Fabrication and testing of microfluidic devices for blood cell separation

This paper was presented at the 2nd Micro and Nano Flows Conference (MNF2009), which was held at Brunel University, West London, UK. The conference was organised by Brunel University and supported by the Institution of Mechanical Engineers, IPEM, the Italian Union of Thermofluid dynamics, the Process Intensification Network, HEXAG - the Heat Exchange Action Group and the Institute of Mathematics and its Applications.Blood separation is a strategic preliminary step in preparation to on-chip biological analysis. Two microfluidic devices for on-chip blood separation are presented. Both devices will be integrated to form the separation module of a Lab on Chip for non-invasive prenatal diagnosis. In the first device, a blood plasma separator, the separation of blood cells from plasma is made possible in microchannels by bio-physical effects such as an axial migration effect and Zweifach-Fung bifurcation law. Behaviour of mussel and human blood suspensions were studied alongside the effect of different geometries. The second device aims to separate fetal nucleated red blood cells based on their magnetic susceptibility. Biocompatible materials are used in the manufacturing of both devices.The authors acknowledge the financial support of the Engineering and Physical Science Research Council (EPSRC) through the funding of the Grand Challenge Project ‘3DMintegration’, reference EP/C534212/1. This work has also been supported by the EPSRC through a Doctoral Training Account (DTA) and has been performed at the Microsystems Engineering Centre (MISEC), Heriot-Watt University, Edinburgh. We thank Tim Ryan and Phil Summersgill, Epigem Ltd. for the fabrication of the blood plasma chips. The fabrication work was carried out in the Fluence Microfluidics Application Centre supported by the DTI and the OneNE Regional Development Agency as part of the UK's MNT Network

Direct metallisation of polyetherimide substrates by activation with different metals

This article reports the performance of different metallic ions and nanoparticles (Ag, Cu, Ni, Pd, Cr, Co, Au and Fe) used as seed layers, formed by chemical or optical reduction, for the electroless Cu plating of metal tracks onto polyetherimide (PEI). Plated Cu performance was tested by adhesion, electrical conductivity, plating rate, XPS, SEM, XRD and EDX analysis. The application of Cu and Ag seeds resulted in high quality electroless Cu deposits presenting strong adhesion properties and high conductivity ((2.0 ± 0.5) × 107 S/m and (3.6 ± 0.2) × 107 S/m, respectively) compared with bulk copper (5.96 × 107 S/m). Performance is attributed to the high surface density and uniformity of seed layers. Of the metals, only Ag ions were photoreduced under the conditions applied and were subsequently used to electroless Cu plate high quality track features of 150 μm width. The application of sulphuric acid pre-treatment to PEI prior to Ag ion exchange, improved the photoinitiated track formation process, as demonstrated by a threefold increase to both photoinduced Ag nanoparticle density on the surface and electroless Cu plating rate, as well as improved electroless Cu adhesion to PEI

A Rapid Photopatterning Method for Selective Plating of 2D and 3D Microcircuitry on Polyetherimide

In this work, a method for the rapid synthesis of metallic microtracks on polyetherimide is presented. The method relies on the photosynthesis of silver nanoparticles on the surface of the polymer substrates from photosensitive silver chloride (AgCl), which is synthesized directly on the polyetherimide surface. The study reveals that the use of AgCl as a photosensitive intermediate accelerates the reactions leading to the formation of silver nanoparticles by up to two orders of magnitude faster than other photodecomposition schemes. The patterning can be conducted under blue light, with notable advantages over UV exposure. Polymers of significant interest to the microelectronics and 3D printing industries can be directly patterned by light using this photography‐inspired technique at throughputs high enough to be commercially advantageous. Light exposures as short as a few seconds are sufficient to allow the direct metallization of the illuminated polyetherimide surface. The results show that the silver required for the seed layer is minimal, and the later copper electroless plating results in the selective growth of conductive tracks for circuitry on the light‐patterned areas, both on flexible films and 3D printed surfaces

A rapid technique for the direct metallization of PDMS substrates for flexible and stretchable electronics applications

Metallization of a polydimethylsiloxane (PDMS)-based substrate is a challenge due to the difficulties in forming crack-free polymer and metal features using standard deposition techniques. Frequently, additional adhesion layers, rigid substrates, multiple processing steps (lift-off and etching) and expensive metal sputtering techniques are required, to achieve such metal patterns. This work presents a novel and rapid technique for the direct metallization of PDMS substrates using photolithography and electroless copper plating. The method has the advantage of not requiring expensive vacuum processing or multiple metallization steps. Electroless copper layer is demonstrated to have a strong adhesion to PDMS substrate with a high conductivity of (3.6 ± 0.7) × 107 S/m, which is close to the bulk copper (5.9 × 107 S/m). The copper-plated PDMS substrate displays mechanical and electrical stability whilst undergoing stretching deformations up to 10% due to applied strain. A functional electronic circuit was fabricated as a demonstration of the mechanical integrity of the copper-plated PDMS after bending

