Thermoresistance of p-Type 4H–SiC Integrated MEMS Devices for High-Temperature Sensing

There is an increasing demand for the development and integration of multifunctional sensing modules into power electronic devices that can operate in high temperature environments. Here, the authors demonstrate the tunable thermoresistance of p‐type 4H–SiC for a wide temperature range from the room temperature to above 800 K with integrated flow sensing functionality into a single power electronic chip. The electrical resistance of p‐type 4H–SiC is found to exponentially decrease with increasing temperature to a threshold temperature of 536 K. The temperature coefficient of resistance (TCR) shows a large and negative value from −2100 to −7600 ppm K−1, corresponding to a thermal index of 625 K. From the threshold temperature of 536–846 K, the electrical resistance shows excellent linearity with a positive TCR value of 900 ppm K−1. The authors successfully demonstrate the integration of p–4H–SiC flow sensing functionality with a high sensitivity of 1.035 μA(m s−1)−0.5 mW−1. These insights in the electrical transport of p–4H–SiC aid to improve the performance of p–4H–SiC integrated temperature and flow sensing systems, as well as the design consideration and integration of thermal sensors into 4H–SiC power electronic systems operating at high temperatures of up to 846 K

Speedup of Interval Type 2 Fuzzy Logic Systems Based on GPU for Robot Navigation

As the number of rules and sample rate for type 2 fuzzy logic systems (T2FLSs) increases, the speed of calculations becomes a problem. The T2FLS has a large membership value of inherent algorithmic parallelism that modern CPU architectures do not exploit. In the T2FLS, many rules and algorithms can be speedup on a graphics processing unit (GPU) as long as the majority of computation a various stages and components are not dependent on each other. This paper demonstrates how to install interval type 2 fuzzy logic systems (IT2-FLSs) on the GPU and experiments for obstacle avoidance behavior of robot navigation. GPU-based calculations are high-performance solution and free up the CPU. The experimental results show that the performance of the GPU is many times faster than CPU

A hot-film air flow sensor for elevated temperatures

We report a novel packaging and experimental technique for characterizing thermal flow sensors at high temperatures. This paper first reports the fabrication of 3C-SiC (silicon carbide) on a glass substrate via anodic bonding, followed by the investigation of thermoresistive and Joule heating effects in the 3C-SiC nano-thin film heater. The high thermal coefficient of resistance of approximately −20 720 ppm/K at ambient temperature and −9287 ppm/K at 200 °C suggests the potential use of silicon carbide for thermal sensing applications in harsh environments. During the Joule heating test, a high-temperature epoxy and a brass metal sheet were utilized to establish the electric conduction between the metal electrodes and SiC heater inside a temperature oven. In addition, the metal wires from the sensor to the external circuitry were protected by a fiberglass insulating sheath to avoid short circuit. The Joule heating test ensured the stability of mechanical and Ohmic contacts at elevated temperatures. Using a hot-wire anemometer as a reference flow sensor, calibration tests were performed at 25 °C, 35 °C, and 45 °C. Then, the SiC hot-film sensor was characterized for a range of low air flow velocity, indicating a sensitivity of 5 mm−1 s. The air flow was established by driving a metal propeller connected to a DC motor and controlled by a microcontroller. The materials, metallization, and interconnects used in our flow sensor were robust and survived temperatures of around 200 °

A rapid and cost-effective metallization technique for 3C-SiC MEMS using direct wire bonding

This paper presents a simple, rapid and cost-effective wire bonding technique for single crystalline silicon carbide (3C–SiC) MEMS devices. Utilizing direct ultrasonic wedge–wedge bonding, we have demonstrated for the first time the direct bonding of aluminum wires onto SiC films for the characterization of electronic devices without the requirement for any metal deposition and etching process. The bonded joints between the Al wires and the SiC surfaces showed a relatively strong adhesion force up to approximately 12.6–14.5 mN and excellent ohmic contact. The bonded wire can withstand high temperatures above 420 K, while maintaining a notable ohmic contact. As a proof of concept, a 3C–SiC strain sensor was demonstrated, where the sensing element was developed based on the piezoresistive effect in SiC and the electrical contact was formed by the proposed direct-bonding technique. The SiC strain sensor possesses high sensitivity to the applied mechanical strains, as well as exceptional repeatability. The work reported here indicates the potential of an extremely simple direct wire bonding method for SiC for MEMS and microelectronic applications

Nano strain-amplifier: making ultra-sensitive piezoresistance in nanowires possible without the need of quantum and surface charge effects

This paper presents an innovative nano strain-amplifier employed to significantly enhance the sensitivity of piezoresistive strain sensors. Inspired from the dogbone structure, the nano strain-amplifier consists of a nano thin frame released from the substrate, where nanowires were formed at the centre of the frame. Analytical and numerical results indicated that a nano strain-amplifier significantly increases the strain induced into a free standing nanowire, resulting in a large change in their electrical conductance. The proposed structure was demonstrated in p-type cubic silicon carbide nanowires fabricated using a top down process. The experimental data showed that the nano strain-amplifier can enhance the sensitivity of SiC strain sensors at least 5.4 times larger than that of the conventional structures. This result indicates the potential of the proposed strain-amplifier for ultra-sensitive mechanical sensing applications.Comment: 4 pages, 5 figure

Speedup of Interval Type 2 Fuzzy Logic Systems Based on GPU for Robot Navigation

As the number of rules and sample rate for type 2 fuzzy logic systems (T2FLSs) increases, the speed of calculations becomes a problem. The T2FLS has a large membership value of inherent algorithmic parallelism that modern CPU architectures do not exploit. In the T2FLS, many rules and algorithms can be speedup on a graphics processing unit (GPU) as long as the majority of computation a various stages and components are not dependent on each other. This paper demonstrates how to install interval type 2 fuzzy logic systems (IT2-FLSs) on the GPU and experiments for obstacle avoidance behavior of robot navigation. GPUbased calculations are high-performance solution and free up the CPU. The experimental results show that the performance of the GPU is many times faster than CPU