Optical properties of refractory metal based thin films

There is a growing interest in refractory metal thin films for a range of emerging nanophotonic applications including high temperature plasmonic structures and infrared superconducting single photon detectors. We present a detailed comparison of optical properties for key representative materials in this class (NbN, NbTiN, TiN and MoSi) with texture varying from crystalline to amorphous. NbN, NbTiN and MoSi have been grown in an ultra-high vacuum sputter deposition system. Two different techniques (sputtering and atomic layer deposition) have been employed to deposit TiN. We have carried out variable angle ellipsometric measurements of optical properties from ultraviolet to mid infrared wavelengths. We compare with high resolution transmission electron microscopy analysis of microstructure. Sputter deposited TiN and MoSi have shown the highest optical absorption in the infrared wavelengths relative to NbN, NbTiN or ALD deposited TiN. We have also modelled the performance of a semi-infinite metal air interface as a plasmonic structure with the above mentioned refractory metal based thin films as the plasmonic components. This study has implications in the design of next generation superconducting nanowire single photon detector or plasmonic nanostructure based devices

Design and characterisation of titanium nitride sub-arrays of kinetic inductance detectors for passive terahertz imaging

We report on the investigation of titanium nitride (TiN) thin films deposited via atomic layer deposition (ALD) for microwave kinetic inductance detectors (MKID). Using our in-house ALD process, we have grown a sequence of TiN thin films (thickness 15, 30, 60 nm). The films have been characterised in terms of superconducting transition temperature Tc , sheet resistance Rs and microstructure. We have fabricated test resonator structures and characterised them at a temperature of 300 mK. At 350 GHz, we report an optical noise equivalent power NEPopt≈2.3×10−15 W/√Hz , which is promising for passive terahertz imaging applications

Decision support system (DSS) for water distribution management: Theory and practice

Decision support tools / Irrigation canals / Water delivery / Water management / Information systems / Computer techniques / Decision making / Case studies / Sri Lanka / Kirindi Oya

Introduction of monitoring activities at the main-canal level: A study of the Kirindi Oya right bank main canal -- Maha 1991/92

Irrigation canals / Monitoring / Irrigation management / Water conveyance / Decision making / Indicators / Water management / Canal irrigation / Sri Lanka / Kirindi Oya

High-uniformity atomic layer deposition of superconducting niobium nitride thin films for quantum photonic integration

Atomic layer deposition (ALD) has been identified as a promising growth method for high-uniformity superconducting thin films for superconducting quantum photonic applications, offering superior uniformity, thickness control and conformality to techniques such as reactive sputtering. The potential scalability of ALD makes this method especially appealing for fabrication of superconducting nanowires and resonators across large areas. We report on the growth of highly uniform superconducting NbN thin films via plasma-enhanced atomic layer deposition (PEALD) with radio frequency (RF) substrate biasing, on a 200 mm (8-inch) Si wafer, specifically for superconducting nanowire single-photon detector (SNSPD) applications. Niobium nitride films were grown using (tert-butylimido)-tris(diethylamido)-niobium(V) (TBTDEN) precursor and a H2/Ar plasma. The superconducting properties of a variable thickness series of films (5 – 30 nm) show critical temperature (Tc) of 13.5 K approaching bulk thickness (30 nm) with low suppression down to the ultrathin regime (5 nm) with Tc > 11 K. Tc across the 200 mm wafer with 8 nm thick NbN, measured in 15 mm intervals, exhibits minimal variation (< 7%). Microbridge structures fabricated on 8 nm thick NbN films also exhibit high critical current densities (Jc), > 10 MA/cm2 at 2.6 K. PEALD could therefore be a pivotal technique in enabling large-scale fabrication of integrated quantum photonic devices across a variety of applications

The 2018 GaN Power Electronics Roadmap

Gallium nitride (GaN) is a compound semiconductor that has tremendous potential to facilitate economic growth in a semiconductor industry that is silicon-based and currently faced with diminishing returns of performance versus cost of investment. At a material level, its high electric field strength and electron mobility have already shown tremendous potential for high frequency communications and photonic applications. Advances in growth on commercially viable large area substrates are now at the point where power conversion applications of GaN are at the cusp of commercialisation. The future for building on the work described here in ways driven by specific challenges emerging from entirely new markets and applications is very exciting. This collection of GaN technology developments is therefore not itself a road map but a valuable collection of global state-of-the-art GaN research that will inform the next phase of the technology as market driven requirements evolve. First generation production devices are igniting large new markets and applications that can only be achieved using the advantages of higher speed, low specific resistivity and low saturation switching transistors. Major investments are being made by industrial companies in a wide variety of markets exploring the use of the technology in new circuit topologies, packaging solutions and system architectures that are required to achieve and optimise the system advantages offered by GaN transistors. It is this momentum that will drive priorities for the next stages of device research gathered here

The 2018 GaN power electronics roadmap

Gallium nitride (GaN) is a compound semiconductor that has tremendous potential to facilitate economic growth in a semiconductor industry that is silicon-based and currently faced with diminishing returns of performance versus cost of investment. At a material level, its high electric field strength and electron mobility have already shown tremendous potential for high frequency communications and photonic applications. Advances in growth on commercially viable large area substrates are now at the point where power conversion applications of GaN are at the cusp of commercialisation. The future for building on the work described here in ways driven by specific challenges emerging from entirely new markets and applications is very exciting. This collection of GaN technology developments is therefore not itself a road map but a valuable collection of global state-of-the-art GaN research that will inform the next phase of the technology as market driven requirements evolve. First generation production devices are igniting large new markets and applications that can only be achieved using the advantages of higher speed, low specific resistivity and low saturation switching transistors. Major investments are being made by industrial companies in a wide variety of markets exploring the use of the technology in new circuit topologies, packaging solutions and system architectures that are required to achieve and optimise the system advantages offered by GaN transistors. It is this momentum that will drive priorities for the next stages of device research gathered here

A Study of In-Situ Auger Spectroscopic Surface Analysis in Development of Atomic Layer Etch for GaN/AlGaN Based Power Device Fabrication

No abstract available