Particle separation in surface acoustic wave microfluidic devices using reprogrammable, pseudo-standing waves

We report size and density/compressibility-based particle sorting using on-off quasi-standing waves based on the frequency difference between two ultrasonic transducers. The 13.3 MHz fundamental operating frequency of the surface acoustic wave microfluidic device allows the manipulation of particles on the micrometer scale. Experiments, validated by computational fluid dynamics, were carried out to demonstrate size-based sorting of 5–14.5 lm diameter polystyrene (PS) particles and density/compressibility-based sorting of 10 lm PS, iron-oxide, and poly(methyl methacrylate) particles, with densities ranging from 1.05 to 1.5 g/cm3 . The method shows a sorting efficiency of >90% and a purity of >80% for particle separation of 10 lm and 14.5 lm, demonstrating better performance than similar sorting methods recently published (72%–83% efficiency). The sorting technique demonstrates high selectivity separation of particles, with the smallest particle ratio being 1.33, compared to 2.5 in previous work. Density/compressibility-based sorting of polystyrene and iron-oxide particles showed an efficiency of 97 6 4% and a purity of 91 6 5%. By varying the sign of the acoustic excitation signal, continuous batch acoustic sorting of target particles to a desired outlet was demonstrated with good sorting stability against variations of the inflow rate

In-Vivo Evaluation of Microultrasound and Thermometric Capsule Endoscopes

Clinical endoscopy and colonoscopy are commonly used to investigate and diagnose disorders in the upper gastrointestinal tract and colon respectively. However, examination of the anatomically remote small bowel with conventional endoscopy is challenging. This and advances in miniaturization led to the development of video capsule endoscopy (VCE) to allow small bowel examination in a non-invasive manner. Available since 2001, current capsule endoscopes are limited to viewing the mucosal surface only due to their reliance on optical imaging. To overcome this limitation with submucosal imaging, work is under way to implement microultrasound (μUS) imaging in the same form as VCE devices. This paper describes two prototype capsules, termed Sonocap and Thermocap, which were developed respectively to assess the quality of μUS imaging and the maximum power consumption that can be tolerated for such a system. The capsules were tested in vivo in the oesophagus and small bowel of porcine models. Results are presented in the form of μUS B-scans and safe temperature readings observed up to 100 mW in both biological regions. These results demonstrate that acoustic coupling and μUS imaging can be achieved in vivo in the lumen of the bowel and the maximum power consumption that is possible for miniature μUS systems

Selective Electroless Copper Deposition by Using Photolithographic Polymer/Ag Nanocomposite

This paper presents a novel, direct, selective, vacuum-free, and low-cost method of electroless copper deposition, allowing additive patterning of nonconductive surfaces. Ag nanoparticles (NPs) synthesized inside a photosensitive polymer are acting as seeds for electroless copper deposition. The resulting copper film surface morphology was studied with scanning electron microscopy. Copper films were shown to display a rough grain like structure, covering substrate uniformly with good metal-substrate adhesion. Copper thickness was studied as a function of the plating time, temperature, and Ag NPs seed concentration. A maximal copper thickness of 0.44 ± 0.05 μm was achieved when plated at 30 °C with 0.4 M Ag(I). The minimum feature resolution of copper patterns, grown with 0.025- and 0.1-M silver salt, is attained down to 10 μm. The maximum electrical conductivity of the copper film prepared with 0.025-, 0.1-, and 0.4-M Ag(I) approaches (0.8 ± 0.1) × 10⁷ S/m, (1.1 ± 0.1) ×10⁷ S/m and (1.6 ± 0.4)×10⁷ S/m, respectively. Electroless copper interconnections and LED circuit on glass substrate were fabricated as a proof of concept demonstrators

Hybrid Additive Manufacture of Conformal Antennas

This paper presents a new digitally driven manufacturing process chain for the production of high performance, three-dimensional RF devices. This is achieved by combining Fused Filament Fabrication of polyetherimide based polymer with selective light-based synthesis of silver nanoparticles and electrochemical deposition of copper. The resultant manufacturing method produces devices with excellent DC electrical resistivity (6.68 μΩ cm) and dielectric properties (relative permittivity of 2.67 and loss tangent of 0.001). Chemically modifying and patterning the substrate to produce the metallization overcomes many of the limitations of direct write deposition methods resulting in improved performance, adhesion and resolution of the antenna pattern. The fabricated demonstrators cover a broadband range of 0.1 GHz - 10 GHz and the measured results show a direct agreement with the simulated design over a wide frequency band. Overall the materials used as a substrate have a low relative permittivity and lower dielectric loss than FR-4, thereby making them well suited for antenna applications