19 research outputs found

    Superconductivity devices: Commercial use of space

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    High T sub C superconducting thick film were prepared by a screen printing process. Y-based (YBa2Cu3O(7-x) superconducting thick film were printed on 211/Al2O3, SNT/Al2O3, and YSZ substrates. Because of poor adhesion of the superconductor thick films to 211/Al2O3 and SNT/Al2O3 substrates, relatively low T sub C and J sub C values were obtained from the films printed on these substrates. Critical temperatures (T sub C) of YBa2Cu3O(7-x) thick films deposited on 211/Al2O3 and SNT/Al2O3 substrates were about 80 K. The critical current densities (J sub C) of these films were less than 2 A/sq cm. Higher T sub C and J sub C YBa2Cu3O(7-x) thick films were printed on YSZ substrates. A YBa2Cu3O(7-x) thick film with T sub C=86.4 and J sub C= 50.4 A/sq cm was prepared by printing the film on YSZ substrate and firing at 990 C for 10 minutes. Multiple-lead samples were also prepared on the YSZ substrates. The multiple-lead samples showed lower T sub C and/or J sub C values than those of the plain samples. The electrical properties of YBa2Cu3O(7-x) thick films were determined by the microstructures of the films. The YBa2Cu3O(7-x) thick films printed on the YSZ substrates, which had the best properties among the films printed on the three different kinds of substrates, had the highest density and the best particle interconnection. The YBa2Cu3O(7-x) thick films with preferred orientation in (001) direction were obtained on the YSZ substrates. Cracks, which retard the properties of the films, were found from the films deposited on the YSZ substrates. Currently, a MSZ (Magnesium Stabilized Zirconia) substrate, which had higher thermal expansion coefficient than the YSZ substrate, is used as substrate for the YBa2Cu3O(7-x) thick film in order to eliminate the cracks on the film. Bi-based superconductor thick films were printed on polycrystalline MgO and YSZ substrates. Interactions between BSCCO thick films and the YSZ substrates were observed. Various buffer layer materials were applied onto the substrates in order to avoid the interactions between the BSCCO thick films and the ZrO2-based substrates. So far, a BSCCO printed on MgO substrate with T Sub C=89K was obtained. The J sub C of the film was lower than 0.1 A/sq cm by reason of poor interconnectivity of the BSCCO particles

    Superconductivity devices: Commercial use of space

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    The high T(sub c) superconducting ceramic materials, developed in 1987, are now being extensively investigated for a variety of engineering applications. These applications include such devices as conducting links, rotating and linear bearings, sensors, filters, switches, high Q cavities, magnets, and motors. Some of these devices take advantage of the material's ability to lose all electrical resistance at a critical temperature, T(sub c), while others make use of the repulsion forces generated between the magnetic field of a permanent magnet and a superconductor which is cooled below its T(sub c), Meissner effect. This report describes the work accomplished to date by: (1) reviewing the present state of the art in actuator technology, (2) evaluating processing and fabrication of high strain electrostrictive materials, and (3) testing these electrostrictive materials

    Superconductivity devices: Commercial use of space

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    A YBCO thick film containing 20 percent Ag2O with a T(sub c) of 86.8 K and J(sub c) of 108 A/sq cm was obtained. The film was fabricated by a two-step firing process, i.e., firing the film at 1000 C for 10 minutes and annealing at 970 C for 30 minutes. The two-step firing process, however, was not suitable for the multiple-lead YBCO sample due to the formation of the 211 green phase at 1000 C in the multiple-lead YBCO sample. A BSCCO thick film printed on a MgO coated MSZ substrate and fired at 845 C for 2 hours exhibited a superconducting behavior at 89 K. Because of its porous microstructure, the critical current density of the BSCCO thick film was limited. This report also includes the results of the YBCO and BSCCO materials used as oxide electrodes for ferroelectric materials. The YBCO electroded PLZT showed higher remanent polarization and coercive field than the sample electroded with silver paste. A higher Curie temperature for the PLZT was obtained from the YBCO electroded sample. The BSCCO electroded sample, however, exhibited the same Curie temperature as that of a silver electroded sample. Dissipation factors of the ferroelectric samples increased when the oxide electrode was applied

