Thermokinetic analysis of intermetallic growth in copper clad aluminium wires

International audienceTo increase the ductility of bimetallic wires after deep drawing process, annealing is generally performed, leading to the diffusion between both metals. This paper focuses on the microstructural and thermokinetic properties of copper clad aluminium wires in order to optimise their process and properties. Solid state diffusion reaction was carried out in the temperature range of 573–673 K and time range of 2–48 h. Intermetallic microstructures were analysed thanks to focused ion beam, electron backscattered diffraction and energy dispersive spectroscopy techniques and compared to previous results obtained by friction welding process. Al2Cu, AlCu and Al4Cu9 phases were formed near the Cu/Al interface after heat treatment. The growth kinetic of these intermetallics can be followed by volume diffusion process. To predict the formation of first intermetallic phase, the effective heat of formation model was used and predicts the growth of Al2Cu and AlCu as first compounds

Thermokinetic analysis of intermetallic growth in copper clad aluminium wires

International audienceTo increase the ductility of bimetallic wires after deep drawing process, annealing is generally performed, leading to the diffusion between both metals. This paper focuses on the microstructural and thermokinetic properties of copper clad aluminium wires in order to optimise their process and properties. Solid state diffusion reaction was carried out in the temperature range of 573–673 K and time range of 2–48 h. Intermetallic microstructures were analysed thanks to focused ion beam, electron backscattered diffraction and energy dispersive spectroscopy techniques and compared to previous results obtained by friction welding process. Al2Cu, AlCu and Al4Cu9 phases were formed near the Cu/Al interface after heat treatment. The growth kinetic of these intermetallics can be followed by volume diffusion process. To predict the formation of first intermetallic phase, the effective heat of formation model was used and predicts the growth of Al2Cu and AlCu as first compounds

Structural Investigation of P4W24O80: A New Monophosphate Tungsten Bronze

International audienc

(PO2)4(WO3)14Single Crystals of the MPTBpFamily: A HREM Study

International audienc

(PO2)4(WO3)14Single Crystals of the MPTBpFamily: A HREM Study

International audienc

Thermokinetic analysis of intermetallic growth in copper clad aluminium wires

International audienceTo increase the ductility of bimetallic wires after deep drawing process, annealing is generally performed, leading to the diffusion between both metals. This paper focuses on the microstructural and thermokinetic properties of copper clad aluminium wires in order to optimise their process and properties. Solid state diffusion reaction was carried out in the temperature range of 573–673 K and time range of 2–48 h. Intermetallic microstructures were analysed thanks to focused ion beam, electron backscattered diffraction and energy dispersive spectroscopy techniques and compared to previous results obtained by friction welding process. Al2Cu, AlCu and Al4Cu9 phases were formed near the Cu/Al interface after heat treatment. The growth kinetic of these intermetallics can be followed by volume diffusion process. To predict the formation of first intermetallic phase, the effective heat of formation model was used and predicts the growth of Al2Cu and AlCu as first compounds

Structural Investigation of P4W24O80: A New Monophosphate Tungsten Bronze

International audienc

Characterization of New Lead-Based Monophosphate Tungsten Bronzes, Pbx(PO2)4(WO3)2m(6≤m≤10)

International audienc

Structural Study of P4W14O50, a New Odd Member in the Series (PO2)4(WO3)2m

International audienc