Flexible polydimethylsiloxane/multi-walled carbon nanotubes membranous metacomposites with negative permittivity

Metacomposites with negative electromagnetic parameters can be promising substitute for periodic metamaterials. In this paper, we devoted to fabricating flexible metacomposite films, which have great potential applications in the field of wearable cloaks, sensing, perfect absorption and stretchable electronic devices. The conductivity and the complex permittivity were investigated in flexible polydimethylsiloxane (PDMS)/multi-walled carbon nanotubes (MWCNTs) membranous nanocomposites, which were fabricated via in-situ polymerization process. With the increase of conductive one-dimension carbon nanotubes concentration, there was a percolation transition observed in conduction due to the formation of continuous networks. The dielectric dispersion behavior was also analyzed in the spectra of complex permittivity. It is indicated that the conduction and polarization make a combined effect on the dielectric loss in flexible PDMS/MWCNTs composites. The negative permittivity with a dielectric resonance was obtained, and was attributed to the induced electric dipoles

Targeted Double Negative Properties in Silver/Silica Random Metamaterials by Precise Control of Microstructures

The mechanism of negative permittivity/permeability is still unclear in the random metamaterials, where the precise control of microstructure and electromagnetic properties is also a challenge due to its random characteristic. Here silver was introduced into porous SiO2 microsphere matrix by a self-assemble and template method to construct the random metamaterials. The distribution of silver was restricted among the interstices of SiO2 microspheres, which lead to the precise regulation of electrical percolation (from hoping to Drude-type conductivity) with increasing silver content. Negative permittivity came from the plasma-like behavior of silver network, and its value and frequency dispersion were further adjusted by Lorentz-type dielectric response. During this process, the frequency of epsilon-near-zero (ENZ) could be adjusted accordingly. Negative permeability was well explained by the magnetic response of eddy current in silver micronetwork. The calculation results indicated that negative permeability has a linear relation with ω0.5, showing a relaxation-type spectrum, different from the “magnetic plasma” of periodic metamaterials. Electromagnetic simulations demonstrated that negative permittivity materials and ENZ materials, with the advantage of enhanced absorption (40dB) and intelligent frequency selection even in a thin thickness (0.1 mm), could have potentials for electromagnetic attenuation and shielding. This work provides a clear physical image for the theoretical explanation of negative permittivity and negative permeability in random metamaterials, as well as a novel strategy to precisely control the microstructure of random metamaterials

Piezoelectric and dielectric behavior of 0-3 cement-based composites mixed with carbon black

Cement-based 0-3 type piezoelectric composites, fabricated from white cement, lead zirconate titanate (PZT) powder and small amounts of carbon black, are exploited for potential applications in civil engineering. The nature of the aging and poling behavior of the carbon black/PZT/cement composites is investigated. It is shown that the use of a conductive carbon black phase can facilitate the poling process at room temperature. The influences of the carbon black on the piezoelectric and dielectric properties are studied as well. It is demonstrated that the piezoelectric sensitivities of the composites can be dramatically enhanced by incorporation of small amounts of carbon black, due to its conductive properties. With a poling field of 4 kV/mm and poling time of 20 min, the d(33), epsilon(r), tan delta and K-t values of the composite containing 70 vol.\% PZT and 1.0 vol.\% carbon black are 28.5 pC/N, 202.6, 0.19 and 12.2\%, respectively. (C) 2008 Elsevier Ltd. All rights reserved

New product design structure.

(100- Support device, 200- Lead screw device, 300- Expansion device, 400- Cutting device).</p

Patent verification samples.

