Pairwise Force SPH Model for Real-Time Multi-Interaction Applications

In this paper, we present a novel pairwise-force smoothed particle hydrodynamics (PF-SPH) model to allow modeling of various interactions at interfaces in real time. Realistic capture of interactions at interfaces is a challenging problem for SPH-based simulations, especially for scenarios involving multiple interactions at different interfaces. Our PF-SPH model can readily handle multiple kinds of interactions simultaneously in a single simulation; its basis is to use a larger support radius than that used in standard SPH. We adopt a novel anisotropic filtering term to further improve the performance of interaction forces. The proposed model is stable; furthermore, it avoids the particle clustering problem which commonly occurs at the free surface. We show how our model can be used to capture various interactions. We also consider the close connection between droplets and bubbles, and show how to animate bubbles rising in liquid as well as bubbles in air. Our method is versatile, physically plausible and easy-to-implement. Examples are provided to demonstrate the capabilities and effectiveness of our approach

Effects of recombinant adenovirus-mediated hypoxia-inducible factor-1alpha gene on proliferation and differentiation of endogenous neural stem cells in rats following intracerebral hemorrhage

AbstractObjectiveTo investigate the effects of adenovirus (Ad)-mediated hypoxia-inducible factor-1alpha (HIF-1α) gene on proliferation and differentiation of endogenous neural stem cells (NSCs) in rats following intracerebral hemorrhage (ICH) and the underlying mechanisms.MethodsA total of 120 specific pathogen-free, adult, male Sprague-Dawley rats were included in this study. After establishment of ICH models in rats, PBS, Ad, or Ad-HIF-1α was administered via the ischemic ventricle. On the 1st, 7th, 14th, 21st and 28th d after ICH, rat neurological deficits were scored, doublecortin (DCX) expression in the subventricular zone cells was detected by immunohistochemical staining, and 5-bromo-2'-deoxyuridine (BrdU)-, BrdU/DCX-, and BrdU/glial fibrillary acidic protein-positive cells in the subventricular zone were counted using immumofluorescence method among PBS, Ad, and Ad-HIF-1α groups.ResultsOn the 7th, 14th, 21st and 28th d after ICH, neurological deficit scores in the Ad-HIF-1α group were significantly lower than in the PBS and Ad groups (P<0.05). In the Ad-HIF-1α group, DCX expression was significantly increased on the 7th d, peaked on the 14th d, and then gradually decreased. In the Ad-HIF-1α group, BrdU-positive cells were significantly increased over time course, and significant difference in BrdU-positive cell counts was observed when compared with the PBS and Ad groups at each time point (P<0.01 or 0.05). On the 7th, 14th, 21st and 28th d after ICH, the number of DCX-, BrdU-, BrdU/DCX-, and BrdU/DCX-positive cells in the Ad-HIF-1α group was significantly greater than in the PBS and Ad groups (P<0.05).ConclusionsHIF-1α gene can promote the proliferation, migration and differentiation of endogenous neural stem cells after ICH, thereby contributing to neurofunctional recovery after ICH

Dynamic Finite Element Analysis on Underlay Microstructure of Cu/low-k Wafer during Wirebonding

The aim of present research is to investigate dynamic stress analysis for microstructure of Cu/Low-K wafer subjected to wirebonding predicted by finite element software ANSYS/LS-DYNA. Two major analyses are conducted in the present research. In the first, the characteristic of heat affected zone (HAZ) and free air ball (FAB) on ultra thin Au wire have been carefully experimental measured. Secondary, the dynamic response on Al pad/beneath the pad of Cu/low-K wafer during wirebonding process has been successfully predicted by finite element analysis (FEA). Tensile mechanical properties of ultra thin wire before/after electric flame-off (EFO) process have been investigated by self-design pull test fixture. The experimental obtained hardening value has significantly influence on localize stressed area on Al pad. This would result in Al pad squeezing around the smashed FAB during impact stage and the consequent thermosonic vibration stage. Microstructure of FAB and HAZ are also carefully measured by micro/nano indentation instruments. All the measured data serves as material inputs for the FEA explicit software ANSYS/LS-DYNA. Because the crack of low-k layer and delamination of copper via are observed, dynamic transient analysis is performed to inspect the overall stress/strain distributions on the microstructure of Cu/low-k wafer. Special emphasizes are focused on the copper via layout and optimal design of Cu/low-k microstructure. It is also shown that the Al pad can be replaced by Al-Cu alloy pad or Cu pad to avoid large deformation on pad and cracking beneath the surface. A series of comprehensive experimental works and FEA predictions have been performed to increase bondability and reliability in this study