Thin Film Thermal Deposition at Various Pressures

This research was to verify the hypothesis that resistivity of metal\u27s thin film deposited in a low-pressure environment is the same as its solid material. Thermal Evaporation is a thin film deposition technique in which metal inside a vacuum is evaporated, then deposited onto a surface. Higher quality metal films are deposited when the vacuum pressure is lower. At higher pressures, more air molecules are trapped within the layers of metal, thus increasing scattering sites and increasing the resistance. However, reaching a lower pressure requires more time and effort. In this research, films were deposited at various pressures and resistivities were calculated for each film to determine an ideal pressure range that creates the least resistivity