Quantum-Well Infrared Photodetector (QWIP) Focal Plane Assembly

A paper describes the Thermal Infrared Sensor (TIRS), a QWIP-based instrument intended to supplement the Operational Land Imager (OLI) for the Landsat Data Continuity Mission (LDCM). The TIRS instrument is a far-infrared imager operating in the pushbroom mode with two IR channels: 10.8 and 12 microns. The focal plane will contain three 640x512 QWIP arrays mounted on a silicon substrate. The silicon substrate is a custom-fabricated carrier board with a single layer of aluminum interconnects. The general fabrication process starts with a 4-in. (approx.10-cm) diameter silicon wafer. The wafer is oxidized, a single substrate contact is etched, and aluminum is deposited, patterned, and alloyed. This technology development is aimed at incorporating three large-format infrared detecting arrays based on GaAs QWIP technology onto a common focal plane with precision alignment of all three arrays. This focal plane must survive the rigors of flight qualification and operate at a temperature of 43 K (-230 C) for five years while orbiting the Earth. The challenges presented include ensuring thermal compatibility among all the components, designing and building a compact, somewhat modular system and ensuring alignment to very tight levels. The multi-array focal plane integrated onto a single silicon substrate is a new application of both QWIP array development and silicon wafer scale integration. The Invar-based assembly has been tested to ensure thermal reliability

Silicon Wafer-Scale Substrate for Microshutters and Detector Arrays

The silicon substrate carrier was created so that a large-area array (in this case 62,000+ elements of a microshutter array) and a variety of discrete passive and active devices could be mounted on a single board, similar to a printed circuit board. However, the density and number of interconnects far exceeds the capabilities of printed circuit board technology. To overcome this hurdle, a method was developed to fabricate this carrier out of silicon and implement silicon integrated circuit (IC) technology. This method achieves a large number of high-density metal interconnects; a 100-percent yield over a 6-in. (approximately equal to 15-cm) diameter wafer (one unit per wafer); a rigid, thermally compatible structure (all components and operating conditions) to cryogenic temperatures; re-workability and component replaceability, if required; and the ability to precisely cut large-area holes through the substrate. A method that would employ indium bump technology along with wafer-scale integration onto a silicon carrier was also developed. By establishing a silicon-based version of a printed circuit board, the objectives could be met with one solution. The silicon substrate would be 2 mm thick to survive the environmental loads of a launch. More than 2,300 metal traces and over 1,500 individual wire bonds are required. To mate the microshutter array to the silicon substrate, more than 10,000 indium bumps are required. A window was cut in the substrate to allow the light signal to pass through the substrate and reach the microshutter array. The substrate was also the receptacle for multiple unpackaged IC die wire-bonded directly to the substrate (thus conserving space over conventionally packaged die). Unique features of this technology include the implementation of a 2-mmthick silicon wafer to withstand extreme mechanical loads (from a rocket launch); integrated polysilicon resistor heaters directly on the substrate; the precise formation of an open aperture (approximately equal to 3x3cm) without any crack propagation; implementation of IR transmission blocking techniques; and compatibility with indium bump bonding. Although designed for the microshutter arrays for the NIRSpec instrument on the James Webb Space Telescope, these substrates can be linked to microshutter applications in the photomask generation and stepper equipment used to make ICs and microelectromechanical system (MEMS) devices

Performance of an X-Ray Microcalorimeter with a 240 Micron Absorber and a 50 Micron TES Bilayer

We have been developing superconducting transition-edge sensor (TES) microcalorimeters for a variety of potential astrophysics missions, including Athena. The X-ray Integral Field Unit (X-IFU) instrument on this mission requires close-packed pixels on a 0.25 mm pitch, and high quantum efficiency between 0.2 and 12 keV. The traditional approach within our group has been to use square TES bilayers on molybdenum and gold that are between 100 and 140 microns in size, deposited on silicon nitride membranes to provide a weak thermal conductance to a 50 mK heat bath temperature. It has been shown that normal metal stripes on top of the bilayer are needed to keep the unexplained noise at a level consistent with the expected based upon estimates for the non-equilibrium non-linear Johnson noise.In this work we describe a new approach in which we use a square TES bilayer that is 50 microns in size. While the weak link effect is much stronger in this size of TES, we have found that excellent spectral performance can be achieved without the need for any normal metal strips on top of the TES. A spectral performance of 1.58 eV at 6 KeV has been achieved, the best resolution seen in any of our devices with this pixel size. The absence of normal metal stripes has led to more uniform transition shapes, and more reliable excellent spectral performance. The smaller TES size has meant that that the thermal conductance to the heat bath, determined by the perimeter length of the TES and the membrane thickness, is lower than on previous devices, and thus has a lower count rate capability. This is an advantage for low count-rate applications where the slower speed enables easier multiplexing in the read-out, thus potential higher multiplexing factors. In order to recover the higher count rate capabilities, a potential path exits using thicker silicon nitride membranes to increase the thermal conductance to the heat bath

