CORE
🇺🇦Â
 make metadata, not war
Services
Services overview
Explore all CORE services
Access to raw data
API
Dataset
FastSync
Content discovery
Recommender
Discovery
OAI identifiers
OAI Resolver
Managing content
Dashboard
Bespoke contracts
Consultancy services
Support us
Support us
Membership
Sponsorship
Community governance
Advisory Board
Board of supporters
Research network
About
About us
Our mission
Team
Blog
FAQs
Contact us
Filters
3 research outputs found
Effect of SnO 2 reinforcement on creep property of Sn–Ag–Cu solders
Author
Chan
Ervina
+13Â more
Fakpan
Gain
Hidaka
Hwang
Ma
Roshanghias
Roshanghias
Sharma
Shen
Sujan
Tang
Tay
Yang
Publication venue
'Elsevier BV'
Publication date
01/01/2018
Field of study
No full text
Crossref
Creep-fatigue crack growth behavior of Pb-contained and Pb-free solders at room and elevated temperatures
Author
Dowling
K. Fakpan
+13Â more
K. Kodani
K. Nagata
Kariya
S. Inoue
Solomon
Xie
Y. Mutoh
Y. Otsuka
Yafuso
Yoda
Yu
Zhao
Zhao
Publication venue
'Elsevier BV'
Publication date
01/01/2011
Field of study
No full text
Crossref
A continuum damage mechanics-based unified creep and plasticity model for solder materials
Author
Abu Al-Rub
Bai
+56Â more
Bonora
Bonora
Burke
Busso
Chaboche
Chaboche
Coffin
Darveaux
Fakpan
Fine
Frost
Han
Heiduschke
Johnson
Kachanov
Ladani
Lee
Lee
Lemaitre
Lemaitre
Lemaitre
Leon M. Keer
Maciucescu
McClintock
McDowell
McDowell
Morris E. Fine
Pirondi
Prager
Rabotnov
Rice
Sandstroem
Solomon
Stolkarts
Subrahmanyan
Tan
Voyiadjis
Wang
Wang
Wei
Wei
Wen
Wen
Wen
Wen
Wen
Xiao
Xu He
Yang
Yao
Yao
Yao
Yao
Yao
Yao Yao
Zhang
Publication venue
'Elsevier BV'
Publication date
Field of study
No full text
Crossref