32 research outputs found

    Low Temperature Fluidized Bed Nitriding of Austenitic Stainless Steel

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    In the present investigation, low temperature nitriding has been attempted on AISI 316L austenitic stainless steel by using a laboratory fluidized bed furnace. The nitriding was performed in temperature range between 400°C and 500°C. X-ray diffraction, metallography, and corrosion tests were used to characterize the resultant nitrided surface and layers. The results showed that fluidized bed process can be used to produce a precipitation-free nitrided layer characterized by the S phase or expanded austenite on austenitic stainless steel at temperatures below 500°C. But there exists a critical temperature and an incubation time for effective nitriding, below which nitriding is ineffective. The corrosion behaviour of the as-nitrided surfaces is significantly different from that previously reported for low temperature plasma nitriding. This anomaly is explained by the formation of iron oxide products and surface contamination during the fluidized proces

    Measuring the electronic properties of poly-si thin film solar cells deposited on textured substrate

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    Electrical properties of PECVD produced poly-Si photovoltaic layers on the various textured substrates showing the light trapping effect have been investigated using an AC-conductivity technique. From temperature dependence of electron (hole) conductivities using n-i-n (p-i-p) structures, the Fermi level of the poly-Si layer on the slightly textured substrates is found to locate at the center of the band gap and this material is 'truly' intrinsic. As RMS roughness of the textured substrate, q increases, the Fermi level becomes close to conduction band edge, and finally, the poly-Si layer on the highly textured substrate exhibits n-type character even though any deposition conditions for the poly-Si layers are not changed at all. Changes in electrical conductivities of the poly-Si thin films in conjunction with the results on photovoltaic performances and microstructure are also discussed
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