20 research outputs found

    ESSenTIAL : EPIXfab services specifically targeting (SME) industrial takeup of advanced silicon photonics

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    ePIXfab brings silicon photonics within reach of European small and medium sized enterprises, thereby building on its track record and its integration into Europractice. To this end, ePIXfab offers affordable access to standardized active and passive silicon photonic IC and packaging technology, a path from design to manufacturing and hands-on training. Based on a consortium of major research institutes with silicon photonics expertise, ePIXfab reaches out to European industry and supports them to evaluate silicon photonics in the context of concrete applications and markets. In order to ensure low-cost, quick access and scalability to manufacturing, the maturity of silicon photonic IC technology is enhanced by setting up a library of generic devices, a level of process and device benchmarking and a well maintained design flow. For the first time, devices in a standard package are offered to facilitate measurements. Training programs on the IC and packaging services are also offered, including hands-on training in making designs. Maturity, standardization and sustainability are driven by a steadily growing worldwide user base

    Towards foundry approach for silicon photonics : silicon photonics platform ePIXfab

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    Fabless access to wafer-scale silicon photonics technology is moving silicon photonics closer to becoming a mainstream technology and opens up new exciting areas for research at the same time. It is only by using wafer-scale technology that this emerging field will be able to realise its promise: to become a disruptive technology. At the basis of the rationale for silicon photonics is a complex of photonic functions integrated on a single chip, coupled to a stable, high-yield volume fabrication technology base. ePIXfab is a service platform offering R&D oriented access to state-of-the-art 200 mm wafer-scale CMOS technology optimised for silicon photonics purposes

    Interfacing 3D-stacked electronic and optical NoCs with mixed CMOS-ECL bridges: A realistic preliminary assessment

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    The combination of optical networks-on-chip and 3D stacking represents the most promising system integration framework to overcome the communication bottleneck of future many-core processors. From an architecture viewpoint, the availability of an energy-efficient, low-latency bridge connecting the electronic network-on-chip with the optical one is as important as the maturity of the optical interconnect technology. The key design challenge consists of overcoming the inherent serial nature of optical communications, which is typically pursued by increasing either the data rate or the bit-level parallelism, or by a combination thereof. This paper explores an hybrid CMOS-ECL technology platform for bridge implementation by means of a complete logic synthesis effort. By spanning the wider configuration space of the hybrid bridge with respect to fully-CMOS realizations, the paper identifies the most energy-efficient configurations and provides a comparative assessment of achievable quality metrics. Derived results represent a solid and realistic starting point for future optimizations and for the refinement into an actual layout

    Contribution to the Modelling of Electroluminescence in High Voltage Polymeric Materials

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    This paper compares two models describing electroluminescence under AC stress in order to gain a better understanding on the interfacial processes, responsible for light emission. Simulated data is also compared with electroluminescence measurements for LDPE samples using three types of applied voltage waveforms: sinusoidal, triangular and square

    Effects of pump fluctuations on intensity noise of Nd:YVO

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    The principle of pump noise suppression is applied to a Nd:YVO4 microchip laser, optically pumped by laser diodes. The noise of the microchip laser at low frequency (below the relaxation oscillation frequency) is compared for noisy and amplitude squeezed laser diodes. The minimum intensity noise of the microchip laser is 7 dB above SNL at a frequency of 40 kHz. Very good agreement between experimental results and theoretical predictions of a model based on quantum Langevin equations is found

    Ikebana: Ikenobo School [015]

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    Photograph of hanging scroll and flower arrangementIkenobo school, Kyoto, Japan

    ePIXfab:The silicon photonics platform

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    ePIXfab-The European Silicon Photonics Support Center continues to provide state-of-the-art silicon photonics solutions to academia and industry for prototyping and research. ePIXfab is a consortium of EU research centers providing diverse expertise in the silicon photonics food chain, from training users in designing silicon photonics chips to fiber pigtailed chips. While ePIXfab provides world-wide users access to advanced silicon photonics it also focuses its attention to expanding the silicon photonics infrastructure through a network of design houses, access partners and industrial collaborations. © 2013 SPIE
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