Fabrication of a Hybrid Transition Edge Sensor Array for Lynx

Lynx is a proposed NASA X-Ray telescope flight mission aimed at achieving state-of-the-art angular and energy resolution with a 100 kilopixel array to probe the hot energetic young universe in unprecedented detail. To achieve these goals, our team plans on leveraging our current work in development of the focal plane for the Athena X-Ray Integral Field Unit (X-IFU) while advancing the state-of-the-art in transition edge sensor (TES) X-ray detector technology. The TES is an optimal technology for achieving both high energy and fine angular resolution at the same time because pixel features can be made extremely small and the absorber which dominates the heat capacity can be tuned to meet resolution requirements. Specifically, the proposed mission concept calls for a hybrid detector of three different arrays fabricated in the same planar process in one focal plane and optimized for different science goals. The main arrays consist of 5x5 hydras, 25 pixels of 4 micron thick Au absorbers each with a different thermal link to one common TES. The outer array has absorbers on a 50-micron pitch for most of the 5 arc-minute field-of-view, and the inner array has 25-micron absorbers for the central 1 arc-minute region. A high resolution array consisting of single pixel 1 micron thick Au absorbers on 50-micron pitch will lie off to the side. Reading out an array of this magnitude will likely require improvements in indium bump bonding to superconducting flexible wiring. Fabrication of absorbers of two different sizes requires electroplating through a photoresist mold by careful tuning of the current density to achieve uniform flat absorbers on a fine pitch scale, followed by ion milling to yield narrow streets separating the pixels while preserving high quantum efficiency. We report on progress made at fabricating the hybrid array with different absorber sizes and thicknesses. Further, we also report on ongoing work to adequately heat sink the pixels with backside wire bonding and copper coating. We also report on work to improve detector pixel yield and top side indium bump bonding to flexible wiring

MEMS Microshutter Array System for James Webb Space Telescope

A complex MEMS microshutter array system has been developed at NASA Goddard Space Flight Center (GSFC) for use as a multi-object aperture array for a Near-Infrared Spectrometer (NIRSpec). The NIRSpec is one of the four major instruments carried by the James Webb Space Telescope (JWST), the next generation of space telescope after the Hubble Space Telescope retires. The microshutter arrays (MSAs) are designed for the selective transmission of light with high efficiency and high contrast. It is demonstrated in Figure 1 how a MSA is used as a multiple object selector in deep space. The MSAs empower the NIRSpec instrument simultaneously collect spectra from more than 100 targets therefore increases the instrument efficiency 100 times or more. The MSA assembly is one of three major innovations on JWST and the first major MEMS devices serving observation missions in space. The MSA system developed at NASA GSFC is assembled with four quadrant fully addressable 365x171 shutter arrays that are actuated magnetically, latched and addressed electrostatically. As shown in Figure 2, each MSA is fabricated out of a 4' silicon-on-insulator (SOI) wafer using MEMS bulk-micromachining technology. Individual shutters are close-packed silicon nitride membranes with a pixel size close to 100x200 pm (Figure 3). Shutters are patterned with a torsion flexure permitting shutters to open 90 degrees with a minimized mechanical stress concentration. In order to prevent light leak, light shields are made on to the surrounding frame of each shutter to cover the gaps between the shutters and the Game (Figure 4). Micro-ribs and sub-micron bumps are tailored on hack walls and light shields, respectively, to prevent sticktion, shown in Figures 4 and 5. JWST instruments are required to operate at cryogenic temperatures as low as 35K, though they are to be subjected to various levels of ground tests at room temperature. The shutters should therefore maintain nearly flat in the entire temperature range between 35K and 300K. Through intensive numerical simulations and experimental studies, an optically opaque and electrically conductive metal-nitride thin film was selected as a coating material deposited on the shutters with the best thermal-expansion match to silicon nitride - the shutter blade thin film material. A shutter image shown in Figure 6 was taken at room temperature, presenting shutters slightly bowing down as expected. Shutters become flat when the temperature decreases to 35K. The MSAs are then bonded to silicon substrates that are fabricated out of 6" single-silicon wafers in the thickness of 2mm. The bonding is conducted using a novel single-sided indium flip-chip bonding technology. Indium bumps fabricated on a substrate are shown in Figure 7. There are 180,000 indium bumps for bonding a flight format MSA array to its substrate. Besides a MSA, each substrate houses five customer-designed ASIC (Application Specific Integrated Circuit) multiplexer/address chips for 2-dimensional addressing, twenty capacitors, two temperature sensors, numbers of resistors and all necessary interconnects, as shown in Figure 8. Complete MSA quadrant assemblies have been successfully manufactured and fully functionally tested. The assemblies have passed a series of critical reviews required by JWST in satisfying all the design specifications. The qualification tests cover programmable 2-D addressing, life tests, optical contrast tests, and environmental tests including radiation, vibration, and acoustic tests. A 2-D addressing pattern with 'ESA' letters programmed in a MSA is shown in Figure 9. The MSAs passed 1 million cycle life tests and achieved high optical contrast over 10,000. MSA teams are now making progress in final fabrication, testing and assembly (Figure 10). The delivery of flight-format MSA system is scheduled at the end of 2008 for being integrated to the focal plane of the NIRSpec detectors

