10 research outputs found

    Consideration to minimize losses in terahertz coplanar waveguide on indium phosphide

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    John Wiley & Sons Inc., USA.International audienceThe aim of this study is to analyze the losses of coplanar waveguide (CPW) in the Terahertz (THz) frequency range. A numerical analysis of the origin of losses (conductor, dielectric and radiation) for different geometries of the THz CPW on an Indium Phosphide substrate is presented. Two air-bridges have been created over the central metallization and they are linked to the two ground planes in order to select the fundamental CPW mode by strongly reducing the unwanted slotline mode. Three numerical codes (HFSS, CST and an indigenously developed code called MAXTRA3D) are used for CPW modeling. Several CPW shapes are investigated showing that ohmic losses are dramatic for small central metallization-ground spacing while radiation losses are dominating for large spacing. 2011 Wiley Periodicals, Inc. (26 References)

    High gain constrained lens antenna on BCB substrate for 300-GHz applications

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    International audiencestraight front face constrained lens is used to excite a leaky-wave antenna (array of slots) at 300 GHz. The supporting polymer of the antennas is Benzocyclobutene (BCB). The lens is fabricated using substrate integrated waveguide (SIW) technology, while the radiating slots are etched on the polymer by photolithography. Numerical results show a reflection coefficient lower than-15 dB and a realized gain larger than 15 dBi over a 20% fractional bandwidth, spanning from 260 GHz to 330 GHz. The antenna efficiency is estimated equal to 25% by taking into account dielectric and conductive losses. © 2019 IEEE

    BenzoCycloButene-based in-Package Substrate Integrated Waveguides for sub-THz Applications

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    International audienceThis paper introduces an experimental characterization of substrate integrated waveguide (SIW) components integrated in a benzocyclobutene-based interposer for WR10-band applications. High performance SIWs were experimentally validated, with a measured attenuation constant of 0.39 dB/mm and a quality factor of 27 at 90 GHz. The attenuation constant remains equal to 0.4 dB/mm between 85 GHz and 110 GHz and the quality factor reaches 40 in the upper end of the band. These results show the benefits offered by using benzocyclobutene 3D packaging for the realization of high performance passive circuits with lower cost and higher electrical performance as compared to standard CMOS technologies and concurrent packaging technologies
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