Cost-effective telecom/datacom semiconductor lasers

The recent development of semiconductor laser technologies for cost-effective telecom/datacom applications is reviewed in details in this paper. This includes the laser design, laser chip technology, laser packaging technology and other low cost lasers (chip + packaging). Some design and simulation examples in Archcom laser production are described first. A latest trend in the wafer scale testing/characterization/screening technology for low cost semiconductor laser mass production is discussed then. An advanced long wavelength high power single mode surface emitting laser with wafer scale characterization using our unique mask free focused ion beam (FIB) etching technology is also demonstrated. Detailed descriptions on our wide temperature range (-50 °C to +105 °C) G-PON distributed feedback (DFB) semiconductor lasers with high performance and low cost wafer design are included. Cost reduction innovations in laser package with our beam profile improved laser and optical feedback insensitive (OFBI) laser are also addressed

Cost-effective telecom/datacom semiconductor lasers

The recent development of semiconductor laser technologies for cost-effective telecom/datacom applications is reviewed in details in this paper. This includes the laser design, laser chip technology, laser packaging technology and other low cost lasers (chip + packaging). Some design and simulation examples in Archcom laser production are described first. A latest trend in the wafer scale testing/characterization/screening technology for low cost semiconductor laser mass production is discussed then. An advanced long wavelength high power single mode surface emitting laser with wafer scale characterization using our unique mask free focused ion beam (FIB) etching technology is also demonstrated. Detailed descriptions on our wide temperature range (-50 °C to +105 °C) G-PON distributed feedback (DFB) semiconductor lasers with high performance and low cost wafer design are included. Cost reduction innovations in laser package with our beam profile improved laser and optical feedback insensitive (OFBI) laser are also addressed

Optimized Biasing of Pump Laser Diodes in a Highly Reliable Metrology Source for Long-Duration Space Missions

Non Planar Ring Oscillator (NPRO) lasers are highly attractive for metrology applications. NPRO reliability for prolonged space missions is limited by reliability of 808 nm pump diodes. Combined laser farm aging parameter allows comparing different bias approaches. Monte-Carlo software developed to calculate the reliability of laser pump architecture, perform parameter sensitivity studies To meet stringent Space Interferometry Mission (SIM) Lite lifetime reliability / output power requirements, we developed a single-mode Laser Pump Module architecture that: (1) provides 2 W of power at 808 nm with >99.7% reliability for 5.5 years (2) consists of 37 de-rated diode lasers operating at -5C, with outputs combined in a very low loss 37x1 all-fiber couple

Micro-Pixel Image Position Sensing Testbed

The search for Earth-mass planets in the habitable zones of nearby Sun-like stars is an important goal of astrophysics. This search is not feasible with the current slate of astronomical instruments. We propose a new concept for microarcsecond astrometry which uses a simplified instrument and hence promises to be low cost. The concept employs a telescope with only a primary, laser metrology applied to the focal plane array, and new algorithms for measuring image position and displacement on the focal plane. The required level of accuracy in both the metrology and image position sensing is at a few micro-pixels. We have begun a detailed investigation of the feasibility of our approach using simulations and a micro-pixel image position sensing testbed called MCT. So far we have been able to demonstrate that the pixel-to-pixel distances in a focal plane can be measured with a precision of 20 micro-pixels and image-to-image distances with a precision of 30 micro-pixels. We have also shown using simulations that our image position algorithm can achieve accuracy of 4 micro-pixels in the presence of lambda/20 wavefront errors