Fabrication of MEMS Microshutter Arrays for Cryogenic Applications

Two-dimensional MEMS microshutter arrays are being developed for use as a high contrast field selector for the Near Infrared Spectrograph (NIRSpec) on the James Webb Space Telescope (JWST). We present details of microshutter array fabrication and give results of work done to optimize the flatness of microshutter elements through film stress control for both room temperature and cryogenic (35K) operation

Performance of an X-ray Microcalorimeter with a 240 m Absorber and a 50 m TES Bilayer

Superconducting transition-edge sensor (TES) microcalorimeters are being developed for a variety of potential astrophysics missions, including Athena. The X-ray integral field unit instrument on this mission requires close-packed pixels on a 0.25 mm pitch, and high quantum efficiency between 0.2 and 12 keV. In this work, we describe a new approach with 50 m square TESs consisting of a Mo/Au bilayer, deposited on silicon nitride membranes to provide a weak thermal conductance to a ~50 mK heat bath. Larger TESs usually have additional normal metal stripes on top of the bilayer to reduce the noise. However, we have found that excellent spectral performance can be achieved without the need for any normal metal stripes on top of the TES. A spectral performance of 1.58+/-0.12 eV at 5.9 keV has been achieved, the best resolution seen in any of our devices with this pixel size

MEMS Microshutter Arrays for James Webb Space Telescope

MEMS microshutter arrays are being developed at NASA Goddard Space Flight Center for use as an aperture array for a Near-Infrared Spectrometer (NirSpec). The instruments will be carried on the James Webb Space Telescope (JWST), the next generation of space telescope after Hubble Space Telescope retires. The microshutter arrays are designed for the selective transmission of light with high efficiency and high contrast, Arrays are close-packed silicon nitride membranes with a pixel size of 100x200 microns. Individual shutters are patterned with a torsion flexure permitting shutters to open 90 degrees with a minimized mechanical stress concentration. Light shields are made on to each shutter for light leak prevention so to enhance optical contrast, Shutters are actuated magnetically, latched and addressed electrostatically. The shutter arrays are fabricated using MEMS technologies

Parametric Characterization of TES Detectors Under DC Bias

The X-ray integrated field unit (X-IFU) in European Space Agency's (ESA's) Athena mission will be the first high-resolution X-ray spectrometer in space using a large-format transition-edge sensor microcalorimeter array. Motivated by optimization of detector performance for X-IFU, we have conducted an extensive campaign of parametric characterization on transition-edge sensor (TES) detectors with nominal geometries and physical properties in order to establish sensitivity trends relative to magnetic field, dc bias on detectors, operating temperature, and to improve our understanding of detector behavior relative to its fundamental properties such as thermal conductivity, heat capacity, and transition temperature. These results were used for validation of a simple linear detector model in which a small perturbation can be introduced to one or multiple parameters to estimate the error budget for X-IFU. We will show here results of our parametric characterization of TES detectors and briefly discuss the comparison with the TES model

Reduced-Scale Transition-Edge Sensor Detectors for Solar and X-Ray Astrophysics

We have developed large-format, close-packed X-ray microcalorimeter arrays fabricated on solid substrates, designed to achieve high energy resolution with count rates up to a few hundred counts per second per pixel for X-ray photon energies upto 8 keV. Our most recent arrays feature 31-micron absorbers on a 35-micron pitch, reducing the size of pixels by about a factor of two. This change will enable an instrument with significantly higher angular resolution. In order to wire out large format arrays with an increased density of smaller pixels, we have reduced the lateral size of both the microstrip wiring and the Mo/Au transition-edge sensors (TES). We report on the key physical properties of these small TESs and the fine Nb leads attached, including the critical currents and weak-link properties associated with the longitudinal proximity effect