Fabrication of a Hybrid Transition Edge Sensor Array for Lynx

Abstract

Lynx is a proposed NASA X-Ray telescope flight mission aimed at achieving state-of-the-art angular and energy resolution with a 100 kilopixel array to probe the hot energetic young universe in unprecedented detail. To achieve these goals, our team plans on leveraging our current work in development of the focal plane for the Athena X-Ray Integral Field Unit (X-IFU) while advancing the state-of-the-art in transition edge sensor (TES) X-ray detector technology. The TES is an optimal technology for achieving both high energy and fine angular resolution at the same time because pixel features can be made extremely small and the absorber which dominates the heat capacity can be tuned to meet resolution requirements. Specifically, the proposed mission concept calls for a hybrid detector of three different arrays fabricated in the same planar process in one focal plane and optimized for different science goals. The main arrays consist of 5x5 hydras, 25 pixels of 4 micron thick Au absorbers each with a different thermal link to one common TES. The outer array has absorbers on a 50-micron pitch for most of the 5 arc-minute field-of-view, and the inner array has 25-micron absorbers for the central 1 arc-minute region. A high resolution array consisting of single pixel 1 micron thick Au absorbers on 50-micron pitch will lie off to the side. Reading out an array of this magnitude will likely require improvements in indium bump bonding to superconducting flexible wiring. Fabrication of absorbers of two different sizes requires electroplating through a photoresist mold by careful tuning of the current density to achieve uniform flat absorbers on a fine pitch scale, followed by ion milling to yield narrow streets separating the pixels while preserving high quantum efficiency. We report on progress made at fabricating the hybrid array with different absorber sizes and thicknesses. Further, we also report on ongoing work to adequately heat sink the pixels with backside wire bonding and copper coating. We also report on work to improve detector pixel yield and top side indium bump bonding to flexible wiring