ПРОЕКТИРОВАНИЕ IGBT-ПРИБОРА ВЫСОКОГО БЫСТРОДЕЙСТВИЯ

Results of the investigation of IGBT manufacturing technology parameters influence on its dynamic features are presented. The important role of impurities concentration in various parts of IGBT structure (concentration level in the emitter of the bipolar transistor as apart of the IGBT structure, implantation dose in the MOS channel, the energy of ions implanted in the base of the bipolar transistor) was shown. These effects are discussed with the standpoint of dynamic characteristics of charge carriers. It was discovered that the level of impurity concentration in the emitter does not affect on the device dynamic features and reveals only small influence from the level of impurity concentration in the base. More effect is determined by the dose and energy of implanted ions under the doping of the MOS channel: the two-time dose increasing leads 20 % decreasing of switch on and switch off times of IGBT and the 20 % increasing of the ion energy leads to 25 % increasing of output impulse duration.Представлены результаты исследования влияния технологических параметров формирования структуры IGBT-прибора на его динамические характеристики. Показано, что быстродействие (время включения и выключения) структуры существенно определяется технологическими параметрами формирования как биполярного транзистора, так и МОП-транзистора - составляющих элементов IGBT-прибора. Показано, что на быстродействие прибора не влияет уровень концентрации примеси в эмиттере биполярного транзистора и проявляется лишь небольшое влияние степени легирования базы. В большей мере динамические характеристики IGBT-структуры определяются дозой и энергией ионов при имплантационном подлегировании области канала МОП-транзистора (при увеличении дозы в 2 раза время включения и выключения снижаются почти на 20 % каждое, а при увеличении энергии ионов на 20 % длительность выходного импульса увеличивается почти на 25 %)

DESIGN OF HIGH-SPEED IGBT DEVICE

Results of the investigation of IGBT manufacturing technology parameters influence on its dynamic features are presented. The important role of impurities concentration in various parts of IGBT structure (concentration level in the emitter of the bipolar transistor as apart of the IGBT structure, implantation dose in the MOS channel, the energy of ions implanted in the base of the bipolar transistor) was shown. These effects are discussed with the standpoint of dynamic characteristics of charge carriers. It was discovered that the level of impurity concentration in the emitter does not affect on the device dynamic features and reveals only small influence from the level of impurity concentration in the base. More effect is determined by the dose and energy of implanted ions under the doping of the MOS channel: the two-time dose increasing leads 20 % decreasing of switch on and switch off times of IGBT and the 20 % increasing of the ion energy leads to 25 % increasing of output impulse duration

Insulated-gate bipolar transistor formed in the bulk silicon and using «Silicon on insulator» technology

Представлены результаты оптимизации конструктивно-технологических параметров приборных структур биполярного транзистора с изолированным затвором (БТИЗ), сформированного в стандартном кремнии и по технологии «Кремний на изоляторе» (КНИ). Рассмотрены особенности функционирования различных конструктивных решений БТИЗ. Предложена и исследована конструкция БТИЗ на КНИ структуре с несколькими затворами, что обеспечивает ступенчатое изменение коммутируемого тока.The results of the optimization of design and technological parameters device structures insulated- gate bipolar transistor (IGBT), formed in bulk silicon and using «Silicon on Insulator» (SOI) technology are presented. The specific features of the functioning of various constructive solutions IGBT are studied. A construction of SOI-IGBT structure with multiple gates, which allows a step change in the switched current, is suggested and investigated

Statistical analysis and optimization of igbt manufacturing flow

The use of computer simulation, design and optimization of power electronic devices formation technological processes can significantly reduce development time, improve the accuracy of calculations, choose the best options for implementation based on strict mathematical analysis. One of the most common power electronic devices is isolated gate bipolar transistor (IGBT), which combines the advantages of MOSFET and bipolar transistor. The achievement of high requirements for these devices is only possible by optimizing device design and manufacturing process parameters. Therefore important and necessary step in the modern cycle of IC design and manufacturing is to carry out the statistical analysis. Procedure of the IGBT threshold voltage optimization was realized. Through screening experiments according to the Plackett-Burman design the most important input parameters (factors) that have the greatest impact on the output characteristic was detected. The coefficients of the approximation polynomial adequately describing the relationship between the input parameters and investigated output characteristics ware determined. Using the calculated approximation polynomial, a series of multiple, in a cycle of Monte Carlo, calculations to determine the spread of threshold voltage values at selected ranges of input parameters deviation were carried out. Combinations of input process parameters values were determined randomly by a normal distribution within a given range of changes. The procedure of IGBT process parameters optimization consist a mathematical problem of determining the value range of the input significant structural and technological parameters providing the change of the IGBT threshold voltage in a given interval. The presented results demonstrate the effectiveness of the proposed optimization techniques

Insulated-gate bipolar transistor formed in the bulk silicon and using «Silicon on insulator» technology

Представлены результаты оптимизации конструктивно-технологических параметров приборных структур биполярного транзистора с изолированным затвором (БТИЗ), сформированного в стандартном кремнии и по технологии «Кремний на изоляторе» (КНИ). Рассмотрены особенности функционирования различных конструктивных решений БТИЗ. Предложена и исследована конструкция БТИЗ на КНИ структуре с несколькими затворами, что обеспечивает ступенчатое изменение коммутируемого тока.The results of the optimization of design and technological parameters device structures insulated- gate bipolar transistor (IGBT), formed in bulk silicon and using «Silicon on Insulator» (SOI) technology are presented. The specific features of the functioning of various constructive solutions IGBT are studied. A construction of SOI-IGBT structure with multiple gates, which allows a step change in the switched current, is suggested and investigated