Evaluation of high value patents is essential for the enterprise’s technical layout and innovative product design. The existing research on the patent value needs the support of a large number of professional statistical information and is difficult to directly reflect the technical value. Since technological innovation is the fundamental means to enhance the sustainable competitiveness of enterprises. Therefore, a high-tech value patent evaluation and cultivation method for engineering designers need to be proposed. Firstly, the patent samples based on design methodology are retrieved and the indicators for evaluating technical value are summarized and the rationality of the evaluation indicators is verifier through empirical study based on improved evidence theory. Secondly, based on principal component analysis and factor analysis, a high-tech value patent evaluation and cultivation method is proposed. Finally, the proposed method is applied to identify the high-tech value patents in the cutting machine industry, and structural improvement is made based on this patent to demonstrate the cultivation process of high-tech value patents. The proposed method provides a clear guiding direction for the cultivation of high novelty patents and enterprise innovative product design. The method can effectively assist the product R&D activities of engineering designers and enhance the sustainable competitiveness of enterprises from a technological perspective.</div

Factor analysis results.

Evaluation of high value patents is essential for the enterprise’s technical layout and innovative product design. The existing research on the patent value needs the support of a large number of professional statistical information and is difficult to directly reflect the technical value. Since technological innovation is the fundamental means to enhance the sustainable competitiveness of enterprises. Therefore, a high-tech value patent evaluation and cultivation method for engineering designers need to be proposed. Firstly, the patent samples based on design methodology are retrieved and the indicators for evaluating technical value are summarized and the rationality of the evaluation indicators is verifier through empirical study based on improved evidence theory. Secondly, based on principal component analysis and factor analysis, a high-tech value patent evaluation and cultivation method is proposed. Finally, the proposed method is applied to identify the high-tech value patents in the cutting machine industry, and structural improvement is made based on this patent to demonstrate the cultivation process of high-tech value patents. The proposed method provides a clear guiding direction for the cultivation of high novelty patents and enterprise innovative product design. The method can effectively assist the product R&D activities of engineering designers and enhance the sustainable competitiveness of enterprises from a technological perspective.</div

Correlation analysis.

Evaluation of high value patents is essential for the enterprise’s technical layout and innovative product design. The existing research on the patent value needs the support of a large number of professional statistical information and is difficult to directly reflect the technical value. Since technological innovation is the fundamental means to enhance the sustainable competitiveness of enterprises. Therefore, a high-tech value patent evaluation and cultivation method for engineering designers need to be proposed. Firstly, the patent samples based on design methodology are retrieved and the indicators for evaluating technical value are summarized and the rationality of the evaluation indicators is verifier through empirical study based on improved evidence theory. Secondly, based on principal component analysis and factor analysis, a high-tech value patent evaluation and cultivation method is proposed. Finally, the proposed method is applied to identify the high-tech value patents in the cutting machine industry, and structural improvement is made based on this patent to demonstrate the cultivation process of high-tech value patents. The proposed method provides a clear guiding direction for the cultivation of high novelty patents and enterprise innovative product design. The method can effectively assist the product R&D activities of engineering designers and enhance the sustainable competitiveness of enterprises from a technological perspective.</div

Construction of evaluation indicators.

Evaluation of high value patents is essential for the enterprise’s technical layout and innovative product design. The existing research on the patent value needs the support of a large number of professional statistical information and is difficult to directly reflect the technical value. Since technological innovation is the fundamental means to enhance the sustainable competitiveness of enterprises. Therefore, a high-tech value patent evaluation and cultivation method for engineering designers need to be proposed. Firstly, the patent samples based on design methodology are retrieved and the indicators for evaluating technical value are summarized and the rationality of the evaluation indicators is verifier through empirical study based on improved evidence theory. Secondly, based on principal component analysis and factor analysis, a high-tech value patent evaluation and cultivation method is proposed. Finally, the proposed method is applied to identify the high-tech value patents in the cutting machine industry, and structural improvement is made based on this patent to demonstrate the cultivation process of high-tech value patents. The proposed method provides a clear guiding direction for the cultivation of high novelty patents and enterprise innovative product design. The method can effectively assist the product R&D activities of engineering designers and enhance the sustainable competitiveness of enterprises from a technological perspective.</div

Patent value evaluation system and indicator weight.

Patent value evaluation system and indicator weight.</p