    Environmental test program for superconducting materials and devices

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    A systematic approach to obtaining real time, superconducting YBa2Cu30(7-x) materials is presented. The work was carried out under the overall direction of Clemson University with tasks being performed at both Clemson and Westinghouse (Aiken, SC). Clemson prepared the tapecast superconducting 123 material and fabricated in into substrate-supported, environmentally-protected conducting links. Following this, all of the elements were individually tested for resistance vs. temperature and Tc; and then a portion of them were kept at Clemson for further testing while a randomly selected group was delivered to Westinghouse for specialized testing and evaluation in their low temperature/high vacuum and radiation facilities. In addition, a number of control samples (12 ea.) were put on the shelf at Clemson for further reference at the end of the testing period. The specific tests conducted at Clemson and Westinghouse/SRC are presented with a summary of the results

    Sintering behavior and characteristics study of BaTiO₃ with 50 wt% of B₂O₃-Bi₂O₃-SiO₂-ZnO glass

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    Abstract The thermal analysis of B₂O₃-Bi₂O₃-SiO₂-ZnO (BBSZ) glass with different particle sizes and LiF addition was researched to study its temperature behavior. Next the composites with 50 wt% BaTiO₃–50 wt% BBSZ glass were prepared for shrinkage, microstructures and dielectric properties investigations. The differently treated BBSZ glass showed that the smaller glass particles clearly decreased its softening and crystallization temperatures. LiF addition had the same but much weaker effect. The composites showed two-stage shrinkage related to the softening of the glass and new phase generation of Bi₂₄Si₂O₄₀ at 385–450 °C, and Bi₄BaTi₄O₁₅ over 680 °C. The microstructures of the composites sintered at 720 °C showed Bi₄BaTi₄O₁₅, BaTiO₃ and Bi₂₄Si₂O₄₀ with residual ZnO phase. LiF addition increased the amount of Bi₄BaTi₄O₁₅, thus increasing the loss value. However the particle size of the glass did not effect to the dielectric properties of the composites showing permittivity of 248–256 and loss of 0.013 at 100 kHz

    Low dielectric loss ceramics in the Mg₄Nb₂O₉-ZnAl₂O₄-TiO₂ ternary system

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    Abstract This study used a traditional solid-state reaction method to prepare a series of composite ceramics in the 0.7Mg₄Nb₂O₉-(0.3-x)ZnAl₂O₄-xTiO₂ ternary system. Crystalline phases and microstructure of Mg₄Nb₂O₉-ZnAl₂O₄-TiO₂ dielectric ceramic composites were investigated and correlated with the relevant dielectric properties. It was observed that the addition of Ti⁴⁺ substituted Nb⁵⁺ in the Mg₄Nb₂O₉ structure, which promoted the decomposition of Mg₄Nb₂O₉ to form the second phase, Mg₅Nb₄O₁₅, during sintering. The synergistic effect of ZnAl₂O₄-TiO₂ co-doping promoted the Mg₄Nb₂O₉ ceramic densification. The sample (0.7Mg₄Nb₂O₉-(0.3-x)ZnAl₂O₄-xTiO₂) with x = 0.15−0.2 exhibited dielectric constants of 13–14, larger than those of ZnAl₂O₄, Mg₄Nb₂O₉ and Mg₅Nb₄O₁₅, due to the NbO₆ octahedra distortion resulting from the substitution of Al³⁺/Ti⁴⁺ for Nb⁵⁺ in Mg₄Nb₂O₉ and Mg₅Nb₄O₁₅. The long-range order of the NbO₆ octahedra was enhanced by co-doping ZnAl₂O₄ and TiO₂, thereby enhancing the Qxf value. A dielectric constant of 13.1, Qxf value of 366,000 GHz and a τf of −60.8 ppm/°C were obtained from 1300 °C sintered 0.7Mg₄Nb₂O₉-0.15ZnAl₂O₄-0.15TiO₂. These results show that 0.7Mg₄Nb₂O₉-0.15 ZnAl₂O₄-0.15TiO₂ ceramic is a good candidate for microwave electronic device applications

    Tape casting system for ULTCCs to fabricate multilayer and multimaterial 3D electronic packages with embedded electrodes

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    Abstract A 3D multilayer structure built by two ultra‐low temperature co‐fired ceramic (ULTCC) compositions with silver embedded electrodes are co‐fired at a temperature of 450°C. The 3D multilayer module is prepared by laminating the ULTCC green tapes with a new binder system, which organics can be completely burned out at temperature of 250°C before the sintering of the ULTCC 3D modulus. High‐density microstructures are achieved for the sintered module. In this study, the ULTCC feasible binder system is introduced. Also, ULTCC multilayers and multimaterial structures with surface and embedded silver electrodes are fabricated. This research opens up a new horizon for fabrication of electroceramic devices with embedded electrodes in multimaterial devices
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