A drugs marketing company salary system design

内容摘要薪酬制度是企业人力资源管理的核心。它体现了企业人力资源价值的分配和人力资源管理理念。企业在设计新酬制度的过程中，必须在其经营战略的框架下，通过对其薪酬组成元素的优化配置，以整体薪酬制度的形式来发挥薪酬效能，以支持企业战略目标的实现和满足员工多元化的需求。企业营销人员薪酬制度问题，是营销管理中的一个重要课题，建立一套科学、有效的销售人员薪酬制度并非易事。世界上没有通用、固定不变的某种销售薪酬制度，它将随企业营销战略、模式、渠道，所提供的产品或服务性质，细分客户群和客户类型等的不同而存在差异。可以说，不同类型的销售人员、不同类型的企业、不同类型的市场，就有不同类型的薪酬制度。本文从薪酬的基...ABSTRACT Salary system is the core of human resource management for enterprise. It expresses the enterprise’s value distribution and management idea of human resource. When an enterprise initiates its salary system, it is very important for them to optimize the allocation of salary elements based on the enterprise’s operation strategy so as to maximize the efficiency of salary system by way ...学位：工商管理硕士院系专业：管理学院高级经理教育中心（EMBA项目）_管理经济学学号：X20031503

The ABC130 barrel module prototyping programme for the ATLAS strip tracker

For the Phase-II Upgrade of the ATLAS Detector, its Inner Detector, consisting of silicon pixel, silicon strip and transition radiation sub-detectors, will be replaced with an all new 100 % silicon tracker, composed of a pixel tracker at inner radii and a strip tracker at outer radii. The future ATLAS strip tracker will include 11,000 silicon sensor modules in the central region (barrel) and 7,000 modules in the forward region (end-caps), which are foreseen to be constructed over a period of 3.5 years. The construction of each module consists of a series of assembly and quality control steps, which were engineered to be identical for all production sites. In order to develop the tooling and procedures for assembly and testing of these modules, two series of major prototyping programs were conducted: an early program using readout chips designed using a 250 nm fabrication process (ABCN-25) and a subsequent program using a follow-up chip set made using 130 nm processing (ABC130 and HCC130 chips). This second generation of readout chips was used for an extensive prototyping program that produced around 100 barrel-type modules and contributed significantly to the development of the final module layout. This paper gives an overview of the components used in ABC130 barrel modules, their assembly procedure and findings resulting from their tests.Comment: 82 pages, 66 figure

Verification of simulated ASIC functionality and radiation tolerance for the HL-LHC ATLAS ITk Strip Detector

ASICs are important components in many HEP detectors and their functional simulation ensures successful operation while minimizing the number of long production cycles. Three radiation-tolerant ASICs (HCC, AMAC, and ABC) will perform the front-end readout, monitoring, and control of the outer layers of the ITk Strip particle tracker for the HL-LHC ATLAS detector. Simulated verification with the Python-based cocotb framework allows for sophisticated tests with major contributions from students and firmware non-experts. The verification program includes interactions between multiple ASICs, realistic HL-LHC data flows, operational stress tests, and a focus on mitigation of disruptive Single Event Effects due to radiation

Testing of the HCC and AMAC functionality and radiation tolerance for the HL-LHC ATLAS ITk Strip Detector

The ITk Strip is a new silicon-strip charged-particle detector for the HL-LHC ATLAS experiment. The HCC and AMAC chip are radiation-tolerant ASICs that contribute to the front-end readout, monitoring and control of the ITk Strip. Comprehensive functionality tests have been performed on HCC and AMAC to guarantee their reliability throughout the HL-LHC lifetime. In addition, to ensure the operation of the HCC and AMAC under a radiation heavy environment, gamma, heavy ions, proton and x-ray irradiation campaigns were conducted. HCC and AMAC successfully operated at extreme conditions and were reliable at the expected HL-LHC conditions

