Near-surface processing on AlGaN/GaN heterostructures: a nanoscale electrical and structural characterization

The effects of near-surface processing on the properties of AlGaN/GaN heterostructures were studied, combining conventional electrical characterization on high-electron mobility transistors (HEMTs), with advanced characterization techniques with nanometer scale resolution, i.e., transmission electron microscopy, atomic force microscopy (AFM) and conductive atomic force microscopy (C-AFM). In particular, a CHF3-based plasma process in the gate region resulted in a shift of the threshold voltage in HEMT devices towards less negative values. Two-dimensional current maps acquired by C-AFM on the sample surface allowed us to monitor the local electrical modifications induced by the plasma fluorine incorporated in the material

Active dopant profiling and Ohmic contacts behavior in degenerate n-type implanted silicon carbide

This Letter reports on the active dopant profiling and Ohmic contact behavior in degenerate P-implanted silicon carbide (4H-SiC) layers. Hall measurements showed a nearly temperature-independent electron density, corresponding to an electrical activation of about 80% of the total implanted dose. Using the Hall result as calibration, the depth resolved active P-profile was extracted by scanning capacitance microscopy (SCM). Such information on the active P-profile permitted to elucidate the current injection mechanism at the interface of annealed Ni Ohmic contacts with the degenerate n-type 4H-SiC layer. Modeling the temperature dependence of the specific contact resistance with the thermionic field emission mechanism allowed extracting a doping concentration of 8.5 × 1019 cm−3 below the metal/4H-SiC interface, in excellent agreement with the value independently obtained by the SCM depth profiling. The demonstrated active dopant profiling methodology can have important implications in the 4H-SiC device technology

Threshold voltage instability by charge trapping effects in the gate region of p-GaN HEMTs

In this work, the threshold voltage instability of normally-off p-GaN high electron mobility transistors (HEMTs) has been investigated by monitoring the gate current density during device on-state. The origin of the gate current variations under stress has been ascribed to charge trapping occurring at the different interfaces in the metal/p-GaN/AlGaN/GaN system. In particular, depending on the stress bias level, electrons (VG 6 V) are trapped, causing a positive or negative threshold voltage shift {DVTH, respectively. By monitoring the gate current variations at different temperatures, the activation energies associated to the electrons and holes trapping could be determined and correlated with the presence of nitrogen (electron traps) or gallium (hole traps) vacancies. Moreover, the electrical measurements suggested the generation of a new electron-trap upon long-time bias stress, associated to the creation of crystallographic dislocation-like defects extending across the different interfaces (p-GaN/AlGaN/GaN) of the gate stack

Genesis and evolution of extended defects: The role of evolving interface instabilities in cubic SiC

Emerging wide bandgap semiconductor devices such as the ones built with SiC have the potential to revolutionize the power electronics industry through faster switching speeds, lower losses, and higher blocking voltages, which are superior to standard silicon-based devices. The current epitaxial technology enables more controllable and less defective large area substrate growth for the hexagonal polymorph of SiC (4H-SiC) with respect to the cubic counterpart (3C-SiC). However, the cubic polymorph exhibits superior physical properties in comparison to its hexagonal counterpart, such as a narrower bandgap (2.3 eV), possibility to be grown on a silicon substrate, a reduced density of states at the SiC/SiO2 interface, and a higher channel mobility, characteristics that are ideal for its incorporation in metal oxide semiconductor field effect transistors. The most critical issue that hinders the use of 3C-SiC for electronic devices is the high number of defects in bulk and epilayers, respectively. Their origin and evolution are not understood in the literature to date. In this manuscript, we combine ab initio calibrated Kinetic Monte Carlo calculations with transmission electron microscopy characterization to evaluate the evolution of extended defects in 3C-SiC. Our study pinpoints the atomistic mechanisms responsible for extended defect generation and evolution, and establishes that the antiphase boundary is the critical source of other extended defects such as single stacking faults with different symmetries and sequences. This paper showcases that the eventual reduction of these antiphase boundaries is particularly important to achieve good quality crystals, which can then be incorporated in electronic devices

Proposal for a New Score-Based Approach To Improve Efficiency of Diagnostic Laboratory Workflow for Acute Bacterial Meningitis in Adults

Microbiological tests on cerebrospinal fluid (CSF) utilize a common urgent-care procedure that does not take into account the chemical and cytological characteristics of the CSF, resulting sometimes in an unnecessary use of human and diagnostic resources. The aim of this study was to retrospectively validate a simple scoring system (bacterial meningitis-Careggi score [BM-CASCO]) based on blood and CSF sample chemical/cytological parameters for evaluating the probability of acute bacterial meningitis (ABM) in adults. BM-CASCO (range, 0 to 6) was defined by the following parameters: CSF cell count, CSF protein levels, CSF lactate levels, CSF glucose-to-serum glucose ratio, and peripheral neutrophil count. BM-CASCO was retrospectively calculated for 784 cases of suspected ABM in adult subjects observed during a four-and-a-half-year-period (2010 to 2014) at the emergency department (ED) of a large tertiary-care teaching hospital in Italy. Among the 28 confirmed ABM cases (3.5%), Streptococcus pneumoniae was the most frequent cause (16 cases). All ABM cases showed a BM-CASCO value of ≥3. Most negative cases (591/756) exhibited a BM-CASCO value of ≤1, which was adopted in our laboratory as a cutoff to not proceed with urgent microbiological analysis of CSF in cases of suspected ABM in adults. During a subsequent 1-year follow-up, the introduction of the BM-CASCO in the diagnostic workflow of ABM in adults resulted in a significant decrease in unnecessary microbiological analysis, with no false negatives. In conclusion, BM-CASCO appears to be an accurate and simple scoring system for optimization of the microbiological diagnostic workflow of ABM in adults

