53 research outputs found

    Planar fiber-chip-coupling using angle-polished polarization maintaining fibers

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    We report on our latest developments of a planar fiber-chip-coupling scheme, using angle polished, polarization maintaining (PM) fibers. Most integrated photonic chip components are polarization sensitive and a suitable way to launch several wavelength channels with the same polarization to the chip is the use of PM fibers. Those impose several challenges at processing and handling to achieve a stable, permanent, and low-loss coupling. We present the processing of the fibers in detail and experimental results for our planar and compact fiber-chip-coupling technique

    Planar fiber-chip-coupling using angle-polished polarization maintaining fibers

    Get PDF
    We report on our latest developments of a planar fiber-chip-coupling scheme, using angle polished, polarization maintaining (PM) fibers. Most integrated photonic chip components are polarization sensitive and a suitable way to launch several wavelength channels with the same polarization to the chip is the use of PM fibers. Those impose several challenges at processing and handling to achieve a stable, permanent, and low-loss coupling. We present the processing of the fibers in detail and experimental results for our planar and compact fiber-chip-coupling technique

    First 10Gb/s Transmission with radiation-hardened Silicon Photonic Mach-Zehnder Modulators in a Full Transmission System

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    We present standard and radiation-hardened pn depletion-type Mach-Zehnder modulators (MZM) to be used in high-bandwidth, fully-integrated wavelength division multiplexing (WDM) transmitter designs, aiming to upgrade the optical data transmission of future detector systems. A detailed characterization of the modulators with respect to modulation efficiency and RF response was carried out. Based on this work, a first optical link with a data rate of 11.3 Gb/s was set up

    Building blocks of a scalable and radiation-hardened integrated transmitter unit based on 250 nm SOI

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    Building blocks of a scalable and radiation-hardened integrated transmitter unit based on 250 nm SOI

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    Multimode interferometers for integrated transceivers on 250 nm SOI platform

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    Key building block optimization for high-performance transceivers: Multimode interferometers from conventional to sub-wavelength regime

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    Multimode interferometers (MMIs) are key components for high-bandwidth transceivers in upgrading the data transmission of future detector systems. We present two conventional highperformance MMIs fabricated on a 250 nm SOI platform with different power splitting ratios which operate as 50%:50% power splitter for Mach-Zehnder modulators and as 86%:14% power splitter for loop control in future transceiver designs, respectively. Besides, we present the novel MMIs based on sub-wavelength gratings. By engineering the refractive index of relevant parts, more compact 50%:50% MMIs and multi-port, low phase error MMIs become feasible
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