Pre-Production Testing of the HCCStar at Penn for the ATLAS ITk Detector

The high-luminosity LHC requires a complete overhaul of the ATLAS inner tracker subsystem, including a new silicon-strip charged-particle tracking detector. The HCCStar (Hybrid Controller Chip) is one of three new radiation-tolerant ASICs for this subsystem. As the interface to multiple binary readout ASICs for the strip detector, the HCCStar buffers and forwards controls signals and trigger and readout requests to them, and serializes their output at 640 MHz. All HCCStars undergo a suite of tests to verify their analog and digital functionality, and large statistics of performance with various operational parameters are collected

Quality Control Testing of the HCC ASIC for the HL-LHC ATLAS ITk Strip Detector

The high-luminosity upgrade to the LHC requires a new silicon-strip charged-particle tracking detector for ATLAS. The HCC (Hybrid Controller Chip) is one of three new radiation-tolerant ASICs for this subsystem. As the interface to multiple binary readout ASICs for the strip detector, the HCC buffers and forwards control signals and trigger and readout requests to them, and serializes their output at 640 MHz. All HCCs undergo a suite of tests to verify their analog and digital functionality, and large statistics of performance with various operational parameters are collected. Yields of HCC ASICs exceed the 90\% required for production

Real time tracker based upon local hit correlation circuit for silicon strip sensors

For the planned high luminosity upgrade of the Large Hadron Collider (LHC), a significant performance improvement of the detectors is required, including new tracker and trigger systems that makes use of charged track information early on. In this note we explore the principle of real time track reconstruction integrated in the readout electronics. A prototype was built using the silicon strip sensor for the ATLAS phase-II upgrade. The real time tracker is not the baseline for ATLAS but is nevertheless of interest, as the upgraded trigger design has not yet been finalized. For this, a new readout scheme in parallel with conventional readout, called the Fast Cluster Finder (FCF), was included in the latest prototype of the ATLAS strip detector readout chip (ABC130). The FCF is capable of finding hits within 6 ns and transmitting the found hit information synchronously every 25 ns. Using the FCF together with external correlation logic makes it possible to look for pairs of hits consistent with tracks from the interaction point above a transverse momentum threshold. A correlator logic finds correlations between two closely spaced parallel sensors, a “doublet”, and can generate information used as input to a lowest level trigger decision. Such a correlator logic was developed as part of a demonstrator and was successfully tested in an electron beam. The results of this test beam experiment proved the concept of the real time track vector processor with FCF

Irradiation testing of ASICs for the ATLAS HL-LHC upgrade

For the high-luminosity upgrade to the LHC, the ATLAS Inner Detector will be replaced by an all-silicon tracker (ITk) consisting of two systems: pixels and strips. HCC and AMAC are ITk Strip ASICs vital for performing the system readout, monitoring, and control. To ensure these ASICs will successfully operate in the high-radiation environment of the HL-LHC, they need to be tested for radiation tolerance, and tests have been performed using both heavy ions and protons. The ASIC designs were shown to protect against radiation related effects

The ABC130 barrel module prototyping programme for the ATLAS strip tracker

For the Phase-II Upgrade of the ATLAS Detector [1], its Inner Detector, consisting of silicon pixel, silicon strip and transition radiation sub-detectors, will be replaced with an all new 100% silicon tracker, composed of a pixel tracker at inner radii and a strip tracker at outer radii. The future ATLAS strip tracker will include 11,000 silicon sensor modules in the central region (barrel) and 7,000 modules in the forward region (end-caps), which are foreseen to be constructed over a period of 3.5 years. The construction of each module consists of a series of assembly and quality control steps, which were engineered to be identical for all production sites. In order to develop the tooling and procedures for assembly and testing of these modules, two series of major prototyping programs were conducted: an early program using readout chips designed using a 250 nm fabrication process (ABCN-250) [2,2] and a subsequent program using a follow-up chip set made using 130 nm processing (ABC130 and HCC130 chips). This second generation of readout chips was used for an extensive prototyping program that produced around 100 barrel-type modules and contributed significantly to the development of the final module layout. This paper gives an overview of the components used in ABC130 barrel modules, their assembly procedure and findings resulting from their tests