Nickel Silicide Formation Using Excimer Laser Annealing

AbstractIn this work, we report on a self-aligned nickel silicide formation technique based on excimer laser annealing (ELA). We evaluate this process for the front contact formation of industrial PERC type solar cells on random pyramid textured Si surfaces where damage to surface texture, emitter passivation, or to the shallow junction should be avoided or minimized. PERC type solar cells obtained by POCl3 diffusion were processed on large area (12.5x12.5cm2) CZ-Si. Self-aligned litho-free Ni/Cu contacts defined by ps-laser ablation of the SiO2/SiNx anti-reflective coating (ARC) and subsequent ELA of the Ni layer were compared to conventional Ag screen printed contacts.The novel ELA process results in an absolute gain in Jsc of 0.8mA/cm2 as well as a drop of 0.3Ω.cm2 in series resistance (Rs) compared to SP Ag contacts due to reduced shading and resistance losses. This leads to 0.5% absolute increase in efficiency from 19.3% to 19.7% since other characteristics (Voc, pFF) could be maintained to the same level. In this work, the best performing cell with the ELA process reached an outstanding 20.0% energy conversion efficiency with Jsc=39.3mA/cm2, Voc=649.8mV, and FF=78.3%

Long pulse excimer laser crystallization of thin film silicon on metallic substrate

International audienc

Evolution in morphological, optical, and electronic properties of ZnO:Al thin films undergoing a laser annealing and etching process

International audienc

Excimer laser crystallization of amorphous silicon on metallic substrate

An attempt has been made to achieve the crystallization of silicon thin film on metallic foils by long pulse duration excimer laser processing. Amorphous silicon thin films (100 nm) were deposited by radiofrequency magnetron sputtering on a commercial metallic alloy (N42-FeNi made of 41 % of Ni) coated by a tantalum nitride (TaN) layer. The TaN coating acts as a barrier layer, preventing the diffusion of metallic impurities in the silicon thin film during the laser annealing. An energy density threshold of 0.3 J cm-2, necessary for surface melting and crystallization of the amorphous silicon, was predicted by a numerical simulation of laser-induced phase transitions and witnessed by Raman analysis. Beyond this fluence, the melt depth increases with the intensification of energy density. A complete crystallization of the layer is achieved for an energy density of 0.9 J cm-2. Scanning electron microscopy unveils the nanostructuring of the silicon after laser irradiation, while cross-sectional transmission electron microscopy reveals the crystallites' columnar growth. © 2013 Springer-Verlag Berlin Heidelberg