Cu joints was investigated. The microstructure of the solder in both bulk and rapidly solidified ribbon forms was analyzed by scanning electron microscopy (SEM) and X-ray diffraction. The peculiarities in melting kinetic, studied by differential scanning calorimetry (DSC), and silver influence on it are described and discussed. The wetting of a copper substrate was examined by the sessile drop method in the temperature range of 553-673 K in air and deoxidizing gas (N-2+10%H-2) at atmospheric pressure. Cu-solder-Cu joints were also prepared in both atmospheres, and their shear strength was measured by the push-off method. The produced solders consisted of tin, bismuth and Ag3Sn phases. The product of the interaction between the solder and the copper substrate consists of two phases: Cu3Sn, which is adjacent to the substrate, and a Cu6Sn5 phase. The wetting angle in air increased slightly as the silver concentration in the solder increased. Wetting of the copper substrate in N-2+10H(2) gas shows the opposite tendency: the wetting angle slightly decreased as the silver content in the solder increased. The shear strength of the joints prepared in air (using flux) tends to decrease with increasing production temperature and increasing silver content in the solder. The equivalent decrease in the shear strength of the joints prepared in N-2+10H(2) is more apparent. (C) 2013 Elsevier B.V. All rights reserved