Highly Homogeneous 2D/3D Heterojunction Diodes by Pulsed Laser Deposition of MoS2 on Ion Implantation Doped 4H-SiC

In this paper, 2D/3D heterojunction diodes have been fabricated by pulsed laser deposition (PLD) of MoS2 on 4H-SiC(0001) surfaces with different doping levels, i.e., n(-) epitaxial doping (approximate to 10(16) cm(-3)) and n(+) ion implantation doping (>10(19) cm(-3)). After assessing the excellent thickness uniformity (approximate to 3L-MoS2) and conformal coverage of the PLD-grown films by Raman mapping and transmission electron microscopy, the current injection across the heterojunctions is investigated by temperature-dependent current-voltage characterization of the diodes and by nanoscale current mapping with conductive atomic force microscopy. A wide tunability of the transport properties is shown by the SiC surface doping, with highly rectifying behavior for the MoS2/n(-) SiC junction and a strongly enhanced current injection for MoS2/n(+) SiC one. Thermionic emission is found the dominant mechanism ruling forward current in MoS2/n(-) SiC diodes, with an effective barrier phi(B) = (1.04 +/- 0.09) eV. Instead, the significantly lower effective barrier phi(B) = (0.31 +/- 0.01) eV and a temperature-dependent ideality factor for MoS2/n(+) SiC junctions is explained by thermionic-field-emission through the thin depletion region of n(+) doped SiC. The scalability of PLD MoS2 deposition and the electronic transport tunability by implantation doping of SiC represents key steps for industrial development of MoS2/SiC devices

Multiscale Investigation of the Structural, Electrical and Photoluminescence Properties of MoS2 Obtained by MoO3 Sulfurization

In this paper, we report a multiscale investigation of the compositional, morphological, structural, electrical, and optical emission properties of 2H-MoS(2) obtained by sulfurization at 800 °C of very thin MoO(3) films (with thickness ranging from ~2.8 nm to ~4.2 nm) on a SiO(2)/Si substrate. XPS analyses confirmed that the sulfurization was very effective in the reduction of the oxide to MoS(2,) with only a small percentage of residual MoO(3) present in the final film. High-resolution TEM/STEM analyses revealed the formation of few (i.e., 2–3 layers) of MoS(2) nearly aligned with the SiO(2) surface in the case of the thinnest (~2.8 nm) MoO(3) film, whereas multilayers of MoS(2) partially standing up with respect to the substrate were observed for the ~4.2 nm one. Such different configurations indicate the prevalence of different mechanisms (i.e., vapour-solid surface reaction or S diffusion within the film) as a function of the thickness. The uniform thickness distribution of the few-layer and multilayer MoS(2) was confirmed by Raman mapping. Furthermore, the correlative plot of the characteristic A(1g)-E(2g) Raman modes revealed a compressive strain (ε ≈ −0.78 ± 0.18%) and the coexistence of n- and p-type doped areas in the few-layer MoS(2) on SiO(2), where the p-type doping is probably due to the presence of residual MoO(3). Nanoscale resolution current mapping by C-AFM showed local inhomogeneities in the conductivity of the few-layer MoS(2), which are well correlated to the lateral changes in the strain detected by Raman. Finally, characteristic spectroscopic signatures of the defects/disorder in MoS(2) films produced by sulfurization were identified by a comparative analysis of Raman and photoluminescence (PL) spectra with CVD grown MoS(2) flakes

Vertical Transistors Based on 2D Materials: Status and Prospects

Two-dimensional (2D) materials, such as graphene (Gr), transition metal dichalcogenides (TMDs) and hexagonal boron nitride (h-BN), offer interesting opportunities for the implementation of vertical transistors for digital and high-frequency electronics. This paper reviews recent developments in this field, presenting the main vertical device architectures based on 2D/2D or 2D/3D material heterostructures proposed so far. For each of them, the working principles and the targeted application field are discussed. In particular, tunneling field effect transistors (TFETs) for beyond-CMOS low power digital applications are presented, including resonant tunneling transistors based on Gr/h-BN/Gr stacks and band-to-band tunneling transistors based on heterojunctions of different semiconductor layered materials. Furthermore, recent experimental work on the implementation of the hot electron transistor (HET) with the Gr base is reviewed, due to the predicted potential of this device for ultra-high frequency operation in the THz range. Finally, the material sciences issues and the open challenges for the realization of 2D material-based vertical transistors at a large scale for future industrial applications are discussed