Enhanced light emission from improved homogeneity in biaxially suspended Germanium membranes from curvature optimization

A silicon compatible light source is crucial to develop a fully monolithic silicon photonics platform. Strain engineering in suspended Germanium membranes has offered a potential route for such a light source. However, biaxial structures have suffered from poor optical properties due to unfavorable strain distributions. Using a novel geometric approach and finite element modelling (FEM) structures with improved strain homogeneity were designed and fabricated. Micro-Raman (μ-Raman) spectroscopy was used to determine central strain values. Micro-photoluminescence (μ-PL) was used to study the effects of the strain profiles on light emission; we report a PL enhancement of up to 3x by optimizing curvature at a strain value of 0.5% biaxial strain. This geometric approach offers opportunity for enhancing the light emission in Germanium towards developing a practical on chip light source

Long operating lifetime mid-infrared LEDs based on black phosphorus.

Black phosphorus (BP) is a narrow bandgap layered semiconductor promising for mid-infrared optoelectronic applications. BP-based devices have been shown to surpass state-of-the-art mid-infrared detectors and light-emitting diodes (LEDs) in terms of performance. Despite their device advantages, the materials inherent instability in the air could hinder its use in practical optoelectronic applications. Here, we investigated the impact of passivation on the device lifetime of BP LEDs, which deteriorate in a matter of seconds without using passivation. The lifetime is significantly extended with an Al2O3 passivation layer and nitrogen packaging via atomic layer deposition and ultra-violet curable resin sealing. The operational lifetime (half-life) at room temperature is extrapolated to be ~15,000 h with an initial power density of 340 mW/cm2 based on accelerated life testing. The present results indicate that efficient BP optoelectronics can be highly robust through simple and scalable packaging technologies, with important practical implications for mid-infrared applications

Inhibited nonradiative decay at all exciton densities in monolayer semiconductors.

Most optoelectronic devices operate at high photocarrier densities, where all semiconductors suffer from enhanced nonradiative recombination. Nonradiative processes proportionately reduce photoluminescence (PL) quantum yield (QY), a performance metric that directly dictates the maximum device efficiency. Although transition metal dichalcogenide (TMDC) monolayers exhibit near-unity PL QY at low exciton densities, nonradiative exciton-exciton annihilation (EEA) enhanced by van-Hove singularity (VHS) rapidly degrades their PL QY at high exciton densities and limits their utility in practical applications. Here, by applying small mechanical strain (less than 1%), we circumvented VHS resonance and markedly suppressed EEA in monolayer TMDCs, resulting in near-unity PL QY at all exciton densities despite the presence of a high native defect density. Our findings can enable light-emitting devices that retain high efficiency at all brightness levels

Low voltage AC electroluminescence in silicon MOS capacitors

Low power silicon based light source and detector are attractive for on-chip photonic circuits given their ease of process integration. However, conventional silicon light emitting diodes emit photons with energies near the band edge where the corresponding silicon photodetectors lack responsivity. On the other hand, previously reported hot carrier electroluminescent silicon devices utilizing a reverse biased diode require high operating voltages. Here, we investigate hot carrier electroluminescence in silicon metal-oxide-semiconductor capacitors operating under transient voltage conditions. During each voltage transient, large energy band bending is created at the edge of the source contact, much larger than what is achievable at a steady state. As a result, electrons and holes are injected efficiently from a single source contact into the silicon channel at the corresponding voltage transient, where they subsequently undergo impact ionization and phonon-assisted interband recombination. Notably, we show low voltage operation down to 2.8 V by using a 20 nm thick high- κ gate dielectric. We show further voltage scaling is possible by reducing the gate dielectric thickness, thus presenting a low voltage platform for silicon optoelectronic integrated circuits

Germanium light sources for silicon photonics

Germanium (Ge) is a group-IV semiconductor promissing for both advanced electronics and photonics applications integrated on Silicon (Si) chips. The high electron mobility is favourable for the Complementary Metal-Oxide-Semiconductor (CMOS) transistors, while the quasi-indirect band gap character is useful for developing light sources for Si photonics. In this talk, we will review the current developments of Ge light sources fabricated using nano-fabrication technologies compatible with CMOS processes. In particular, we review recent progress in applying high-tensile strain to Ge to reduce the direct band gap. By making a freestanding beam using Micro-Electro-Mechanical-Systems (MEMS) processes, extremely high-tensile strain exceeding a few % can be applicable to Ge, converting indirect to direct band gap characters. Another important process is doping Ge with donor impurities to fill the indirect band gap valleys in the conduction band. Realization of carrier confinement structures and suitable optical cavities will also be discussed. Finally, we will discuss various applications of Ge light sources in potential photonics-electronics convergent systems

Spin-on doping of germanium-on-insulator wafers for monolithic light sources on silicon

High electron doping of germanium (Ge) is considered to be an important process to convert Ge into an optical gain material and realize a monolithic light source integrated on a silicon chip. Spin-on doping is a method that offers the potential to achieve high doping concentrations without affecting crystalline qualities over other methods such as ion implantation and in-situ doping during material growth. However, a standard spin-on doping recipe satisfying these requirements is not yet available. In this paper we examine spin-on doping of Ge-on-insulator (GOI) wafers. Several issues were identified during the spin-on doping process and specifically the adhesion between Ge and the oxide, surface oxidation during activation, and the stress created in the layers due to annealing. In order to mitigate these problems, Ge disks were first patterned by dry etching followed by spin-on doping. Even by using this method to reduce the stress, local peeling of Ge could still be identified by optical microscope imaging. Nevertheless, most of the Ge disks remained after the removal of the glass. According to the Raman data, we could not identify broadening of the lineshape which shows a good crystalline quality, while the stress is slightly relaxed. We also determined the linear increase of the photoluminescence intensity by increasing the optical pumping power for the doped sample, which implies a direct population and recombination at the gamma valley

Large-scale efficient mid-wave infrared optoelectronics based on black phosphorus ink.

The mid-wave infrared (MWIR), ranging from 2 to 5 micrometers, is of substantial interest for chemical sensing, imaging, and spectroscopy. Black phosphorus (bP)-based MWIR light emitters and detectors have been shown to outperform the state-of-the-art for commercial devices due to the low Auger recombination coefficient of bP. However, the scalability of these devices remains a challenge. Here, we report a bP ink formula that preserves the exceptional MWIR optoelectronic properties of bP to deposit centimeter-scale, uniform, and pinhole free films with a photoluminescence quantum yield higher than competing III-V and II-VI semiconductors with similar bandgaps at high excitation regime. As a proof of concept, we use bP ink as a phosphor on a red commercial light-emitting diode to demonstrate bright MWIR light emission. We also show that these films can be integrated into heterostructure device architectures with electron and hole selective contacts for direct-injected light emission and detection in MWIR

Fabrication of Ge micro-disks on free-standing SiO2 beams for monolithic light emission

Realizing a germanium (Ge)-based monolithic light source requires n-type doping with high activation levels, tensilestrain, and an optical cavity. Here, we demonstrate the application of spin-on doping technique, and the use of free-standing structures to induce tensile strain on Ge micro-disks, which act as a simple micro-cavit